JPWO2006070649A1 - Pattern forming method and electronic circuit - Google Patents

Abstract

An object of the present invention is to provide a pattern forming method capable of forming a pattern such as an electronic circuit with a small number of steps without using an etching solution exhibiting strong acidity or strong alkalinity. In the pattern forming method of the present invention, an antireflection layer (13) and a thin film layer (14) are sequentially formed on one main surface of a transparent substrate (10), and the antireflection layer (13) and the thin film layer ( 14) and a laminate forming step for forming a laminate (15), and a laminate for forming an opening in the laminate (15) by irradiating the laminate (15) with a first laser beam (L1). A body opening forming step.

Description

  The present invention relates to a method for forming a pattern provided in an electronic circuit, and an electronic circuit such as a plasma display substrate.

A plasma display panel (hereinafter also referred to as “PDP”) can be reduced in thickness, can be easily increased in size, and has features such as light weight and high resolution. Therefore, it is attracting attention as a promising candidate for replacing a CRT as a display device. Has been.
PDPs are roughly classified into DC type and AC type, and the operation principle is based on the light emission phenomenon accompanying gas discharge. For example, in the AC type, as shown in FIG. 15, a cell space is defined by partition walls 3 formed between a transparent front substrate 1 and a rear substrate 2 arranged so as to face each other. Encloses a Penning mixed gas such as He + Xe, Ne + Xe and the like that has low visible light emission and high ultraviolet light emission efficiency. Then, plasma discharge is generated in the cell, and the phosphor layer 9A on the inner wall of the cell is caused to emit light to form an image on the display screen.

  The PDP is generally provided on the front substrate 1 with a display electrode 5 for generating plasma discharge, and a bus electrode 6 provided on a part of the display electrode 5 to reduce the resistance of the display electrode 5. The dielectric layer 8 and the MgO layer 9 that prevent the display electrode 5 and the bus electrode 6 from being eroded by plasma and coming into contact with the electrodes formed on the back substrate 2, and if necessary, It has a plasma display substrate provided with black stripes 4 that reduce reflection of external light. Further, an address electrode 7 for writing information is provided on the back substrate 2.

When manufacturing this PDP, after forming the display electrode 5 on the front substrate 1 using a transparent conductive material, the bus electrode 6 is formed on a part of the display electrode 5 using a conductive material. When the black stripe 4 is provided, the black stripe 4 is further formed.
Next, the dielectric layer 8 and the MgO layer 9 are formed (see Patent Document 1, Non-Patent Document 1, and Non-Patent Document 2).

  By the way, when forming the display electrode 5, the bus electrode 6, etc., the thin layer formed of the conductive material is processed into a predetermined shape. As a method for processing the shape of the thin layer, wet etching using a resist is employed.

However, the thin layer processing by wet etching first forms a resist layer on the thin layer, then exposes and develops the resist layer to form openings in the resist layer, and then uses an etching solution. Many steps are required to be done by etching the thin layer exposed in the opening and finally stripping the resist layer.
Further, since wet etching is performed every time each member such as the display electrode 5 and the bus electrode 6 is formed, the wet etching is performed a plurality of times when one PDP is manufactured.

  Therefore, when the thin film is processed into a predetermined shape by wet etching, the number of steps required for manufacturing the PDP becomes enormous. When the number of steps is large, the number of operations required for manufacturing increases, resulting in inconveniences such as an increase in complicated operations and an increase in cost.

Further, it has been proposed to form the black stripe 4 on the front substrate 1 in order to further improve the contrast and make the image clearer.
However, the black stripe 4 is formed in a separate process from the display electrode 5 and the bus electrode 6. Also, when the black stripe 4 is formed, it is necessary to obtain a predetermined shape by wet etching. Therefore, the number of steps required for manufacturing the PDP further increases by forming the black stripe 4.

  Moreover, since the etching solution used for wet etching exhibits strong acidity and strong alkalinity, for example, if it is discarded as it is, it has problems such as a large environmental load and is difficult to handle. Therefore, when wet etching is performed when manufacturing a PDP, it becomes necessary to perform complicated operations associated with the handling of the etching solution, and the number of steps required for manufacturing further increases.

Furthermore, the wet etching is also used when a pattern of an electronic circuit other than the above-described PDP is formed.
In recent years, the pattern of electronic circuits has become more complex in order to cope with a rapidly advanced information society. Therefore, as the pattern becomes more complicated, the number of processes by performing wet etching is greatly increased even when an electronic circuit is manufactured, and there are inconveniences such as an increase in complicated operations as described above and an increase in cost. Arise.
JP-A-7-65727 Tatsuo Uchida and Hiraki Uchiike, “Flat Panel Display Dictionary”, Industrial Research Committee, December 25, 2001, p. 583-585 Takeshi Okumura, “Flat Panel Display 2004 Practice”, Nikkei Business Publications, p. 176-183

  The present invention has been proposed in view of the conventional situation described above, and provides a pattern forming method capable of reducing the number of steps and reducing the cost without performing wet etching. Objective. Moreover, it aims at providing an electronic circuit provided with the pattern formed by this formation method.

  In order to solve the above-described problems, the present invention provides a pattern forming method shown in the following (1) to (12), electrodes and / or black stripes formed thereby, and an electronic device using the same Is to provide.

(1) A laminated body forming step of sequentially forming an antireflection layer and a thin film layer on one main surface of the transparent substrate to form a laminated body composed of the antireflection layer and the previous thin film layer; A pattern forming method comprising: a laminated body opening forming step of irradiating a first laser beam to form an opening in the laminated body.

(2) The antireflection layer includes the first antireflection layer containing chromium oxide and / or titanium oxide, and the second antireflection layer containing metal chromium and / or metal titanium (1). The pattern forming method according to 1.

