JPWO2006134901A1 - Coaxial cable unit, device interface device, and electronic component testing device - Google Patents

Abstract

The coaxial cable unit (40a) for transmitting signals includes two coaxial cables (41) having a ground layer (413) and a signal line (411) surrounded by the ground layer (413), A mold (42a) provided at an end of the two coaxial cables (411), and each ground layer (413) included in the two coaxial cables (411) includes a ground press-fit pin (43). The ground press-fit pin (43) is led out from the mold (42a), and each signal line (411) of the two coaxial cables (41) is connected to the mold (42a). Are derived individually from

Description

  The present invention relates to a coaxial cable unit for transmitting a signal, and is used in a device interface device, an electronic component test apparatus, and the like for testing various electronic components (hereinafter also simply referred to as “IC”) such as a semiconductor integrated circuit element. The present invention relates to a preferred coaxial cable unit to be applied.

  In an electronic component testing apparatus, a test head electrically connected to a tester is set in a handler, and an IC conveyed on the handler side is pressed into a socket connected to the test head. Tested by a tester. When the test is completed, the ICs are taken out of the test process by the handler, and are classified into categories such as non-defective products and defective products according to the test results.

  A test head provided in the test process is equipped with a HiFix (device interface device) for relaying signal transmission / reception between the IC and the test head. This HiFix has a socket board with a socket to which the IC is electrically contacted, a performance board electrically connected to the test head, and a plurality of coaxials that electrically connect the socket board and the performance board. It is comprised from the cable unit and the support structure which supports these. Various types of HiFix are available according to the type of IC and are exchanged when the IC type is changed.

  As a coaxial cable unit that connects the socket board and the performance board, the outer periphery of the ground layer at the end of the coaxial cable is surrounded by the cable terminal enclosure, and the mounting part electrically connected to this enclosure is connected to the signal line. In the past, a cable that is extended in the axial direction of the coaxial cable at a desired distance from the cable is known (see, for example, Patent Document 1).

  In addition, as a coaxial cable unit having another configuration, a coaxial cable unit that has a cable block electrically connected to a ground line of an electric circuit board, and a ground layer of the coaxial cable is electrically connected to the cable block has been conventionally used. It is known (see, for example, Patent Document 2).

  In the former coaxial cable unit, the coaxial cable unit is connected to the electric circuit board by inserting a signal line and an attachment portion into a through hole formed in the electric circuit board. At this time, it is necessary to solder the attachment portion to the through hole on the surface on the insertion side of the electric circuit board, and to solder the signal line and the attachment portion to the through hole on the surface on the penetration side. Therefore, it is necessary to solder on both sides.

  Also in the latter coaxial cable unit, it is necessary to solder the ground layer of the coaxial cable to the cable block and to solder the signal line of the coaxial cable to the electrode pad of the electric circuit board.

  Therefore, any of the above coaxial cable units requires a large number of mounting steps. Along with this, many man-hours are required for repairs such as replacement of the coaxial cable unit.

  Furthermore, in recent years, there has been a demand for lead-free solder, but lead-free solder has a melting point of about 40 ° C. higher than that of conventional solder. For this reason, in the above-described coaxial cable unit with many soldering points, a large increase in the number of mounting steps is inevitably caused when dealing with lead-free.

  As another coaxial cable unit, a coaxial cable unit 40k as shown in FIG. 18 is known. In this coaxial cable unit 40k, in the mold 42k provided at the end of the coaxial cable 41, the insulating layer 412 covering the signal line 411 and the ground layer 413 are exposed and separated by a predetermined length. Yes. The signal line 411 exposed from the insulating layer 412 at the tip is connected to the signal terminal 48, and the exposed ground layer 413 is attached to the ground terminal 49, and the signal terminal 48 and the ground terminal 49 are connected. Are derived in parallel from the mold 42k.

  Even in the coaxial cable unit 40k having such a structure, since it is necessary to solder after inserting the respective terminals 48 and 49 into the through holes of the electric circuit board, a large number of mounting steps are required. Further, the coaxial cable unit 40k shown in FIG. 18 has a structure in which the coaxial structure mismatch distance L1 is long. In the part, the characteristic impedance of the coaxial cable 41 is different, resulting in distortion of the transmitted pulse signal waveform and jitter due to reflection. Along with this, there is a difficulty in degrading test quality particularly when testing a high-speed device. For this reason, it is a problem as an electronic component testing apparatus for testing high-speed devices.

Japanese Patent Laid-Open No. 2000-235061 JP 2001-357914 A

  An object of the present invention is to provide a coaxial cable unit excellent in workability to an electric circuit board, a device interface apparatus using the coaxial cable unit, and an electronic component testing apparatus.

  (1) In order to achieve the above object, according to the present invention, a coaxial cable unit for transmitting a signal, which has a ground layer and a signal line surrounded by the ground layer, A plurality of coaxial cables and a mold provided on at least one end of the single or multiple coaxial cables, and each ground layer of the single or multiple coaxial cables has a single press Provided by a coaxial cable unit that is electrically connected to a fit pin, the press-fit pin is led out from the mold, and each signal line of the single or plural coaxial cables is led out from the mold (See claim 1).

  In the present invention, the ground layer of the coaxial cable is connected to the press-fit pin, and the press-fit pin is led out from the mold. This eliminates the need for soldering the ground layer and the electric circuit board when connecting the coaxial cable unit and the electric circuit board, thereby reducing the number of man-hours.

  In addition, a single press-fit pin derived from a mold provided at at least one end of the plurality of coaxial cables is shared by the ground layers of the plurality of coaxial cables. Thereby, since the number of soldering locations is reduced, the man-hour for attaching the coaxial cable unit to the electric circuit board is further reduced. In addition, by sharing a single press-fit pin, high-density close mounting can be easily performed. Furthermore, as the number of soldering points decreases, the repairability is improved, and it is possible to cope with lead-free while suppressing an increase in the number of mounting steps.

  On the other hand, when a mold is provided on at least one end of a single coaxial cable, it can be mounted in a narrow area on an electric circuit board that cannot be mounted with the above-mentioned shared type. The packaging density of the coaxial cable can be improved.

  Although not particularly limited in the above invention, it is preferable that the press-fit pin is led out from the mold in a predetermined direction, and the signal lines are led out from the mold in a direction different from the predetermined direction.

