JPS6489597A - Manufacture of multilayer printed wiring board - Google Patents
Manufacture of multilayer printed wiring boardInfo
- Publication number
- JPS6489597A JPS6489597A JP24689387A JP24689387A JPS6489597A JP S6489597 A JPS6489597 A JP S6489597A JP 24689387 A JP24689387 A JP 24689387A JP 24689387 A JP24689387 A JP 24689387A JP S6489597 A JPS6489597 A JP S6489597A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- wiring board
- printed wiring
- layer
- bored
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24689387A JPS6489597A (en) | 1987-09-30 | 1987-09-30 | Manufacture of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24689387A JPS6489597A (en) | 1987-09-30 | 1987-09-30 | Manufacture of multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6489597A true JPS6489597A (en) | 1989-04-04 |
| JPH0573360B2 JPH0573360B2 (enrdf_load_stackoverflow) | 1993-10-14 |
Family
ID=17155308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24689387A Granted JPS6489597A (en) | 1987-09-30 | 1987-09-30 | Manufacture of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6489597A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3166611B2 (ja) | 1996-04-19 | 2001-05-14 | 富士ゼロックス株式会社 | プリント配線板及びその製造方法 |
-
1987
- 1987-09-30 JP JP24689387A patent/JPS6489597A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0573360B2 (enrdf_load_stackoverflow) | 1993-10-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7151228B2 (en) | Laminating double-side circuit board, manufacturing method thereof, and multilayer printed circuit board using same | |
| US6320140B1 (en) | One-sided circuit board for multi-layer printed wiring board, multi-layer printed wiring board, and method of its production | |
| US6955849B2 (en) | Method and structure for small pitch z-axis electrical interconnections | |
| JP3705370B2 (ja) | 多層プリント配線板の製造方法 | |
| JP3738536B2 (ja) | プリント配線基板の製造方法 | |
| JPS6489597A (en) | Manufacture of multilayer printed wiring board | |
| JPH1187912A (ja) | 両面型配線板の製造方法 | |
| JPH1041635A (ja) | 多層プリント配線板用片面回路基板とその製造方法、および多層プリント配線板 | |
| JP3253886B2 (ja) | 多層プリント配線板用片面回路基板とその製造方法、および多層プリント配線板 | |
| JP2576194B2 (ja) | 金属複合積層板の製造方法 | |
| JPS6247199A (ja) | 多層回路板の製造方法 | |
| JPH01151293A (ja) | 多層プリント配線板の内層導通方法 | |
| JP2001144445A (ja) | 多層プリント配線板の製造方法 | |
| JPH01140698A (ja) | 多層印刷配線板の製造方法 | |
| JP2776202B2 (ja) | 超多層積層板の製造方法 | |
| JPS63153894A (ja) | 多層プリント配線板 | |
| JPH0720937Y2 (ja) | 複合回路基板 | |
| JPS601892A (ja) | 金属芯印刷配線基板の製造方法 | |
| JPS6459989A (en) | Manufacture of printed wiring board | |
| JPH0133959B2 (enrdf_load_stackoverflow) | ||
| JPH02122588A (ja) | 金属板ベースプリント配線板 | |
| JPH0521960A (ja) | 多層プリント配線板およびその製造方法 | |
| JPS6392093A (ja) | 多層配線板の製造方法 | |
| JPS6489587A (en) | Manufacture of printed wiring board | |
| TW334669B (en) | Process for producing multilayer printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |