JPS649755B2 - - Google Patents
Info
- Publication number
- JPS649755B2 JPS649755B2 JP20767381A JP20767381A JPS649755B2 JP S649755 B2 JPS649755 B2 JP S649755B2 JP 20767381 A JP20767381 A JP 20767381A JP 20767381 A JP20767381 A JP 20767381A JP S649755 B2 JPS649755 B2 JP S649755B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- flexible printed
- lead wire
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【発明の詳細な説明】
本発明は、フレキシブルプリント基板へ実装さ
れる発光ダイオード等のリード線を有する部品の
取付方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for attaching components having lead wires, such as light emitting diodes, to be mounted on a flexible printed circuit board.
従来、例えば発光ダイオードのようにリード線
を有する部品を半田付固定する際には、プリント
基板からの高さや振れを規制するために部品のリ
ード線にスペーサーを挿入し、部品本体とプリン
ト基板の間に前記スペーサを介在させることによ
り高さ等の位置規制を行つていた。しかしながら
プリント基板がフレキシブルプリント基板の場合
その可撓性のため保持するスペーサがゆがんで確
実な位置規制が行なわれないこと、またフレキシ
ブルプリント基板上の狭いスペース内に大きいス
ペーサを取り付けることが非合理的であり、実装
密度が低下する等の欠点があつた。 Conventionally, when fixing parts with lead wires, such as light emitting diodes, by soldering, spacers are inserted into the lead wires of the parts in order to control the height and deflection from the printed circuit board. By interposing the spacer in between, positional regulation such as height was performed. However, if the printed circuit board is a flexible printed circuit board, the spacers it holds may be distorted due to its flexibility, making it impossible to securely control the position, and it is also irrational to install large spacers in a narrow space on the flexible printed circuit board. However, there were drawbacks such as lower packaging density.
本発明はリード線を有する部品をフレキシブル
プリント基板に取り付ける場合に有効であり、限
られたスペース内を合理的に利用し、確実な取付
ができる部品の取付方法を提供するものである。 The present invention is effective when attaching components having lead wires to a flexible printed circuit board, and provides a method for attaching components that can rationally utilize a limited space and ensure reliable attachment.
以下本発明の一実施例を図面を参照して説明す
る。第１図において１は電気回路を構成するフレ
キシブルプリント基板、２，３はフレキシブルプ
リント基板１に実装される電解コンデンサ等の電
気部品、４，５は他の電気部品、６はリード付部
品で、ここでは発光ダイオードである。電気部品
２と３の間隔Ｔは発光ダイオード６のリード線７
（幅ｔ）が挾持できるような間隔に配されており、
かつこの電気部品２と３は等しい高さである。発
光ダイオード６を電気部品２と３のあいだに挿入
することにより、高さ方向については発光ダイオ
ード６の発光部底面を電気部品２，３の天面へ当
接することにより規制でき、振れについてはリー
ド線７が挾持されることにより規制できる。 An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 1 is a flexible printed circuit board that constitutes an electric circuit, 2 and 3 are electrical parts such as electrolytic capacitors mounted on the flexible printed board 1, 4 and 5 are other electrical parts, and 6 is a leaded part. Here it is a light emitting diode. The distance T between the electrical components 2 and 3 is the lead wire 7 of the light emitting diode 6.
(width t) are arranged at such intervals that they can be held.
Moreover, the electrical components 2 and 3 have the same height. By inserting the light emitting diode 6 between the electrical components 2 and 3, the height direction can be controlled by bringing the bottom surface of the light emitting part of the light emitting diode 6 into contact with the top surface of the electrical components 2 and 3, and the deflection can be controlled by the lead. It can be regulated by clamping the wire 7.
この状態で第２図に示すように電気部品２，
３，４，５および発光ダイオード６をデイツプ等
によりこれらの部品は基板１に固定される。さら
に、フレキシブルプリント基板１に上記の各部品
を半田付８，９，１０，１１，１２により固定し
たあとフレキシブルプリント基板１を矢印で示す
ように１′へ折り曲げることにより発光ダイオー
ド６と電気部品２，３とを外すこと（仮保持状態
の解除）ができる。 In this state, as shown in FIG.
3, 4, 5 and the light emitting diode 6 are fixed to the substrate 1 by dips or the like. Furthermore, after fixing each of the above components to the flexible printed circuit board 1 by soldering 8, 9, 10, 11, and 12, the flexible printed circuit board 1 is bent to 1' as shown by the arrow, and the light emitting diode 6 and the electric component 2 are attached. , 3 can be removed (release of temporary holding state).