  Thereby, a coaxial structure mismatch distance can be shortened and the coaxial cable unit suitable for high frequency transmission can be provided. Also, it is only necessary to form a through hole for connecting the press-fit to the electric circuit board, and no through hole for connecting the signal line is required. Therefore, the coaxial cable unit is mounted on the electric circuit board with high density. However, it is also possible to obtain an advantage that a large number of signal lines can easily pass through the inner layer in the multilayer electric circuit board under impedance conditions having desired characteristics.

  Although not particularly limited in the above invention, it is preferable that the signal line is led out from the mold in a direction substantially orthogonal to the predetermined direction.

  Although not particularly limited in the above invention, the predetermined direction is preferably a direction substantially parallel to the axial direction of the coaxial cable or a direction substantially orthogonal to the axial direction of the coaxial cable. .

  Although not particularly limited in the above invention, the signal line further includes a single or a plurality of electrode pads formed on the surface of the mold, and the signal lines included in the single or a plurality of coaxial cables are the electrode pads. Preferably, each signal line is led out from the mold via each electrode pad (refer to claim 2).

  By deriving the signal line of the coaxial cable from the mold via the electrode pad, when mounting the coaxial cable unit on the electric circuit board, instead of manual soldering, a reflow method can be adopted. It is possible to further reduce the number of mounting steps.

  Although not particularly limited in the above invention, a spring member having elasticity and conductivity is provided on the surface of the mold that contacts the electronic circuit board, and one end of the spring member is in electrical contact with the signal line. Each signal line is led out from the mold via the spring member, and the other end of the spring member is elastically pressed into contact with an electrode formed on the surface of the electronic circuit board. It is preferable to electrically connect to the electrode (see claim 3).

  Although not particularly limited in the above invention, it is preferable to further include a closing means for closing the through hole into which the press-fit pin is inserted (see claim 5).

  In the electronic component test apparatus, the IC is tested in a state where high or low temperature stress is applied to the IC in the chamber of the handler. Further, when the press fit pin is press-fitted into the through hole of the electric circuit board, a gap may be generated between the press fit pin and the inner wall surface of the through hole. For this reason, the cool air in the chamber may cause condensation on the electronic circuit board, the coaxial cable unit, and the like through the gap. On the other hand, in the present invention, it is possible to prevent dew condensation from occurring on the electric circuit board or the coaxial cable unit by closing the through hole of the electric circuit board by the closing means.

  Although it does not specifically limit in the said invention, It is preferable that the said closure means contains the packing in which the said press fit pin derived | led-out from the said mold was press-fit.

  Although it does not specifically limit in the said invention, It is preferable that the said obstruction | occlusion means contains the convex-shaped part formed by raising the part of the said mold (refer Claim 6).

  Although it does not specifically limit in the said invention, It is preferable that the said obstruction | occlusion means contains the enlarged diameter part formed by enlarging a part of said press fit pin.

  Although not particularly limited in the above invention, it is preferable that the closing means includes a plug or a seal that closes an opening located on the opposite side to the opening on the side where the press-fit pin is press-fitted in the through hole.

  Although not particularly limited in the above invention, the press-fit pins led out from the mold are inserted into through holes formed in an electric circuit board, and the signal lines led out from the mold are It is preferable to lead out along the main surface of a circuit board.

  (2) To achieve the above object, according to the present invention, a coaxial cable unit for transmitting a signal, the coaxial cable having a ground layer and a signal line surrounded by the ground layer; A ground press that is electrically connected to the ground layer, and a mold provided on at least one end of the coaxial cable, and a press-fit pin led out from the mold. A coaxial cable unit including a fit pin and a signal press-fit pin electrically connected to the signal line is provided (see claim 4).

  In the present invention, the ground layer of the coaxial cable is electrically connected to the press-fit pin for ground and led out from the mold, and the signal line of the coaxial cable is electrically connected to the press-fit pin for signal and led out from the mold. Let

  Thereby, when attaching a coaxial cable unit to an electric circuit board, the soldering work of a press fit pin becomes unnecessary, and it can reduce an installation man-hour. In addition, repairability is improved as soldering is not required.

  Although not particularly limited in the above invention, it is preferable that the ground press-fit pin and the signal press-fit pin are led out from the mold in substantially the same direction.

  Although not particularly limited in the above invention, it is preferable to further include a closing means for closing the through hole into which the press-fit pin is inserted (see claim 5). Thereby, it can prevent that dew condensation generate | occur | produces on an electric circuit board | substrate or a coaxial cable unit.

  Although it does not specifically limit in the said invention, It is preferable that the said closure means contains the packing in which the said press fit pin derived | led-out from the said mold was press-fit.

Although it does not specifically limit in the said invention, It is preferable that the said obstruction | occlusion means contains the convex-shaped part formed by raising the part of the said mold (refer Claim 6).

  Although it does not specifically limit in the said invention, It is preferable that the said obstruction | occlusion means contains the enlarged diameter part formed by enlarging a part of said press fit pin.

  Although not particularly limited in the above invention, it is preferable that the closing means includes a plug or a seal that closes an opening located on the opposite side to the opening on the side where the press-fit pin is press-fitted in the through hole.

  Although not particularly limited in the above invention, the ground press-fit pins and the signal press-fit pins led out from the mold are preferably press-fitted into through holes formed in the electric circuit board, respectively.

  (3) In order to achieve the above object, according to the present invention, a socket board having a socket to which an electronic component is electrically contacted and a performance electrically connected to a tester for testing the electronic component A device interface apparatus comprising: a board; and the coaxial cable unit according to any one of claims 1 to 6, which electrically connects the socket board and the performance board (see claim 7).

  Thereby, since the man-hour for attaching the coaxial cable unit to the electric circuit board is reduced, the cost of the device interface apparatus can be reduced.

  In order to achieve the above object, according to the present invention, a socket board on which a socket to which an electronic component is electrically contacted is mounted, and a performance board electrically connected to a tester for testing the electronic component A first coaxial cable unit and a second coaxial cable unit for electrically connecting the socket board and the performance board, wherein the first coaxial cable unit comprises: A plurality of coaxial cables having a ground layer and a signal line surrounded by the ground layer, and a mold provided at at least one end of the plurality of coaxial cables, the plurality of coaxial cables being Each ground layer having is electrically connected to a single press-fit pin, the press-fit pin being in front Each signal line of the plurality of coaxial cables derived from a mold is derived from the mold, and the second coaxial cable unit includes a ground layer and a signal surrounded by the ground layer. A single coaxial cable having a wire, and a mold provided on at least one end of the single coaxial cable, and the ground layer of the single coaxial cable is electrically connected to the press-fit pin. There is provided a device interface device in which the press-fit pins are led out from the mold, and the signal lines of the single coaxial cable are led out from the mold.