(3) The pattern forming method according to (1) or (2), wherein the first laser beam has a wavelength of 500 to 1500 nm and an energy density of ² to 40 J / cm ² .

(4) A transparent layer forming step for forming a transparent layer on the one main surface of the transparent substrate, and a second laser on the transparent layer, following the transparent layer forming step. The pattern formation method in any one of said (1)-(3) provided with the transparent layer opening part formation process which irradiates light and forms an opening part in the said transparent layer.
(5) Subsequent to the transparent layer forming step, a transparent layer forming step of forming a transparent layer on the one main surface of the transparent substrate, and a step of forming the transparent layer on the transparent layer. The pattern formation method in any one of said (1)-(3) provided with the transparent layer opening part formation process of irradiating 2 laser beams and forming an opening part in the said transparent layer.

(6) The pattern forming method according to (4) or (5), wherein the second laser beam has a wavelength of 500 to 1500 nm and an energy density of ² to 40 J / cm ² .

(7) The pattern forming method according to any one of (1) to (6), further including a protective layer forming step of forming a protective layer after the thin film layer forming step.

(8) An electronic circuit formed by the pattern forming method according to any one of (1) to (7).

(9) An electronic device having the electronic circuit according to (8).

(10) A plasma display substrate comprising a pattern formed by the pattern forming method according to any one of (1) to (6) as an electrode for a plasma display substrate and / or a black stripe.
(11) A plasma display substrate comprising a pattern formed by the pattern forming method according to any one of (1) to (6) as an electrode for a plasma display substrate and a black stripe.

(12) On one main surface of the transparent substrate, a first antireflection layer made of chromium oxide and / or titanium oxide, a second antireflection layer made of metal chromium and / or metal titanium, and a thin film made of copper A plasma display substrate comprising a pattern having a layer as an electrode and / or a black stripe for the plasma display substrate.
(13) On one main surface of the transparent substrate, a first antireflection layer made of chromium oxide and / or titanium oxide, a second antireflection layer made of metal chromium and / or titanium, and a thin film made of copper A plasma display substrate comprising a pattern having a layer and a transparent layer as an electrode and / or a black stripe for the plasma display substrate.

(14) The plasma display substrate according to (12) or (13), wherein the electrode and / or the black stripe has a reflectance of visible light incident from the other main surface side of the transparent substrate of 50% or less.

(15) A plasma display panel comprising the plasma display substrate according to (12), (13) or (14).

  According to the present invention, since a laminate composed of an antireflection layer and a thin film layer, preferably a laminate containing a transparent layer can be patterned at once, a pattern can be formed with fewer steps than in the past. . Therefore, according to the present invention, an electronic circuit pattern and an electronic circuit can be efficiently manufactured at low cost.

  Further, according to the present invention, it is possible to form a pattern without performing wet etching. Therefore, according to the present invention, it is not necessary to use an etching solution exhibiting strong acidity or strong alkalinity, and therefore it is possible to reduce troublesome work caused by handling the etching solution when forming a pattern. Become. In addition, an increase in the number of processes due to wet etching can be avoided.

  In addition, when the pattern formed by the pattern forming method of the present invention is used for PDP applications, the plasma display substrate black stripe and the plasma display substrate electrode (display electrode and bus electrode) are simultaneously formed by the pattern forming method of the present invention. Can be formed. In addition, by forming an antireflection layer between the plasma display substrate electrode and / or the plasma display substrate black stripe and the substrate, it is possible to prevent the electrode or black stripe from being projected when displaying an image as a PDP. it can.

  In addition, when forming a transparent layer before the layered body forming step or after the layered body opening forming step, a black stripe for a plasma display substrate and a plasma display using the transparent layer as a transparent electrode and the thin film layer as a bus electrode The substrate electrode can be formed simultaneously.

1A to 1F are schematic sectional views showing a pattern forming method of the present invention. FIG. 2 is a cross-sectional view showing a state in which a protective layer is formed on the thin film layer. FIG. 3 is a schematic plan view of a substrate having electrodes for plasma display substrates and / or black stripes formed according to a preferred embodiment of the method for forming electrodes and / or black stripes for plasma display substrates of the present invention. 4 is a schematic cross-sectional view taken along line A-A ′ of the substrate shown in FIG. 3. 5A to 5D are schematic views showing a transparent layer forming step and a transparent layer opening forming step in the pattern forming method of the present invention. FIGS. 6E to 6I are schematic views showing a laminated body forming step and a laminated body opening forming step in the pattern forming method of the present invention. FIG. 7 is a schematic plan view of an electrode for a plasma display substrate having a transparent layer and / or a substrate having an electrode for a plasma display substrate and / or a black stripe formed by a method for forming a black stripe. FIG. 8 is a schematic sectional view taken along line B-B ′ of the substrate shown in FIG. 7. 9 is a schematic cross-sectional view taken along line B-B ′ of another embodiment of the substrate shown in FIG. 7. FIGS. 10A to 10C are schematic views showing a layered body forming step in the steps of forming electrodes for plasma display substrates and / or black stripes in Example 1. FIG. FIGS. 11D to 11F are schematic views showing a laminated body opening forming step in the plasma display substrate electrode and / or black stripe forming step in the first embodiment. 12A to 12C are schematic views showing a transparent layer forming step and a transparent layer opening forming step in the steps of forming the electrode for the plasma display substrate and / or the black stripe in Example 2. FIG. . FIGS. 13D to 13F are cross-sectional views illustrating a laminated body forming process in the plasma display substrate electrode and / or black stripe forming process of the second embodiment. FIGS. 14G and 14H are cross-sectional views showing a laminated body opening forming step in the plasma display substrate electrode and / or black stripe forming step in the second embodiment. FIG. 15 is a schematic diagram showing a schematic configuration of a conventional PDP.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Front substrate 2 Rear substrate 3 Partition 4 Black stripe 5 Display electrode 6 Bus electrode 7 Address electrode 8 Dielectric layer 9 MgO layer 9A Phosphor layer 10 Transparent substrate 11 First antireflection layer 12 Second antireflection layer 13 Antireflection layer DESCRIPTION OF SYMBOLS 14 Thin film layer 15 Laminated body 16 Photomask 17 Protective layer 30 Electrode and / or black stripe 31 Black stripe 32 electrode (bus electrode and display electrode) for plasma display substrates
DESCRIPTION OF SYMBOLS 50 Transparent layer 51 Photomask 52 Photomask 60 Electrode for plasma display substrate and / or black stripe 61 Black stripe 62 Display electrode 63 Bus electrode 70 Glass substrate 80 Sputter deposition apparatus 82 First antireflection layer 84 Second antireflection layer 86 Thin film layer 87 Laminated body 88 Protective layer 89 Photomask 90 Glass substrate 91 Transparent layer 92 Photomask 93 First antireflection layer 94 Second antireflection layer 95 Thin film layer 96 Laminate 97 Photomask

