JPH0628805Y2 - Power combiner / distributor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a power combiner / distributor, and in particular, it is used as a combiner and distributor of high-frequency high-frequency power in a transmitter for TV and FM broadcasting, and is constituted by a microstrip line. The present invention relates to a tournament power distribution combiner.

[Conventional technology]

Conventionally, this type of power combiner / distributor has been shown in FIG.
Is formed as a microstrip line having a structure in which the dielectric substrate 7 having the ground pattern 6 formed on the back surface is fixed to the conductor base 1, and the copper foil pattern A8 constituting the microstrip line 10 is formed after the high frequency power is combined or distributed. The copper foil pattern B9 is used as the previous electric path and before or after the high frequency power is combined.

[Problems to be solved by the invention]

In the conventional power combiner / distributor described above, a method of increasing the thickness of the dielectric substrate to keep the characteristic impedance constant and widening the width of the microstrip line of the copper foil pattern is required in order to pass high power. It is used.

However, the thicker the dielectric substrate is, the more expensive it is, and thus the material cost of the dielectric substrate is high. Further, there is a drawback that the dielectric loss of the dielectric substrate becomes large, which results in a large transmission loss.

It is an object of the present invention to provide an inexpensive power combiner / distributor that eliminates the above-mentioned drawbacks, can increase the width of a copper foil pattern, and can reduce transmission loss.

[Means for solving problems]

The power combiner / distributor of the present invention comprises a microstrip line on a dielectric substrate fixed on a conductor base and having a certain characteristic impedance.
A tournament-type power combiner / distributor that functions as a combiner or distributor of high-power and high-frequency power in a broadcast transmitter, having partially different notches and having substantially the same plane dimensions as the dielectric substrate. A plurality of flat plate-like conductor spacers are interposed between the dielectric substrate and the conductor base in a laminated state to have a height determined by the shape of the notch below the dielectric substrate on which the microstrip line is arranged. A ground having an air gap having a change and removing a portion between the dielectric substrate and the plurality of conductor spacers facing the composite notch of the plurality of conductor spacers and having substantially the same plane dimension as the dielectric substrate. It has a structure in which a copper foil pattern is formed on the dielectric substrate as the microstrip line with a pattern interposed.

Further, in the power combiner / distributor of the present invention, the air gap below the copper foil pattern to be energized after combining high power and high frequency power of the copper foil pattern or before distribution is designed to combine high power and high frequency power. It has a structure including the plurality of conductor spacers formed such that the height thereof is larger than the air gap below the copper foil pattern to be energized before or after distribution, corresponding to the width of the copper foil pattern.

〔Example〕

The present invention will now be described in detail with reference to the drawings. FIG. 1 is a perspective view showing a first embodiment of the present invention, and FIG. 2 is an exploded perspective view showing the embodiment of FIG. The basic configuration of the present invention will be described below with reference to FIGS.

The conductor base 1 is the base of the power combiner / distributor of the present invention. The conductor base 1 is overlaid with conductor spacers A2 and conductor spacers B3, which are partially cut or punched, and the back surface of the dielectric substrate 7, that is, the above On the surface in contact with the conductor spacer B3, there is a ground pattern 6 in which the portions corresponding to the cut portions or punched portions of these two conductor spacers are removed, and the copper foil pattern A8 and the copper foil pattern 9 are provided on the surface.
This is a structure in which the dielectric substrates 7 in which are wired are further stacked.

The dielectric substrate 7 and the conductor base 1 are arranged so that the air gap 5 between the dielectric substrate 7 below the copper foil pattern 8 and the conductor base 1 is thicker than the air gap below the copper foil pattern 9.
The shape and dimensions of the conductor spacers A2 and B3 interposed therebetween are appropriately set by cutting or punching.

In this way, the conductor spacers A2 and A3 are stacked and interposed between the dielectric substrate 7 and the conductor base 1, and the air gaps having heights corresponding to the widths of the copper foil patterns are respectively provided below the copper foil patterns A8 and B9. By providing air, it is possible to use air having a small relative permittivity and therefore a small dielectric loss as a part of the dielectric substrate 7, the width of the copper foil pattern can be widened without increasing the thickness of the dielectric substrate, and Transmission loss can also be reduced.