  When only a coaxial cable unit of a type sharing a ground layer is used, it may not be possible to mount the coaxial cable in a narrow place on the electric circuit board. On the other hand, in the present invention, the mounting density of the coaxial cable on the electric circuit board can be improved by using a coaxial cable of a type not sharing the ground layer together.

  (4) To achieve the above object, according to the present invention, the device interface apparatus according to claim 7 and the device interface apparatus are mounted, and electrical signals are exchanged between the electronic components. An electronic component testing apparatus is provided that includes a test head and a tester that executes a test of the electronic component via the test head (see claim 8).

  Thereby, since the man-hour for attaching the coaxial cable unit to the electric circuit board is reduced, the cost of the electronic component testing apparatus can be reduced.

  Although not particularly limited in the above invention, it is preferable to further include a handler that supplies the electronic component before the test to the test head and classifies the tested electronic component according to a test result.

  (5) To achieve the above object, according to the present invention, a coaxial cable unit for transmitting a signal, comprising a ground layer and a signal line surrounded by the ground layer, A plurality of coaxial cables, a mold provided on at least one end of the single or plural coaxial cables, and a press-fit pin that is led out from the mold and press-fitted into a through hole of an electronic circuit board. The press-fit pin has a structure in which the press-fit pin is directly connected to the circumference of the ground layer of the coaxial cable, and the signal line is exposed so that the mismatch distance of the coaxial structure is minimized. A coaxial cable unit is provided, comprising a signal terminal derived from (refer to claim 9).

  In order to achieve the above object, according to the present invention, a coaxial cable unit for transmitting a signal, the coaxial cable having a ground layer and a signal line surrounded by the ground layer, A mold provided on at least one end of the coaxial cable; and a press-fit pin that is led out from the mold and press-fitted into a through hole of the electronic circuit board. A press-fit pin for signals that has a structure in which press-fit pins are directly connected to the circumference of the ground layer, and a press-fit pin is connected to the end of the signal line of the coaxial cable so as to minimize the coaxial structure mismatch distance. A coaxial cable unit comprising a pin is provided (see claim 10).

  Although not particularly limited in the above invention, it is preferable that a closing means for closing the through hole is provided between the through hole of the electronic circuit board and the mold (see claim 11).

FIG. 1 is a side view showing an electronic component testing apparatus according to the first embodiment of the present invention. FIG. 2 is an exploded perspective view showing the HiFix and the test head according to the first embodiment of the present invention. FIG. 3 is a side view showing the entirety of the first coaxial cable unit according to the first embodiment of the present invention. 4A is a perspective view of an end portion of the first coaxial cable unit shown in FIG. FIG. 4B is a front view of the end portion of the first coaxial cable unit shown in FIG. 4A. FIG. 4C is a side view of the end portion of the first coaxial cable unit shown in FIG. 4A. 4D is a diagram showing an internal structure of an end portion of the first coaxial cable unit shown in FIG. 4A. FIG. 5 is a cross-sectional view taken along line VV in FIG. 4C. FIG. 6A is a cross-sectional view showing a state where the first coaxial cable unit according to the first embodiment of the present invention is attached to a socket board in which a through-side through hole is formed. FIG. 6B is a cross-sectional view showing a state in which the first coaxial cable unit according to the first embodiment of the present invention is attached to a socket board in which a non-through hole is formed. FIG. 6C is a cross-sectional view showing a state in which the first coaxial cable unit according to the first embodiment of the present invention is attached to a socket board on which a ground pad is formed. FIG. 7A is a perspective view showing an end portion of a second coaxial cable unit according to the first embodiment of the present invention. FIG. 7B is a front view of the end portion of the second coaxial cable unit shown in FIG. 7A. FIG. 7C is a side view of the end portion of the second coaxial cable unit shown in FIG. 7A. FIG. 7D is a diagram showing an internal structure of an end portion of the second coaxial cable unit shown in FIG. 7A. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7C. FIG. 9 is a perspective view showing an end portion of the coaxial cable unit according to the second embodiment of the present invention. FIG. 10A is a perspective view showing an end portion of a coaxial cable unit according to the third embodiment of the present invention. FIG. 10B is a front view of the coaxial cable unit shown in FIG. 10A. FIG. 10C is a side view of the coaxial cable unit shown in FIG. 10A. FIG. 11 is a cross-sectional view showing a state where the coaxial cable unit according to the third embodiment of the present invention is attached to the socket board. FIG. 12 is a partially enlarged sectional view showing a coaxial cable unit according to the fourth embodiment of the present invention. FIG. 13 is a partially enlarged sectional view showing a coaxial cable unit according to the fifth embodiment of the present invention. FIG. 14 is a partially enlarged sectional view showing a coaxial cable unit according to the sixth embodiment of the present invention. FIG. 15 is a partially enlarged sectional view showing a coaxial cable unit according to the seventh embodiment of the present invention. FIG. 16: is sectional drawing which shows the edge part of the coaxial cable unit which concerns on 8th Embodiment of this invention. FIG. 17 is a cross-sectional view showing an end portion of the coaxial cable unit according to the ninth embodiment of the present invention. FIG. 18 is a cross-sectional view showing the structure of a conventional coaxial cable unit.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a side view showing an electronic component testing apparatus according to a first embodiment of the present invention, and FIG. 2 is an exploded perspective view showing a hifix and a test head according to the first embodiment of the present invention.

  As shown in FIG. 1, the electronic component testing apparatus 1 according to the first embodiment of the present invention includes a HiFix 10 to which the IC under test is electrically contacted, and the HiFix 10 attached thereto, A test head 50 that exchanges electrical signals between them, a tester 60 that sends a test signal to the test head 50 and executes a test of the IC under test, and supplies the IC under test before the test to the test head 50 The handler 70 classifies the tested ICs to be tested according to the test results. The handler 70 is provided with a chamber (not shown) so that high or low temperature stress can be applied to the IC. The electronic component testing apparatus 1 can test (inspect) whether or not the IC properly operates in a state where a temperature stress is applied, and can classify the IC according to the test result. .