  Hereinafter, the present invention will be described in detail. The following description is an example of the present invention, and the present invention is not limited to this.

In the pattern forming method of the present invention, first, the antireflection layer 13 including the first antireflection layer 11 and the second antireflection layer 12 and the thin film layer 14 are sequentially formed on one main surface of the transparent substrate 10. Thereby, the laminated body 15 is formed (FIG. 1 (A)-(D): Laminated body formation process).
Next, the laminated body 15 is irradiated with the first laser light L1 through the photomask 16 to form an opening, and the laminated body 15 is processed into a predetermined shape (FIGS. 1E and 1F). : Laminate opening forming step).

  By such a forming step, the laminated body 15 including the antireflection layer 13 including the first antireflection layer 11 and the second antireflection layer 12 and the thin film layer 14 is patterned on the one main surface of the transparent substrate 10. Pattern can be formed.

<Transparent substrate>
The transparent substrate 10 is not particularly limited as long as it is formed using a transparent material (in the present invention, a material having a visible light transmittance of 80% or more as defined in JIS R3106 (1998)). A specific example of the transparent substrate 10 is preferably a glass substrate. In particular, a glass substrate having a thickness of 0.7 to 3 mm used as a glass substrate for PDP is preferable.

  In the present invention, of both main surfaces of the transparent substrate 10, the main surface on the side where the first antireflection layer 11, the second antireflection layer 12, the thin film layer 14 and the like are formed is referred to as one main surface. The main surface on which the first antireflection layer 11, the second antireflection layer 12, the thin film layer 14 and the like are not formed is referred to as the other main surface.

<Laminated body formation process>
In the laminated body forming step, an antireflection layer 13 including a first antireflection layer 11 and a second antireflection layer 12 is formed on one main surface of the transparent substrate 10, and a thin film layer 14 is further formed. Form body 15.

<Antireflection layer>
The antireflection layer 13 includes a first antireflection layer 11 formed on one main surface of the transparent substrate 10 and a second antireflection layer 12 formed on the upper surface thereof. Due to such a structure, the antireflection layer 13 has a low reflectance of visible light because the reflected light from each layer interferes with each other, and when an image is displayed as a PDP, electrodes and black stripes are not formed. It is possible to avoid being displayed in the image.

<First antireflection layer>
In the present invention, the material of the first antireflection layer 11 preferably contains chromium oxide and / or titanium oxide. In particular, the material of the first antireflection layer 11 is preferably chromium oxide because it is highly durable, can prevent oxidation of Cu, which is a material of the electrode, and easily exhibits reflection performance. In terms of antireflection performance, the chromium oxide and / or titanium oxide is preferably contained in an amount of 95% by mass or more with respect to the entire material forming the first antireflection layer 11.

Here, the chromium oxide includes Cr ₂ O _{3 in} which oxygen is not deficient, oxygen deficient CrO _x (1.0 ≦ X <1.5), and the like. It is particularly preferable that the chromium oxide is oxygen-deficient CrO _X (1.0 ≦ X <1.5) because the reflection characteristics are good.
In addition, the titanium oxide includes TiO ₂ that is not deficient in oxygen, oxygen deficient TiO _x (1.0 ≦ X <2.0), and the like. It is particularly preferable that the titanium oxide is oxygen deficient TiO _X (1.0 ≦ X <2.0) because the reflection characteristics are good.

The first antireflection layer 11 may further contain carbon, nitrogen, or the like. In particular, by adding carbon and / or nitrogen to the material forming the first antireflection layer 11, the extinction coefficient and the refractive index of the film can be finely adjusted, so that the optical characteristics of the second antireflection layer 32 are matched. Therefore, it is preferable in that the antireflection characteristics in the visible wavelength region to the laser wavelength range used in the present invention can be easily improved. When the chromium oxide contains nitrogen, this chromium oxynitride film has a composition of 0.3 ≦ Y ≦ 0.55 and 0.03 ≦ when expressed as Cr _1-Y—Z O _Y N _Z It is preferable that Z ≦ 0.2, and the chromium oxide includes such nitrogen-containing chromium oxide.

  In the present invention, the thickness of the first antireflection layer 11 is preferably 30 to 100 nm. When the thickness of the first antireflection layer 11 is within this range, it is preferable that antireflection performance is improved by utilizing interference of reflected light. 30 to 70 nm is particularly preferable. The thickness of the first antireflection layer 11 may be appropriately adjusted in the range of 30 to 100 nm from the refractive index and extinction coefficient of the film.