第３図において、１３はキヤビネツト、１４は
発光ダイオード６の先端が挿通するキヤビネツト
の穴１５の近くのキヤビネツト内面に設けられ、
発光ダイオード６が後方から挿入されることによ
り押広げられ発光ダイオード６が所定の位置まで
挿入されると閉じる可撓性をもつた係止部を有す
る保持部である。そしてフレキシブルプリント基
板１を折り曲げることにより仮保持状態を外され
た発光ダイオード６は、キヤビネツト１３に設け
られた保持部１４に係止されることにより再び保
持することができる。この構成では仮保持状態の
時に若干の振れが発生していてもキヤビネツト１
３への取付けに際してフレキシブルプリント基板
がその誤差分だけ変形するため、この誤差を吸収
して取付けることが可能である。 In FIG. 3, 13 is a cabinet, 14 is provided on the inner surface of the cabinet near a hole 15 of the cabinet through which the tip of the light emitting diode 6 is inserted;
The holding portion has a flexible locking portion that is expanded when the light emitting diode 6 is inserted from the rear and closed when the light emitting diode 6 is inserted to a predetermined position. The light emitting diode 6, which has been released from the temporary holding state by bending the flexible printed circuit board 1, can be held again by being locked by a holding part 14 provided in the cabinet 13. With this configuration, even if slight vibration occurs during the temporary holding state, the cabinet 1
3, the flexible printed circuit board deforms by the amount of the error, so it is possible to absorb this error and install the flexible printed circuit board.
上記の実施例からも明らかなように本発明によ
ればリード線を挾持する間隔をあけてフレキシブ
ルプリント基板上に配置された一対の電気部品に
よつて部品を仮固定して半田付を行ない、このフ
レキシブルプリント基板を折り曲げて部品の仮保
持状態を解除し、部品キヤビネツトに保持させる
取付方法であるから、従来のようなスペーサを用
いることなく部品の高さ規制が行なえ、安価にし
て狭いプリント基板上の実装密度を向上させるこ
とができ、またキヤビネツトへの取付けにあたつ
ても、フレキシブルプリント基板の可撓性により
仮保持状態での取付誤差を吸収し、確実な取付け
が可能であるなど、構造上も簡素で、かつ取付け
作業も容易になる優れた部品の取付方法を提供で
きるものである。 As is clear from the above embodiments, according to the present invention, the components are temporarily fixed by a pair of electrical components placed on a flexible printed circuit board with a gap between them so as to sandwich the lead wires, and soldering is performed. Since this mounting method involves bending the flexible printed circuit board to release the temporarily held state of the component and holding it in the component cabinet, the height of the component can be regulated without using conventional spacers, making it possible to reduce the cost and fit narrow printed circuit boards. The mounting density on the board can be improved, and when installing it into the cabinet, the flexibility of the flexible printed circuit board absorbs installation errors when temporarily held, allowing for reliable installation. It is possible to provide an excellent component mounting method that is structurally simple and easy to install.
図面は本発明の一実施例における取付方法の各
工程を説明するもので、第１図は部品配置と部品
挿入を示す斜視図、第２図は半田付固定とフレキ
シブルプリント基板の折曲げを示す側面図、第３
図はキヤビネツトへの取付状態を示す側面図であ
る。
１……フレキシブルプリント基板、２，３……
電気部品、６……発光ダイオード、７……リード
線、８，９，１０……半田付、１３……キヤビネ
ツト、１４……保持部。
The drawings are for explaining each step of the mounting method according to an embodiment of the present invention. Fig. 1 is a perspective view showing component arrangement and component insertion, and Fig. 2 shows soldering fixation and bending of the flexible printed circuit board. Side view, 3rd
The figure is a side view showing how it is attached to the cabinet. 1...Flexible printed circuit board, 2, 3...
Electrical parts, 6... Light emitting diode, 7... Lead wire, 8, 9, 10... Soldering, 13... Cabinet, 14... Holding section.
Claims (1)
けて、等しい高さの一対の電気部品をフレキシブ
ルプリント基板に配設し、前記一対の電気部品で
前記リード線を挾持することによりリード部品を
仮保持し、前記リード線をフレキシブルプリント
基板に半田付固定のあとこのフレキシブルプリン
ト基板を折り曲げて前記リード付部品の仮保持状
態を外し、キヤビネツトに設けられた保持部にリ
ード付部品を取り付けることを特徴とする部品の
取付方法。1. A pair of electrical components of equal height is placed on a flexible printed circuit board with a gap between them to hold the lead wire of the leaded component, and the lead wire is held between the pair of electrical components to temporarily hold the lead wire. After holding the lead wire and fixing the lead wire to a flexible printed circuit board by soldering, the flexible printed circuit board is bent to remove the temporary holding state of the leaded component, and the leaded component is attached to a holding part provided on the cabinet. How to install the parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56207673A JPS58107698A (en) | 1981-12-21 | 1981-12-21 | How to install parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56207673A JPS58107698A (en) | 1981-12-21 | 1981-12-21 | How to install parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58107698A JPS58107698A (en) | 1983-06-27 |
| JPS649755B2 true JPS649755B2 (en) | 1989-02-20 |
Family
ID=16543665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56207673A Granted JPS58107698A (en) | 1981-12-21 | 1981-12-21 | How to install parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58107698A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60161390U (en) * | 1984-04-03 | 1985-10-26 | 澤藤電機株式会社 | display device |
-
1981
- 1981-12-21 JP JP56207673A patent/JPS58107698A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58107698A (en) | 1983-06-27 |
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