  As shown in FIG. 2, the HiFix 10 according to the first embodiment of the present invention includes a socket board 20 on which a socket 21 to which an IC under test is electrically contacted is mounted, and a tester 60 that tests the IC under test. The performance board 30 is electrically connected to the socket board 20 and the first and second coaxial cable units 40a and 40b are electrically connected to the socket board 20 and the performance board 30. In FIG. 2, the second coaxial cable unit 40b is not shown. In FIG. 2, since one end of the coaxial cable unit 40 a is hidden behind the socket board 20, only the mold 42 a at the other end is shown. The coaxial cable units 40a and 40b are provided with molds 42a and 42b at both ends. The HiFix 10 is mounted on the test head 50 and is electrically connected to the tester 60 via a cable.

  The socket board 20 is disposed in the chamber of the handler 70 together with a heat insulating structure (spacing frame) (not shown). The socket board 20 is provided with a ground through hole 22 and a signal through hole 24 as shown in FIG. Here, as described above, in the electronic component testing apparatus 1, since the test is performed in a state where temperature stress is applied to the IC, the inside of the chamber of the handler 70 is passed through the through holes 22 and 24 provided in the socket board 20. It is necessary to prevent the circulation with the outside air. In particular, when the inside of the chamber is cooled, condensation may occur due to the intrusion of moisture from the outside air, resulting in poor insulation between the terminals of the socket board 20 and the coaxial cable unit 40. As a result, good devices may be classified as defective. This will interfere with the implementation of the test. There is a big difficulty in this respect. Here, it is assumed that the other through holes in the socket board 20 are sealed in advance.

  The ground through hole 22 is connected to a ground plane pattern 23 on the entire surface of the socket board 20 provided in the inner layer of the socket board 20 (see FIG. 6A). The ground press-fit pins 43 of the coaxial cable units 40a and 40b shown in FIGS. 4A to 4D and FIGS. Along with the press-fitting, the packing 45 shown in the figure blocks the ground through-hole 22, so that the outflow of gas from the chamber of the handler 70 is prevented.

  The signal through hole 24 is connected to a signal wiring pattern 25 provided in the inner layer of the socket board 20 (see FIG. 6A). The signal through hole 24 is connected to a signal electrode pad 26 (see FIG. 6A) formed on the surface (the lower surface in FIG. 2) to which the coaxial cable units 40a and 40b are attached in the socket board 20. A signal line 411 led out from the coaxial cable units 40a and 40b is soldered to the signal electrode pad 26. Along with this soldering, the through hole of the through hole 24 is sealed with solder, so that gas outflow from the chamber of the handler 70 via the through hole 24 is prevented. If necessary, the signal through hole 24 may be formed by, for example, a printing hole filling method or a non-through-type through hole such as SVH.

  The performance board 30 is also provided with a ground through hole and a signal through hole (not shown).

  The ground through hole of the performance board 30 is connected to a ground plane pattern provided in the inner layer of the performance board 30 although not particularly shown. The ground press-fit pins 43 of the coaxial cable units 40a and 40b are press-fitted into the ground through holes. Note that the packing 45 shown in FIG. 10 may not be inserted into the ground press-fit pin 43 press-fitted into the ground through hole of the performance board 30.

  Further, the signal through hole of the performance board 30 is connected to a signal wiring pattern provided in the inner layer of the performance board 30 although not particularly shown. The signal through hole is connected to a signal electrode pad formed on a surface (upper surface in FIG. 2) to which the coaxial cable units 40a and 40b are attached in the performance board 30. Signal wires 411 led out from the coaxial cable units 40a and 40b are soldered to the signal electrode pads.

  When testing the IC under test using the HiFix 10 configured as described above, first, a high-speed test signal for testing the IC under test is sent from the test head 50 to the performance board of the HiFix 10. 30. The test signal transmitted to the performance board 30 is provided to the signal wiring pattern 25 provided on the socket board 20 through the coaxial cable units 40 a and 40 b and the socket board 20, and further via the socket 21. It is given to the IC under test. Similarly, an output signal output from the IC under test at the time of testing is given to the test head 50 through the socket 21, socket board 20, coaxial cable units 40 a and 40 b, and performance board 30.

  3 is a side view showing the entirety of the first coaxial cable unit according to the first embodiment of the present invention, FIG. 4A is a perspective view of an end portion of the first coaxial cable unit shown in FIG. 3, and FIG. 4B is FIG. FIG. 4C is a side view of the end of the first coaxial cable unit shown in FIG. 4A, and FIG. 4D is an end of the first coaxial cable unit shown in FIG. 4A. FIG. 5 is a cross-sectional view taken along line VV in FIG. 4C, and FIGS. 6A to 6C are views showing a state in which the first coaxial cable unit according to the first embodiment of the present invention is attached to the socket board. FIG.

  As shown in FIGS. 3 to 5, the first coaxial cable unit 40 a according to the present embodiment is provided at two coaxial cables 41 having a signal line 411 and a ground layer 413 and at the end of the coaxial cable 41. A mold 42a, a ground press-fit pin 43 derived from the mold 42a, and a packing 45 for closing a through hole into which the ground press-fit pin 43 is inserted.

  As shown in FIG. 3, each coaxial cable 41 covers the signal line 411, the insulating layer 412 disposed on the outer periphery of the signal line 411, the ground layer 413 disposed on the outer periphery of the insulating layer 412, and these. And a covering layer 414.

  The signal line 411 is made of a material having excellent conductivity, such as a metal material, and is formed by twisting a plurality of strands. The ground layer 413 is formed of a braided body made of a material having excellent conductivity, such as a metal material. The insulating layer 412 and the covering layer 414 are made of a material excellent in flexibility and electrical insulation, such as a synthetic resin material. Note that the signal line 411 may be formed of a single line, but it is preferable that the signal line 411 is formed by twisting a plurality of strands as described above. Moreover, although the ground layer 413 may be comprised with the foil excellent in electroconductivity, it is more preferable to comprise with the braided body as mentioned above.

  The mold 42a is provided at the ends of the two coaxial cables 41 as shown in FIGS. The mold 42a is made of a material having excellent electrical insulation, such as a synthetic resin material, and is preferably formed to be thinner. This facilitates high-density mounting on the electric circuit board. In the present invention, three or more coaxial cables may be attached to one mold 42a.