Moreover, it is preferable that the 1st antireflection film 11 is substantially transparent, and it is preferable that the refractive index in wavelength 550nm is 1.9-2.8, and it is 1.9-2.4. Is more preferable. If it exists in this range, it is preferable at the point which can make an antireflection characteristic favorable. The term “substantially transparent” means that the extinction coefficient is 1.5 or less, more preferably 0.7 or less, whereby sufficient light interference can be generated.
Further, the first antireflection film 11 may have a structure in which a plurality of films are stacked. Specifically, a laminate in which chromium oxide and chromium nitride are sequentially laminated from the substrate is exemplified.

<Second antireflection layer>
The second antireflection layer 12 preferably contains metal chromium (hereinafter also referred to as Cr) and / or metal titanium (hereinafter also referred to as Ti). In particular, the material of the second antireflection layer 12 is preferably Cr because it is highly durable, can prevent oxidation of Cu as a material of the electrode, and easily exhibits reflection performance. In terms of antireflection performance, it is preferable that Cr and / or Ti is contained in a total amount of 95% by mass or more with respect to the entire material forming the second antireflection layer 12.
The second antireflection layer 12 may further contain carbon, nitrogen, or the like. In particular, by adding carbon and / or nitrogen to the material forming the second antireflection layer 12, the extinction coefficient and the refractive index of the film can be finely adjusted, so that the optical characteristics of the first antireflection layer 11 are matched. Therefore, it is preferable in that the antireflection performance can be easily made good in the laser wavelength range used in the present invention from the visible range.

  The second antireflection layer 12 in the present invention preferably has a low light transmittance and is substantially opaque in the visible light region. In order to make it substantially opaque, the visible light transmittance may be 0.0001 to 0.1%. Specifically, the thickness of the second antireflection layer 12 is preferably 10 to 200 nm, particularly preferably 20 to 100 nm.

The first antireflection layer 11 and the second antireflection layer 12 in the present invention are formed by a sputtering method or a vapor deposition method. When the Cr layer as the second antireflection layer 12 is formed by sputtering, sputtering may be performed using a Cr target in an inert atmosphere such as Ar. The same applies when forming a Ti layer. Here, N ₂ , CH _4, or the like may be mixed with Ar or the like for sputtering.

Further, in order to form the chromium oxide layer of the first antireflection layer 11, it is possible to use a chromium oxide target in addition to a method of performing sputtering in an atmosphere containing oxygen using a Cr target. The same applies when the titanium oxide layer is formed. Here, N ₂ , CH ₄ , CO ₂ or the like may be mixed with Ar or the like for sputtering.

  In order for the first antireflection layer 11 and the second antireflection layer 12 formed on the transparent substrate 10 to have the above thickness, the film formation time by sputtering, vapor deposition or the like is controlled. It can be adjusted.

  The pattern widths of the first antireflection layer 11 and the second antireflection layer 12 formed on the transparent substrate 10 are preferably determined in consideration of the balance between target contrast and luminance. If it is too thick, the light itself emitted from the PDP is blocked and sufficient luminance cannot be secured.

  The antireflection layer forming step of the method for forming electrodes and / or black stripes for the plasma display substrate of the present invention is to form the first antireflection layer 11 and the second antireflection layer 12 described above. It is not limited. In addition to these two layers, one or more layers may be formed.

<Thin film layer>
The thin film layer forming material for forming the thin film layer 14 is not particularly limited as long as it functions as an electrode. For example, copper, silver, aluminum, gold or the like can be used. Among these, it is preferable to use copper which has high conductivity and is inexpensive as a material.

The thin film layer 14 is formed by a sputtering method, a vapor deposition method, or the like, using the thin film layer forming material described above, similarly to the first antireflection layer 11 and the second antireflection layer 12.
Further, the thickness of the thin film layer 14 can be adjusted by controlling the film formation time by sputtering, vapor deposition, or the like, similarly to the first antireflection layer 11 and the second antireflection layer 12.
The thickness of the thin film layer 14 is preferably 0.5 to 3 μm, more preferably 0.5 to 2 μm, and further preferably 0.5 to 1.5 μm. Within the above range, the laminate 15 can be peeled from the transparent substrate 10 without being left on the transparent substrate 10 by irradiating the laminate 15 with the first laser light L1. Moreover, if it is 1.5 micrometers or less, the laminated body 15 can be more effectively peeled from the transparent substrate 10.
When the pattern formed by the forming method of the present invention is used for an electrode for a plasma display substrate and / or a black stripe, the thickness of the thin film layer 14 is 0.5 to 3 μm, particularly 0.5 to 2 μm. If it exists, it can avoid displaying on the image of PDP, maintaining the electroconductivity as a display electrode or a bus electrode, and it is preferable at the point of transparency.

<Laminated body opening forming step>
In the laminated body opening forming step, the first laser beam L1 is irradiated, and a predetermined region of the laminated body 15 formed on the one main surface of the transparent substrate 10 in the laminated body forming step is subjected to ablation and thermal energy. To form an opening in the laminate 15. As the first laser light L1, for example, excimer laser light or YAG laser light is used.

  The first laser beam L1 is applied to the stacked body 15 through the photomask 16. Thereby, the first laser beam L1 transmitted through the opening provided in the photomask 16 is irradiated to the stacked body 15, the region corresponding to the opening of the photomask 16 in the stacked body 15 is evaporated and removed, and the stacked body 15 is removed. Is processed according to the shape of the photomask 16. By this method, a pattern obtained by patterning the antireflection layer and the thin film layer can be formed.