FIG. 3 (a) is a plan view of the second embodiment of the present invention, and FIG. 3 (b) is a side view of the second embodiment of the present invention. The second embodiment shown in FIGS. 3 (a) and 3 (b) is an example in which the power combiner / distributor of the present invention has a plurality of combiner / distributor paths, and in this case, three combiner distributors are used. Four kinds of air gaps 5 having thicknesses d ₁ , d ₂ , d ₃ and d ₄ are formed between the conductor base 1 and the dielectric substrate 7 by the conductor spacers, that is, the conductor spacers A2, B3 and C4. The air gaps of these four heights are present as a part of the dielectric substrate 7 corresponding to the D ₁ , D ₂ , D ₃ and D ₄ portions of the copper foil pattern 8 and have thicknesses d _{1 to} d. ₄ is determined by the size corresponding to the copper foil pattern width of the portions D _{1 to} D ₄ . Thus, without increasing the thickness of the dielectric substrate 7, the width of the copper foil pattern can be increased by increasing the thickness of the air gap 5 toward the combined output side (or the distributed input side) of the power combiner / distributor. You can

In the case of FIGS. 3 (a) and 3 (b), a part of the air gap on the combined input side (or distribution output side), for example, the thicknesses d ₁ and d ₂ are formed with a common d _2. By removing the conductor spacer C4, the portion D of the copper foil pattern 8 is removed.
The width of ₁ can be expanded.

[Effect of device]

As described above, according to the present invention, air having a small relative permittivity and a small dielectric loss can be used as a part of the dielectric by providing an air gap between the dielectric substrate and the conductor base by the conductor spacer. Therefore, the width of the copper foil pattern can be widened and the transmission loss can be reduced.

Further, since the width of the copper foil pattern can be widened, high power can be easily passed through, and there is an effect that it is particularly suitable for a high power synthetic distributor.

Further, since the dielectric substrate can be made thin, there is an effect that the production cost of the power combiner / distributor can be reduced.

[Brief description of drawings]

1 is a perspective view showing a first embodiment of the present invention, FIG. 2 is an exploded perspective view showing the embodiment of FIG. 1, and FIG. 3 (a) is a second embodiment of the present invention. FIG. 3 (b) is a side view of the second embodiment of the present invention, and FIG. 4 is a perspective view of a conventional power combiner / distributor. 1 ... Conductor base, 2 ... Conductor spacer A, 3 ... Conductor spacer B, 4 ... Conductor spacer C, 5 ... Air gap, 6 ... Ground pattern, 7 ... Dielectric substrate, 8 ... Copper foil pattern A, 9 ... Copper foil Pattern B, 10 ... Microstrip line.

Claims (2)

[Scope of utility model registration request] 1. A combination or distribution path for high-power and high-frequency power in a transmitter for TV and FM broadcasting, which is fixed on a conductor base and comprises a microstrip line on a dielectric substrate having a certain characteristic impedance. In the functioning power combiner / distributor, a plurality of flat plate-like conductor spacers having partially different cutouts and having substantially the same plane dimension as the dielectric substrate are stacked between the dielectric substrate and the conductor base. And an air gap having a height change determined by the shape of the cutout is formed below the dielectric substrate on which the microstrip line is disposed, and the dielectric substrate and the plurality of conductor spacers are formed. And a ground pattern having substantially the same plane size as the dielectric substrate by removing a portion of the plurality of conductor spacers facing the composite notch. And a copper foil pattern formed on the dielectric substrate as the microstrip line. 2. The air gap below the copper foil pattern to be energized after synthesizing high-power and high-frequency power of the copper foil pattern is energized before or after synthesizing high-power and high-frequency power. The utility model registration claim characterized by comprising the plurality of conductor spacers formed to have a height corresponding to the copper foil pattern width larger than the air gap below the copper foil pattern to be formed (1) A power combiner / divider according to the paragraph.