  In FIG. 3, for convenience of explanation, the mold 42 a is illustrated only on one end of the coaxial cable 41, but in actuality, in this embodiment, both of the coaxial cables 41 are shown. A mold 42a is provided at the end.

  As shown in FIGS. 4D and 5, in each coaxial cable 41, the ground layer 413 is exposed by peeling the coating layer 414 in the mold 42 a. Each exposed ground layer 413 is bonded to the rear end portion of a single ground press-fit pin 43 by using a technique such as soldering. Therefore, in the first coaxial cable unit 40a according to the present embodiment, one ground press-fit pin 43 is shared by the two coaxial cables 41 as a ground layer. The exposed ground layer 413 and the rear end portion of the ground press-fit pin 43 may be wrapped with a metal plate and spot-welded or soldered to join.

  The ground press-fit pin 43 in which the ground layers 413 of the two coaxial cables 41 are joined to the rear end portion is formed from the surface of the mold 42a opposite to the side from which the coaxial cable 41 is led out. Deriving along a direction substantially parallel to the direction. The press fit pin 43 is made of a material having excellent conductivity such as a metal material. The press-fit pin 43 has a press-fit portion 431 having a shape that is elastically constricted and press-fitted into the through hole. Here, it is preferable that the press-fit portion 431 has a short distance to be electrically connected to the ground through hole 22 of the connection partner. For example, the press-fit portion 431 is disposed close to the mold 42a side within a range that can be accurately retained by press-fitting. Moreover, the site | part of the press fit part 431 may be formed long and may be formed so that it may be provided in two places up and down.

  Furthermore, each coaxial cable 41 is peeled after the ground layer 413 is exposed for a predetermined length in the mold 42a, so that the insulating layer 412 is exposed. 4D and FIG. 5, the coaxial cable 41 located on the left side and entering the mold 42a is substantially perpendicular to the direction in which the ground press-fit pin 43 is led out (in the drawing). After bending in the left direction, it is led out from the left side surface of the mold 42a. Similarly, the coaxial cable 41 positioned on the right side and entering the mold 42a in FIG. 5 is bent in a direction (right direction in the drawing) in which the ground press-fit pin 43 is substantially orthogonal to the lead-out direction. After that, it is led out from the right side surface of the mold 42a. The insulating layer 412 of each coaxial cable 41 led out from the side surface of the mold 42a is peeled off at a predetermined distance from the side surface, and the signal line 411 of each coaxial cable 41 is individually exposed.

  Therefore, the coating layer 414 of the coaxial cable 41 is peeled off, and the ground press-fit pin 43 is directly connected to a desired portion of the exposed ground layer 413. Thereby, it is not necessary to expose and separate the insulating layer 412 covering the signal line 411 and the ground layer 413 by a predetermined length, and the ground press-fit pin 43 can be directly connected.

  Further, the signal line 411 of the coaxial cable 41 is used as a terminal of the signal line 411 after maintaining the structure of the coaxial cable 41 close to the lead-out portion of the mold 42 so that the coaxial structure mismatch distance L2 is minimized. Expose the part that should be exposed. As a result, a portion different from the characteristic impedance of the coaxial cable 41 becomes the shortest, so that a coaxial cable unit having excellent transmission characteristics can be realized.

  Further, if desired, a ground plating process or the like may be applied to the outer surface of the mold 42 at a site adjacent to the coaxial structure mismatch distance L2. In this case, the characteristic impedance at the coaxial structure mismatch distance L2 can be brought close to the characteristic impedance of the coaxial cable. If desired, a ground surface may be provided on the substrate side in contact with the mold 42. In this case, the characteristic impedance at the coaxial structure mismatch distance L2 can be brought close to the characteristic impedance of the coaxial cable.

  The packing 45 prevents gas from flowing through the ground through-hole 22 when a test of the IC is performed in a state where a high or low temperature stress is applied to the IC in the chamber. As shown in FIGS. 3 to 5, a ground press-fit pin 43 that has an annular shape and is led out from the mold 42 a is inserted into the inner hole thereof. Examples of the material constituting the packing 45 include an elastomer having rubber elasticity. Among them, it is preferable to use a silicone resin having excellent heat resistance and cold resistance, but the present invention is not limited to this as long as it can meet the purpose of the test. When a non-through-type through hole such as SVH is applied as the ground through hole 22, the packing 45 is not necessary.

  The first coaxial cable unit 40a configured as described above is attached to the socket board 20 as follows. That is, as shown in FIG. 6A, first, the press-fit pin 43 for ground of the coaxial cable unit 40a is press-fitted into the through-hole 22 for ground from the back side of the socket board 20 until the mold 42a hits the socket board 20. With this press-fitting, the opening 221 on the lower side of the ground through-hole 22 is closed by the packing 45 in which the ground press-fit pin 43 is inserted.

  Since the press-fit portion 431 of the press-fit ground press-fit pin 43 is elastically constricted in the ground through-hole 22, the ground press-fit pin 43 and the ground through-hole 22 are soldered. There is no need.

  Next, each signal line 411 led out from the mold 42a in the lateral direction is connected to the signal electrode pad 26 formed on the back surface of the socket board 20 by soldering.

  Even when the first coaxial cable unit 40a is attached to the performance board 30, although not particularly illustrated, first, the ground press-fit pin 43 is press-fitted into the ground through-hole from the surface side of the performance board 30. Next, each signal line 411 led out from the mold 42a is connected to a signal electrode pad formed on the surface of the performance board 30 by soldering. However, the packing 45 may not be inserted into the ground press-fit pin 43 on the performance board 30 side.

  6A is an example in the case where the signal through hole 24 is a through-type through hole, whereas FIG. 6B is an example in the case of non-through by SVH (Surface Via Hole). The first coaxial cable unit 40a according to the present embodiment can cope with a non-through-type through hole by SVH shown in FIG. 6B in addition to the through-type through hole shown in FIG. 6A.

  FIG. 6C shows an example in which a ground pad 22 b is formed around the opening 221 of the ground through hole 22. Thereby, the ground pad 22b is arranged around the signal line 411 from which the ground layer 413 is peeled in the mold 42a, so that the characteristic impedance of the coaxial cable 41 can be brought close to.