The first laser beam L1 used for forming the opening in the laminate opening forming step preferably has a wavelength of 500 to 1500 nm and an energy density of 1.5 to 40 J / cm ² or ² to 40 J / cm ^2. In particular, it is preferably 1.5 to ²⁰ J / cm ² , more preferably 1.5 to 10 J / cm ² . The first laser light L1 may be a pulse or CW (continuous light). Specific examples of such laser light include YAG laser light having a wavelength of 1064 nm, YAG laser light having a wavelength of 532 nm, and the like. The energy density is the total energy density of the irradiated pulses when the number of laser pulses is plural, and so on.
By irradiating the laminated body 15 with such first laser light L1, the laminated body 15 does not remain on the surface of the transparent substrate 10 exposed to the opening with only a short irradiation, and the opening is reliably formed. be able to.

  In the present embodiment, the first antireflection layer 11, the second antireflection layer 12, and the thin film layer 14 are laminated on the transparent substrate 10 in this order. A layer may be formed.

  By the way, when the formed pattern is used as an electrode for a plasma display substrate and / or a black stripe for a plasma display, it may be covered with a dielectric. The resistance to the dielectric of the electrode and / or black stripe of the present invention is preferable because it is further improved by the following two methods.

  As shown in FIG. 2, the first method is to form a pattern including a protective layer forming step of forming the protective layer 17 after the step of forming the thin film layer. The protective layer 17 is preferably composed mainly of Cr and / or Ti, and specifically, preferably contains 95 mass% or more of Cr and / or Ti. As a result, the dielectric is not directly in contact with the thin film layer 14, so that the thin film layer 14 is less likely to be eroded.

The protective layer 17 is formed by a normal sputtering method or vapor deposition method, similarly to the first antireflection layer 11 and the second antireflection layer 12.
The thickness of the protective layer 17 is preferably 0.05 to 0.2 μm. With this thickness, the thin film layer 14 can be prevented or suppressed from being eroded by the dielectric. Similar to the first antireflection layer 11, the thickness of the protective layer 17 can be adjusted by controlling the film formation time by sputtering or vapor deposition.

The second method is a method in which the thin film layer 14 contains Cr and / or Ti. This is because Cr and Ti have high resistance to dielectrics. When Cr and / or Ti is contained in an amount of 5 to 15% by mass with respect to the entire material constituting the thin film layer 14, the thin film layer 14 has sufficient resistance to the dielectric and keeps conductivity. This is preferable.
The thin film layer 14 containing Cr and / or Ti is formed by sputtering or vapor deposition using the thin film layer forming material containing Cr and / or Ti.

  In addition to the first antireflection layer 11, the second antireflection layer 12, and the thin film layer 14, one or more other thin film layers may be formed. For example, before the formation of the first antireflection layer 11, between the formation of the first antireflection layer 11 and the formation of the second antireflection layer 12, or after the formation of the second antireflection layer 12, the one of the transparent substrates 10. Another thin film layer may be formed on the main surface side. For example, a transparent layer as described later may be provided.

  Next, the electrode for the plasma display substrate and / or the black stripe 30 provided with the black stripe 31 and the electrode 32 formed by the pattern forming method described above will be described with reference to FIGS. 4 shows a cross-sectional view taken along the line A-A 'of the substrate shown in FIG. Note that the electrode 32 also serves as a display electrode and a bus electrode.

  As shown in FIG. 3, the electrode and / or black stripe 30 includes a black stripe 31 that is formed on one main surface of the transparent substrate 10 and reduces reflection of external light, and an electrode 32.

  As shown in FIG. 4, the black stripe 31 is formed from a laminate 15 including an antireflection layer 13 including a first antireflection layer 11 and a second antireflection layer 12, and a thin film layer 14. By forming the first antireflection layer 11 and the second antireflection layer 12, reflection of external light can be reduced.

As shown in FIG. 4, the electrode 32 is formed from a laminate 15 including an antireflection layer 13 including a first antireflection layer 11 and a second antireflection layer 12, and a thin film layer 14. An electric current flows through the electrode 32 when the electrode and / or the black stripe 30 is attached to the PDP. When a current flows through the electrode 32, the plasma sealed in the corresponding position is discharged.
In addition, since the electrode 32 includes the first antireflection layer 11 and the second antireflection layer 12, similarly to the black stripe 31, the electrode 32 prevents reflection of visible light incident from the other main surface side of the transparent substrate 10. . For this reason, the electrode and / or the black stripe 30 of the present invention has a high effect of suppressing reflection of external light or the like. In addition, a clear image can be formed on the PDP using the electrode and / or the black stripe 30 of the present invention. That is, the electrode 32 has a function of both a display electrode and a bus electrode in the PDP.

  The reflectance of visible light incident from the other main surface side of the transparent substrate 10 is preferably 50% or less, more preferably 40% or less, and even more preferably 10% or less. By setting it to 50% or less, a clearer image is displayed on the PDP.

As described above, in the present invention, since a thin film is not processed by wet etching using a resist film, a pattern can be formed at a lower cost with a smaller number of forming steps.
Further, since an etching agent exhibiting strong acidity or strong alkalinity is not used, it is not necessary to perform a complicated operation required by handling the etching agent, and the number of steps required for pattern formation is reduced.
In addition, when the black stripe for the plasma display substrate is provided, since the black stripe and the electrode can be formed at the same time, the electrode for the plasma display substrate and / or the black stripe can be formed at a lower cost with a smaller number of forming steps. Can be formed. Here, the electrodes mean display electrodes and bus electrodes in the plasma display substrate. In the case of PDP, since the thin film layer also functions as a transparent electrode and a bus electrode, the process can be further shortened. Further, the number of steps can be further reduced by patterning the antireflection layer and the thin film layer together.
Moreover, this invention can form the electronic circuit provided with the pattern formed by the said pattern formation method, and the electronic device using the said electronic circuit. Examples of the electronic circuit include a substrate with an electrode for LCD, a substrate with an electrode for organic EL, an electrode for a plasma display substrate, and / or a substrate with a black stripe (a front substrate and a rear substrate, particularly a front substrate). Examples of the electronic device include an LCD, an organic EL, and a PDP.
In addition, the plasma display back substrate provided with an address electrode can also be formed with the pattern formation method of this invention. Furthermore, a PDP can also be formed using this plasma display back substrate.

