JPS649733B2 - - Google Patents

Info

Publication number
JPS649733B2
JPS649733B2 JP57097674A JP9767482A JPS649733B2 JP S649733 B2 JPS649733 B2 JP S649733B2 JP 57097674 A JP57097674 A JP 57097674A JP 9767482 A JP9767482 A JP 9767482A JP S649733 B2 JPS649733 B2 JP S649733B2
Authority
JP
Japan
Prior art keywords
electrode
wafer
guide
processed
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57097674A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58215057A (ja
Inventor
Kenji Matsura
Seiichi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57097674A priority Critical patent/JPS58215057A/ja
Publication of JPS58215057A publication Critical patent/JPS58215057A/ja
Publication of JPS649733B2 publication Critical patent/JPS649733B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W99/00—

Landscapes

  • Wire Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
JP57097674A 1982-06-09 1982-06-09 バンプ形成装置 Granted JPS58215057A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57097674A JPS58215057A (ja) 1982-06-09 1982-06-09 バンプ形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57097674A JPS58215057A (ja) 1982-06-09 1982-06-09 バンプ形成装置

Publications (2)

Publication Number Publication Date
JPS58215057A JPS58215057A (ja) 1983-12-14
JPS649733B2 true JPS649733B2 (cg-RX-API-DMAC10.html) 1989-02-20

Family

ID=14198559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57097674A Granted JPS58215057A (ja) 1982-06-09 1982-06-09 バンプ形成装置

Country Status (1)

Country Link
JP (1) JPS58215057A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
US6022761A (en) * 1996-05-28 2000-02-08 Motorola, Inc. Method for coupling substrates and structure

Also Published As

Publication number Publication date
JPS58215057A (ja) 1983-12-14

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