  The first coaxial cable unit 40a according to the present embodiment has a structure in which each ground layer 413 of the two coaxial cables 41 shares one ground press-fit pin 43 led out from the mold 42a. As a result, a large number of coaxial cable units 40a ranging from several hundred to several thousand can be easily mounted with high density, and the number of soldering points can be reduced when attaching to the socket board 20 or the performance board 30. I can do it. Moreover, since all connection operations can be performed from one surface of the substrate, the number of mounting steps can be reduced. Furthermore, repairability such as repair and maintenance can be improved because all connection operations can be performed from one side.

  Generally, lead-free solder has a melting point of about 40 ° C. higher than that of conventional solder (containing lead). For this reason, soldering that requires heat capacity such as the ground of a coaxial cable is difficult. However, even with the same coaxial cable, the soldering of a signal or the like does not require a heat capacity as large as the ground, and therefore is considerably easier than the ground and can be made lead-free. In this respect, according to the present embodiment, it is possible to cope with lead-free soldering while suppressing an increase in the number of mounting steps by reducing the number of soldering portions of the ground. Moreover, regarding the transmission path of the coaxial cable unit, the coaxial structure mismatch distance L2 shown in FIG. 4D can be shortened, and a coaxial cable unit suitable for high-frequency transmission can be provided.

  Further, in the first coaxial cable unit 41 according to this embodiment, the ground through hole 22 of the socket board 20 is closed by the packing 45 in which the ground press-fit pin 43 is inserted. As a result of preventing the circulation of the cool air, it is possible to prevent the condensation on the socket board 20 and the coaxial cable unit 40 and the like. Therefore, as a result of preventing the occurrence of insulation failure or the like due to condensation, stable test quality can always be maintained.

  7A is a perspective view showing the end of the second coaxial cable unit in the first embodiment of the present invention, FIG. 7B is a front view of the end of the coaxial cable unit shown in FIG. 7A, and FIG. 7C is the coaxial shown in FIG. 7A. 7D is a side view of the end portion of the cable unit, FIG. 7D is a view showing the internal structure of the end portion of the first coaxial cable unit shown in FIG. 7A, and FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG.

  In the HiFix 10 according to the first embodiment of the present invention, as a cable for electrically connecting the socket board 20 and the performance board 30, in addition to the first coaxial cable unit 40a described above, the second described below. A coaxial cable unit 40b is used.

  Unlike the first coaxial cable unit 40a, the second coaxial cable unit 40b in the first embodiment of the present invention has only one coaxial cable 41 attached to the mold 42b, as shown in FIGS. . Accordingly, the signal line 411 is led out only from one side surface of the mold 42b, and the signal line is not led out from the other side surface. Also, as shown in FIG. 8, only the ground layer 413 of one coaxial cable 41 is connected to the ground press-fit pin 43 led out from the mold 42b.

  By using the second coaxial cable unit 40b configured as described above, the coaxial cable 41 can be mounted on the socket board 20 and the performance board 30 even in a narrow area that is impossible with the first coaxial cable unit 40a. Thus, the mounting density of the coaxial cable 41 can be improved.

  FIG. 9 is a perspective view showing an end portion of the coaxial cable unit according to the second embodiment of the present invention.

  In the coaxial cable unit 40c according to the second embodiment of the present invention, as shown in FIG. 9, the ground layers 413 of the two coaxial cables 41 are provided in the same manner as the first coaxial cable unit 40a according to the first embodiment. An electrically connected ground press-fit pin 43 is led out from the mold 42c.

  In the present embodiment, unlike the first coaxial cable unit 40a according to the first embodiment, the signal line 411 of the coaxial cable 41 located on the left side and entering the mold 42c in FIG. The electrode pad 421 formed on the left side surface is electrically connected. In addition, the signal line 411 of the coaxial cable 41 located on the right side and entering the mold 42c in the figure is electrically connected to the electrode pads 421 formed on the upper surface and the right side surface of the mold 42c. Both signal lines 411 are electrically connected to an electrode pad 421 (for example, a material suitable for soldering or a plated material), and the electrode pad 421 is exposed like a mold 42c shown in FIG.

  When the coaxial cable unit 40c is attached to the socket board 20, after pressing the ground press-fit pin 43 into the ground through hole 22, each electrode pad 421 formed on the surface of the mold 42c is placed on the lower surface of the socket board 20. The signal electrode pad 26 (see FIG. 6A) thus formed is connected by a reflow method or the like. Similarly, when attaching to the performance board 30, after pressing the press-fit pins 43 for ground into the ground through holes formed in the performance board 30, the electrode pads 421 formed on the surface of the mold 42 c are connected to the performance board 30. It joins to the signal electrode pad formed on the surface of 30 by a reflow method or the like.

  As described above, in the coaxial cable unit 40c according to the present embodiment, when the signal line 411 of the coaxial cable 41 is led out from the mold 42c via the electrode pad 421, the coaxial cable unit 40c is mounted on the electric circuit board. Since the reflow method can be employed instead of the manual soldering, the number of mounting steps can be further reduced.

  10A is a perspective view showing an end portion of the coaxial cable unit according to the third embodiment of the present invention, FIG. 10B is a front view of the coaxial cable unit shown in FIG. 10A, and FIG. 10C is a side view of the coaxial cable unit shown in FIG. FIG. 11 is a cross-sectional view showing a state in which the coaxial cable unit according to the third embodiment of the present invention is attached to the socket board.

  As shown in FIGS. 10A to 10C, the coaxial cable unit 40d according to the third embodiment of the present invention has one coaxial cable 41 attached to the mold 42d and two press-fit pins 43 from the mold 42d. , 44 is derived.

  As in the first embodiment, the ground layer 413 of the coaxial cable 41 is electrically connected to the ground press-fit pin 43. On the other hand, unlike the first embodiment, the signal press-fit pin 44 is electrically connected to the signal line 411 of the coaxial cable 41 using a technique such as welding.

  The signal line 411 from which the insulating layer 412, the ground layer 413, and the coating layer 414 are peeled off in the mold 42d is connected to the signal press-fit pin 44 so that the length of the exposed portion is the shortest. Yes. Thereby, the different characteristic impedance in the said part can be made into the minimum distance. Therefore, as a result of improving the waveform quality particularly when testing a high-speed device, better device test quality can be achieved.

  These press-fit pins 43 and 44 are led out from the mold 42d in substantially the same direction. Moreover, these press-fit pins 43 and 44 are inserted in the inner holes of the packing 45, respectively, as in the first embodiment.