By the way, before forming the laminated body 15 on one main surface of the transparent substrate 10, first, the transparent layer 50 is formed as shown in FIGS. 5A and 5B (transparent layer forming step), and then. As shown in FIGS. 5C and 5D, the transparent layer 50 may be irradiated with the second laser light L2 through a photomask to form an opening (transparent layer opening forming step).
After forming the opening of the transparent layer, it is possible to go through the laminate forming step and the laminate opening forming step having the antireflection layer and the thin film layer as described above. Specifically, as shown in FIGS. 6E to 6G, after the laminated body 15 is formed on the transparent layer 50 in which the opening is formed, it is shown in FIGS. 6H and 6I. Thus, an opening is formed in the stacked body 15.

  By such a forming process, a pattern in which the transparent layer 50, the first antireflection layer 11, the second antireflection layer 12, and the thin film layer 14 are patterned is formed on one main surface of the transparent substrate 10. be able to.

<Transparent layer forming step>
In the transparent layer forming step, the transparent layer 50 is formed on the one main surface of the transparent substrate 10. The material used for forming the transparent layer 50 is not particularly limited as long as it is a conductive material having transparency, and a tin compound such as ITO (Indium Tin Oxide) or tin oxide (SnO ₂ ) can be used. . Among the tin compounds, from the viewpoint of prevention of erosion by the dielectric, it is preferred to use SnO _2, it is particularly preferable to use the SnO ₂ containing 2-8 wt% combined with Sb. The transparent layer preferably has a visible light transmittance of 80% or more as defined in JIS R3106 (1998).

The transparent layer 50 is formed by a sputtering method or a vapor deposition method. The thickness of the transparent layer 50 is preferably 0.1 to 3 μm, 0.1 to 1 μm, and particularly preferably 0.1 to 0.5 μm from the viewpoint of easy patterning. When using as an electrode, it is preferable that the thickness of the transparent layer 50 is 0.1-3 micrometers from the electroconductive point. In order for the transparent layer 50 to have the above thickness, it can be adjusted by controlling the film formation time by sputtering or vapor deposition.
When the transparent layer 50 is formed by sputtering, for example, sputtering is performed by mixing O ₂ or the like with Ar or the like using a transparent layer forming material such as ITO or SnO ₂ as a target.

<Transparent layer opening forming step>
In the transparent layer opening forming step, the second laser beam L2 is formed on the surface of the transparent substrate 10 in the transparent layer forming step by using, for example, excimer laser beam or YAG laser beam in combination with ablation and thermal energy. The transparent layer 50 is removed by evaporation to form an opening.

  The second laser light L2 is applied to the transparent layer 50 through the photomask 51. As a result, only the second laser light L <b> 2 that has passed through the opening provided in the photomask 51 is irradiated to the transparent layer 50, and the transparent layer 50 is processed according to the shape of the photomask 51.

In forming the opening in the transparent layer opening forming step, the second laser light L2 to be used preferably has a wavelength of 500 to 1500 nm, and an energy density of 1.5 to 40 J / cm ² or ² to 40 J / cm. ² , particularly 1.5 to 20 J / cm ² , more preferably 1.5 to 10 J / cm ² . The second laser light L2 may be a pulse or CW (continuous light).
Specific examples of such laser light include YAG laser light having a wavelength of 1064 nm, YAG laser light having a wavelength of 532 nm, and the like.
As shown in FIG. 6, when forming the transparent layer 50 before forming the laminated body 15, it is preferable that the wavelength of the 1st laser beam L1 is 500-1500 nm, and energy density is higher than 2nd laser beam L2. Preferably it is low. Specifically, the energy density of the first laser beam L1 is preferably 0.5 to ²⁰ J / cm ² , particularly preferably 1.0 to 5 J / cm ² .

  By irradiating the transparent layer 50 with such second laser light L2, the transparent layer 50 does not remain on the surface of the transparent substrate 10 exposed to the opening with only a very short time irradiation, so that the opening can be reliably formed. Can be formed.

  Next, the black stripe 61, the display electrode 62, the bus electrode 63, and the black stripe formed by the method for forming the electrode for the plasma display substrate and / or the black stripe described above with reference to FIGS. The electrode for the plasma display substrate including 61, the display electrode 62, and the bus electrode 63 and / or the black stripe 60 will be described. FIG. 8 is a sectional view taken along line B-B ′ of the substrate shown in FIG. 7.

  As shown in FIG. 7, the plasma display substrate electrode and / or the black stripe 60 is formed on the transparent substrate 10 with a black stripe 61 for reducing reflection of external light, a display electrode 62 through which a current flows, and a display. A bus electrode 63 that lowers the resistance value of the electrode 62 is formed.

  As shown in FIG. 8, the black stripe 61 is formed from a stacked body 15 including a first antireflection layer 11, a second antireflection layer 12, and a thin film layer 14. The black stripe 61 reduces the reflection of external light using interference between the reflected light of the first antireflection layer 11 and the reflected light of the second antireflection layer 12, and makes the image displayed on the PDP clearer. .

  The display electrode 62 is formed from the transparent layer 50. When the front substrate is mounted on the PDP, a current flows through the display electrode 62 and discharges the plasma sealed at the corresponding position.

