JPS648806U

JPS648806U -

Info

Publication number: JPS648806U
Application number: JP10301287U
Authority: JP
Priority date: 1987-07-03
Filing date: 1987-07-03
Publication date: 1989-01-18
Anticipated expiration: 2002-07-03
Also published as: JPH0628805Y2

Description

[Brief explanation of drawings]

第１図は本考案の第一の実施例を示す斜視図、
第２図は第１図の実施例を分解して示す斜視図、
第３図ａは本考案の第二の実施例の平面図、第３
図ｂは本考案の第二の実施例の側面図、第４図は
従来の電力合成分配器の斜視図である。１……導体ベース、２……導体スペーサＡ、３
……導体スペーサＢ、４……導体スペーサＣ、５
……空気間隙、６……接地パターン、７……誘電
体基板、８……銅箔パターンＡ、９……銅箔パタ
ーンＢ、１０……マイクロストリツプ線路。 FIG. 1 is a perspective view showing a first embodiment of the present invention;
FIG. 2 is an exploded perspective view of the embodiment shown in FIG.
Figure 3a is a plan view of the second embodiment of the present invention;
FIG. b is a side view of the second embodiment of the present invention, and FIG. 4 is a perspective view of a conventional power combiner/distributor. 1...Conductor base, 2...Conductor spacer A, 3
...Conductor spacer B, 4...Conductor spacer C, 5
...Air gap, 6...Grounding pattern, 7...Dielectric substrate, 8...Copper foil pattern A, 9...Copper foil pattern B, 10...Microstrip line.

Claims

[Claims for Utility Model Registration] (1) Fixed on a conductor base, it is composed of microstrip lines on a dielectric substrate having a certain characteristic impedance, and functions as a synthesis and distribution path for high-frequency power. In the power combining/distributing device, a plurality of flat conductive spacers having different cutouts in some parts and having approximately the same outer diameter as the dielectric substrate are stacked and interposed between the dielectric substrate and the conductor base. A spatial gap having a thickness change determined by the shape of the cutout is formed below the microstrip line on the dielectric substrate, and the ground pattern formed on the lower surface of the dielectric substrate connects the conductor to the conductor. A power combining/distributing device characterized in that a spacer is removed corresponding to a notch, and a copper foil pattern is further formed on the dielectric substrate as the microstrip line. (2) Among the copper foil patterns, the air gap below the copper foil pattern to which electricity should be applied after combining or distributing high-frequency power is larger than the air gap below the copper foil pattern to which electricity should be applied before combining or distributing high-frequency power. The power combining/distributing device according to claim 1, characterized in that the plurality of conductive spacers are formed to have a thickness corresponding to the width of the copper foil pattern.