  As shown in FIG. 11, the coaxial cable unit 40d configured as described above press-fits the ground press-fit pin 43 into the ground through hole 22 and simultaneously presses the signal press-fit pin 44 into the signal through wheel 24. By doing so, it is attached to the socket board 20. With this press-fitting, the packing 45 in which the ground press-fit pin 43 is inserted closes the opening 221 on the lower side of the ground through-hole 22 and the packing 45 in which the signal press-fit pin 44 is inserted. As a result, the lower opening 241 of the signal through hole 24 is closed.

  At this time, since the press-fit portion 431 of the press-fit ground press-fit pin 43 is elastically constricted in the ground through-hole 22, the ground press-fit pin 43 and the ground through-hole 22 are soldered. There is no need to attach it. Similarly, since the press-fit portion 441 of the press-fit signal press-fit pin 44 is elastically constricted in the signal through hole 24, the signal press-fit pin 44 and the signal press-fit pin 24 are connected to each other. There is no need to solder. Therefore, when attaching the coaxial cable unit 40d according to this embodiment to the socket board 20, no soldering work is required.

  Similarly, the press-fit pins 43 and 44 are press-fitted into the through holes 22 and 24 when attached to the performance board 30, so that the coaxial cable unit 40 d is attached to the performance board 30 without performing soldering work. However, the packing 45 may not be inserted into the press-fit pins 43 and 44 on the performance board 30 side.

  As described above, the coaxial cable unit 40d according to the present embodiment does not require any soldering work when attached to the socket board 20 or the performance board 30, so that the number of attachment steps can be reduced. In addition, repairability is improved as soldering is not required.

  Furthermore, in the coaxial cable unit 40d according to the present embodiment, the through holes 22 and 24 are closed by the packing 45 in which the press-fit pins 43 and 44 are inserted. It is possible to prevent dew condensation from occurring on the board 20 and the coaxial cable unit 40d. Moreover, as a result of preventing the occurrence of insulation failure or the like due to dew condensation, stable test quality can always be maintained.

  FIG. 12 is a partially enlarged sectional view showing a coaxial cable unit according to the fourth embodiment of the present invention.

  In the coaxial cable unit 40e according to the fourth embodiment of the present invention, as shown in FIG. 12, instead of the packing 45 in the first embodiment, a convex portion 422 whose part is raised in a convex shape is formed on the mold 42e. Is formed. When the ground press-fit pin 43 is press-fitted into the ground through-hole 22, the convex portion 422 closes the opening 221 below the ground through-hole 22. In this case, the generation of condensation on the socket board 20 or the coaxial cable unit 40e due to the cool air in the chamber of the handler 70 without the packing 45 is prevented, and as a result, the construction can be made at a lower cost. In addition to the structure example in which the convex portion 422 is formed in the mold shown in FIG. 12, an annular structure is formed by extending the mold 42e in the direction of the press-fit pin 43, and lightly press-fitted so as to close the through hole 22. It is good also as a shape to do. Also in this case, since the packing 45 can be deleted, it can be configured at a lower cost.

  FIG. 13 is a partially enlarged cross-sectional view showing a coaxial cable unit according to a fifth embodiment of the present invention.

  In the coaxial cable unit 40f according to the fifth embodiment of the present invention, as shown in FIG. 13, instead of the packing 45 in the first embodiment, a diameter-enlarged portion whose diameter is enlarged at the ground press-fit pin 43. 432 is formed. When the ground press-fit pin 43 is press-fitted into the ground through-hole 22, the enlarged diameter portion 432 closes the opening 221 below the ground through-hole 22. This prevents condensation on the socket board, the coaxial cable unit 40f, and the like due to the cool air in the chamber of the handler 70.

  14 and 15 are partially enlarged views showing coaxial cable units according to sixth and seventh embodiments of the present invention, respectively.

  In the coaxial cable unit 40g according to the sixth embodiment of the present invention, as shown in FIG. 14, a plug 46 is inserted into the opening 222 on the upper side of the ground through-hole 22 instead of the packing 45 in the first embodiment. ing. The opening 222 is located on the opposite side of the ground through hole 22 from the side on which the ground press-fit pin 43 is inserted.

  Further, in the coaxial cable unit 40h according to the seventh embodiment of the present invention, as shown in FIG. 15, a seal 47 is provided in the opening 222 on the upper side of the ground through-hole 22 instead of the packing 45 in the first embodiment. It is pasted.

  By closing the opening 222 on the upper side of the ground through-hole 22 using the plug 46 and the seal 47 as described above, the socket board 20 and the coaxial cable units 40g, 40h, etc. due to the cool air in the chamber of the handler 70 are connected. Condensation is prevented from occurring. It is good also as a structure which seals on the upper and lower sides of the socket board 20 together with the packing 45 if desired.

  FIG. 16 is a cross-sectional view showing the end of the coaxial cable unit according to the eighth embodiment of the present invention.

  In the coaxial cable unit 40i according to the eighth embodiment of the present invention, as shown in FIG. 16, similarly to the first coaxial cable unit 40a according to the first embodiment, the end portions of the two coaxial cables 41 are molded. 42i is provided, and a ground press-fit pin 42 electrically connected to each ground layer 413 of the two coaxial cables 41 is led out from the mold 42i, and each signal line of the two coaxial cables 41 is provided. 411 is individually derived from the mold 42i.

  In FIG. 16, since one coaxial cable 41 is hidden behind the other coaxial cable 41, only one coaxial cable 411 is illustrated. Further, in the drawing, since one signal line 411 is hidden behind the other signal line 411, only one signal line 411 is illustrated.

  The coaxial cable unit 40i according to the present embodiment is the same as the first embodiment in that the ground press-fit pin 43 is led out from the mold 42i along a direction substantially orthogonal to the axial direction of the coaxial cable 41. This is different from the first coaxial cable unit 40a. In the coaxial cable unit 40 i according to the present embodiment, each signal line 411 is led out from the mold 42 i along the axial direction of the coaxial cable 41.

FIG. 17 is a sectional view showing an end of a coaxial cable unit according to the ninth embodiment of the present invention.
In the coaxial cable unit 40j according to the ninth embodiment of the present invention, two leaf springs 424 are provided at a contact surface portion in contact with the electric circuit board in the mold 42j. The leaf spring 424 is made of a metal plate that is conductive and elastic, such as adjacent bronze, and is disposed on both sides of the press-fit pin 43. One end of the leaf spring 424 passes through the contact surface portion and is electrically connected to the signal line 411 inside the mold 42j. The other end of the leaf spring 424 is elastically formed and disposed on the contact surface portion of the mold 42j.