The bus electrode 63 is formed from the transparent layer 50 and the laminated body 15 including the first antireflection layer 11, the second antireflection layer 12, and the thin film layer 14. The bus electrode 63 supplies a current to the display electrode 62 and reduces the resistance value of the display electrode 62.
Further, since the bus electrode 63 includes the first antireflection layer 11 and the second antireflection layer 12, the reflection of visible light incident from the other main surface side of the transparent substrate 10 is prevented similarly to the black stripe 61. Is done. A clear image can be displayed on the PDP.

In addition, as shown in FIG. 9, you may form the transparent layer 50 in the back | latter stage of a laminated body opening formation process. Here, FIG. 9 shows a cross-sectional view taken along the line BB ′ of the substrate of this embodiment among the substrates shown in FIG. By forming the transparent layer 50 after forming the laminate 15, the transparent layer 50 is preferable in that the laminate 15 can be protected. If an opening is formed in the transparent layer 50 by the method described above, the pattern shown in FIG. 9 can be formed. In particular, when SnO ₂ which is a material of the transparent electrode is used as the material of the transparent layer 50, the transparent layer 50 is formed on the laminate of the antireflection layer 13 and the thin film layer 14, so that the antireflection layer 13 is formed. And the thin film layer 14 are preferably protected by the transparent layer 50 and are not easily eroded by the dielectric. Further, since the antireflection layer / thin film layer is formed in contact with this order, the reflection characteristics become more effective and preferable. Moreover, when using the pattern of this invention as PDP, it is preferable at the point which can take the conduction | electrical_connection of a thin film layer and a transparent layer effectively.

  Even in the case of forming a transparent layer, the reflectance of visible light (specified in JIS-R3106 (1998)) incident from the other main surface side of the transparent substrate 10 in the electrode and / or black stripe is 50% or less. Preferably, it is 40% or less, more preferably 10% or less. By setting it to 50% or less, a clearer image is displayed on the PDP.

As described above, even when a transparent layer is formed, since the thin film is not processed by wet etching using a resist film, the electrode for the plasma display substrate can be manufactured at a lower cost with fewer forming steps. A black stripe can be formed. Here, the electrodes mean display electrodes and bus electrodes in the PDP. In the case of PDP, the transparent layer serves as a display electrode, and the thin film layer serves as a bus electrode.
In addition, when the black stripe for the plasma display substrate is provided, the black stripe for the plasma display substrate and the electrode for the plasma display substrate can be formed at the same time. Electrodes and / or black stripes can be formed. Further, the number of steps can be further reduced by patterning the antireflection layer and the thin film layer together.

In addition, since an etching agent exhibiting strong acidity or strong alkalinity is not used, there is no need to perform complicated operations required by handling the etching agent, and it is necessary for forming electrodes and / or black stripes for plasma display substrates. This reduces the number of processes.
Moreover, this invention can form the electronic circuit provided with the pattern formed by the said pattern formation method, and the electronic device using the said electronic circuit. Examples of the electronic circuit include a substrate with an electrode for LCD, a substrate with an electrode for organic EL, an electrode for a plasma display substrate, and / or a substrate with a black stripe (a front substrate and a rear substrate, particularly a front substrate). Examples of the electronic device include an LCD, an organic EL, and a PDP.

  EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example, this invention is not limited to these.

(Example 1)
A method for forming electrodes and / or black stripes for the plasma display substrate according to the first embodiment will be described with reference to FIGS.

  In Example 1, a metal Cr target (purity: 99.99% or more) is used as a material for forming the first antireflection layer, and a metal Cr target (purity: 99.99) as a material for forming the second antireflection layer. %), A metal Cu target (purity: 99.99% or more) is used as the thin film layer forming material.

  As shown in FIGS. 10 and 11, the method for forming electrodes and / or black stripes for the plasma display substrate according to Example 1 includes (1) Laminate formation step (FIG. 10), (2) Laminate opening formation. A process (FIG. 11) is provided.

First, the glass substrate 70 is mounted on the sputter film forming apparatus 80, and sputter film formation is performed using a metal chromium target in Ar + O ₂ gas, so that the extinction coefficient is zero on the one main surface of the glass substrate 70. .3 CrO _1.3 layer is formed (FIG. 10A), and sputtering is performed using a metal chromium target in Ar gas, thereby forming the first reflection layer. A second antireflection layer 84 made of a Cr layer having a visible light transmittance of 0.05% is formed on the prevention layer 82 (FIG. 10B). The thickness of the first antireflection layer 82 is about 50 nm, and the thickness of the second antireflection layer 84 is about 80 nm.

  Subsequently, a thin film layer 86 made of a Cu layer is formed on the second antireflection layer 84 by performing sputtering film formation using a metal copper target in Ar gas, thereby forming a stacked body 87 (FIG. 10). (C)). The thickness of the thin film layer 86 is about 1 μm.

  Next, a protective layer 88 made of a Cr layer is formed on the thin film layer 86 by sputtering using a metal chromium target in Ar gas (FIG. 11D). The thickness of the protective layer 88 is about 10 nm.

As a first laser beam, a YAG laser beam having a wavelength of 1064 nm and an energy density of 1.5 J / cm ² is irradiated from the other main surface side of the glass substrate 70 to the stacked body 87 and the protective layer 88 through the photomask 89. Then, an opening is formed in the stacked body 87 (FIGS. 11E and 11F).

  Through the above steps, electrodes and / or black stripes for plasma display substrates similar to those shown in FIGS. 3 and 4 can be formed with very few steps. In addition, the formed electrode and / or black stripe for the plasma display substrate is useful as a PDP.

(Example 2)
A method for forming electrodes and / or black stripes for a plasma display substrate according to Example 2 will be described with reference to FIGS.

In Example 2, SnO ₂ containing 5% by mass of Sb was used as the material for forming the transparent layer, and metal Cr (purity: 99.99% or more) was used as the material for forming the first antireflection layer. Metal Cr (purity: 99.99% or more) is used as the material for forming the antireflection layer, and metal Cu (purity: 99.99% or more) is used as the material for forming the thin film layer.

  As shown in FIGS. 12 to 14, the method for forming electrodes and / or black stripes for the plasma display substrate according to Example 2 is as follows: (1) Transparent layer forming step (FIG. 12A), (2) Transparent layer The opening forming step (FIGS. 12B and 12C), (3) Laminate forming step (FIG. 13), and (4) Laminate opening forming step (FIG. 14) are provided.

First, the transparent substrate 91 is formed by mounting the glass substrate 90 on the sputter deposition apparatus 80 and performing sputter deposition using SnO ₂ containing 5% by mass of Sb as a target. (FIG. 12 (A)). The thickness of the transparent layer 91 is about 0.2 μm.

Next, as the second laser beam, a YAG laser beam having a wavelength of 1064 nm and an energy density of 2.5 J / cm ² is irradiated from the other main surface side of the glass substrate 90 to the transparent layer 91 through the photomask 92, Openings are formed in the transparent layer 91 (FIGS. 12B and 12C).

Next, by using the same sputter deposition apparatus 80 and performing sputter deposition using a metal chromium target in Ar + O ₂ gas, a CrO _1.3 layer having an extinction coefficient of 0.3 is formed on the transparent layer 91. The first antireflection layer 93 made of (FIG. 13D) is formed, and further, sputter film formation is performed using a metal chromium target in Ar gas, whereby visible light is transmitted over the first antireflection layer 93. A second antireflection layer 94 made of a Cr layer having a rate of 0.05% is formed (FIG. 13E). The thickness of the first antireflection layer 93 is about 50 nm, and the thickness of the second antireflection layer 94 is about 80 nm.

  Next, a thin film layer 95 made of a Cu layer is formed on the second antireflection layer 94 by performing sputter film formation using a metal copper target in Ar gas using the same sputter film formation apparatus 80. A body 96 is formed (FIG. 13F). The thickness of the thin film layer 95 is about 1 μm.

As a first laser beam, a YAG laser beam having a wavelength of 1064 nm and an energy density of ² J / cm ² is irradiated from the other main surface side of the glass substrate 70 to the stacked body 96 through the photomask 97, and the stacked body 96. An opening is formed in (FIGS. 14G and 14H).

  Through the above steps, electrodes and / or black stripes for a plasma display substrate similar to those shown in FIGS. 7 and 8 can be formed with a small number of steps. In addition, the formed electrode and / or black stripe for the plasma display substrate is useful as a PDP.

Although the present invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
This application is based on Japanese Patent Application No. 2004-376332 filed on Dec. 27, 2004, the contents of which are incorporated herein by reference.

According to the present invention, since a laminate composed of an antireflection layer and a thin film layer, preferably a laminate containing a transparent layer can be patterned at once, a pattern can be formed with fewer steps than in the past. . Therefore, according to the present invention, an electronic circuit pattern and an electronic circuit can be efficiently manufactured at low cost.

Claims (15)

A laminate forming step of sequentially forming an antireflection layer and a thin film layer on one main surface of the transparent substrate, and forming a laminate composed of the antireflection layer and the thin film layer;
A pattern forming method comprising: a stacked body opening forming step of irradiating the stacked body with a first laser beam to form an opening in the stacked body. The antireflection layer is
A first antireflective layer containing chromium oxide and / or titanium oxide;
The pattern formation method of Claim 1 provided with the 2nd antireflection layer containing metal chromium and / or metal titanium. The pattern forming method according to claim 1, wherein the first laser beam has a wavelength of 500 to 1500 nm and an energy density of ² to 40 J / cm ² . Before the layered product forming step,
A transparent layer forming step of forming a transparent layer on the one main surface of the transparent substrate;
The transparent layer opening part formation process of irradiating the said 2nd laser beam to the said transparent layer following the said transparent layer formation process, and forming the opening part in the said transparent layer is provided in any one of Claims 1-3. Pattern forming method. In the subsequent stage of the laminate opening forming step,
A transparent layer forming step of forming a transparent layer on the one main surface of the transparent substrate;
The transparent layer opening part formation process of irradiating the said 2nd laser beam to the said transparent layer following the said transparent layer formation process, and forming the opening part in the said transparent layer is provided in any one of Claims 1-3. Pattern forming method. 6. The pattern forming method according to claim 4, wherein the second laser light has a wavelength of 500 to 1500 nm and an energy density of ² to 40 J / cm ² .   The pattern formation method in any one of Claims 1-6 provided with the protective layer formation process which forms a protective layer in the back | latter stage of the said thin film layer formation process.   An electronic circuit formed by the pattern forming method according to claim 1.   An electronic device having the electronic circuit according to claim 8.   A plasma display substrate comprising a pattern formed by the pattern forming method according to claim 1 as an electrode and / or a black stripe.   A plasma display substrate comprising a pattern formed by the pattern forming method according to claim 1 as an electrode and a black stripe. On one main surface of the transparent substrate,
A first antireflection layer made of chromium oxide and / or titanium oxide;
A second antireflection layer made of metallic chromium and / or metallic titanium;
A plasma display substrate comprising a pattern having a thin film layer made of copper as an electrode and / or a black stripe. On one main surface of the transparent substrate,
A first antireflection layer made of chromium oxide and / or titanium oxide;
A second antireflection layer made of metallic chromium and / or metallic titanium;
A thin film layer made of copper;
A plasma display substrate comprising a pattern having a transparent layer as an electrode and / or a black stripe.   The plasma display substrate according to claim 12 or 13, wherein the electrode and / or the black stripe has a reflectance of 50% or less of visible light incident from the other main surface side of the transparent substrate.   A plasma display panel comprising the plasma display substrate according to claim 13, 14 or 15.

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