  Here, the connection form between the one end of the leaf spring 424 and the signal line 411 may be a structure in which both are in electrical contact when pressed by using the elasticity of the leaf spring 424 itself. Moreover, it is good also as a structure which connects both mechanically / electrically by welding, soldering, etc.

  In the present embodiment, a wedge 433 is formed on the press-fit pin 43 in order to prevent the press-fit pin 43 from moving in the removal direction due to long-term use. Instead of the wedge 433, a ring-shaped convex portion or concave portion, or a spiral convex portion or concave portion may be formed in the press fit 43. As a result, the press-fit pins 43 are press-fitted into the through holes of the electric circuit board, and at the same time, the two leaf springs 424 are brought into contact with and electrically connected to the signal electrode pads 26 (see FIG. 4D) of the electric circuit board. The advantage that soldering is unnecessary is obtained. In addition, since the adjacent coaxial cable units 40 can be closely mounted, a large number of thousands of coaxial cable units 40 can be mounted with high density.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, in the first and second coaxial cable units 40a and 40b according to the first embodiment, the ground layer 413 of the coaxial cable 41 is led out from the mold 42a using the ground press-fit pin 43. In the present invention, the present invention is not limited to this, and the ground layer 413 itself may be electrically connected to each other without using a press-fit pin, and may be led out from the mold 42a as a single common ground layer.

  Further, in the coaxial cable units 40c and 40d according to the second embodiment and the third embodiment, instead of the packing 45, a convex portion 422 may be formed in the mold as in the fourth embodiment, or the fifth embodiment. In this way, the enlarged diameter portion 432 is formed on the press-fit pins 43 and 44, the plug 46 is inserted into the opening of the through holes 22 and 24 as in the sixth embodiment, or the through hole 22 as in the seventh embodiment. , 24 may be attached with a seal 47.

  In addition, a part of the press-fit pin is enlarged to a portion that does not hinder press-fit of the press-fit pin 43 (for example, a tip portion, an intermediate portion, and a root portion), and is pressed into contact with the inner periphery of the through hole 22. A ring-shaped structure may be formed. Even with these structures, it is possible to prevent the air from flowing, and as a result, it is possible to prevent the occurrence of insulation failure due to condensation.

  Further, a wedge 433, a ring-shaped convex portion or concave portion, or a spiral convex portion or concave portion may be formed on the press-fit pin 43. According to this, since the movement of the press-fit pin 43 in the removal direction can be prevented, the press-fitted position state can be stably maintained even in a long-term use or a use environment with a large temperature change.

  Further, in the coaxial cable unit 40d according to the third embodiment, a plurality of coaxial cables 41 are attached to the same mold 42d, and the ground layer 413 of each coaxial cable 41 shares one ground press-fit pin 43. You may comprise so that it may do. Thereby, the further reduction of the man-hours for attaching the coaxial cable unit 40h to the socket board 20 and the performance board 30 can be achieved.

Claims (11)

A coaxial cable unit for transmitting signals,
A single or a plurality of coaxial cables having a ground layer and a signal line surrounded by the ground layer;
A mold provided on at least one end of the single or plural coaxial cables,
Each ground layer of the single or plural coaxial cables is electrically connected to a single press-fit pin, and the press-fit pin is derived from the mold,
Each signal line of the single or plural coaxial cables is a coaxial cable unit derived from the mold. A single or a plurality of electrode pads formed on the surface of the mold;
Each signal line of the single or multiple coaxial cables is electrically connected to each electrode pad,
The coaxial cable unit according to claim 1, wherein the signal lines are led out from the mold through the electrode pads. On the surface in contact with the electronic circuit board in the mold, provided with a spring member having elasticity and conductivity,
One end of the spring member is electrically contacted or connected to the signal line, and each signal line is led out from the mold through the spring member,
The coaxial cable unit according to claim 1, wherein the other end of the spring member is elastically pressed into contact with an electrode formed on the surface of the electronic circuit board to be electrically connected to the electrode. A coaxial cable unit for transmitting signals,
A coaxial cable having a ground layer and a signal line surrounded by the ground layer;
A mold provided on at least one end of the coaxial cable;
A press-fit pin derived from the mold, and
The press fit pin is
A press-fit pin for ground electrically connected to the ground layer;
And a signal press-fit pin electrically connected to the signal line.   The coaxial cable unit according to any one of claims 1 to 4, further comprising closing means for closing a through hole into which the press fit pin is inserted.   The coaxial cable unit according to claim 5, wherein the closing means includes a convex portion formed by raising a part of the mold. A socket board with a socket on which electronic components are electrically contacted;
A performance board electrically connected to a tester for testing the electronic component;
A device interface apparatus comprising: the coaxial cable unit according to claim 1, which electrically connects the socket board and the performance board. A device interface apparatus according to claim 7;
A test head that is mounted with the device interface device and that exchanges electrical signals with the electronic component;
An electronic component testing apparatus comprising: a tester that executes a test of the electronic component via the test head. A coaxial cable unit for transmitting signals,
A single or a plurality of coaxial cables having a ground layer and a signal line surrounded by the ground layer;
A mold provided at at least one end of the single or plural coaxial cables;
A press-fit pin that is derived from the mold and press-fitted into the through hole of the electronic circuit board,
The press-fit pin has a structure in which the press-fit pin is directly connected on the circumference of the ground layer of the coaxial cable, and the signal line is exposed from the mold so that a coaxial structure mismatch distance is minimized. A coaxial cable unit comprising a signal terminal to be led out. A coaxial cable unit for transmitting signals,
A coaxial cable having a ground layer and a signal line surrounded by the ground layer;
A mold provided on at least one end of the coaxial cable;
Derived from the mold, and press-fit pins that are press-fitted into the through holes of the electronic circuit board,
The press-fit pin has a structure in which the press-fit pin is directly connected to the circumference of the ground layer of the coaxial cable, and the end portion of the signal line of the coaxial cable has a minimum coaxial structure mismatch distance. A coaxial cable unit comprising a signal press-fit pin for connecting a press-fit pin to the cable.   The coaxial cable unit according to claim 9 or 10, further comprising a closing unit that closes the through hole between the through hole of the electronic circuit board and the mold.

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