JPS648741U - - Google Patents

Info

Publication number

JPS648741U

JPS648741U JP10174387U JP10174387U JPS648741U JP S648741 U JPS648741 U JP S648741U JP 10174387 U JP10174387 U JP 10174387U JP 10174387 U JP10174387 U JP 10174387U JP S648741 U JPS648741 U JP S648741U

Authority

JP

Japan

Prior art keywords

lead

header

semiconductor device

subassembly

flowing out

Prior art date

1987-07-03

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 5
• 229920005989 resin Polymers 0.000 claims description 4
• 239000011347 resin Substances 0.000 claims description 4
• 239000000463 material Substances 0.000 claims description 2
• 239000008188 pellet Substances 0.000 claims description 2
• 230000000087 stabilizing effect Effects 0.000 claims description 2
• 239000003822 epoxy resin Substances 0.000 claims 1
• 229920000647 polyepoxide Polymers 0.000 claims 1
• 239000003223 protective agent Substances 0.000 claims 1
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
• 238000007747 plating Methods 0.000 description 2
• XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1
• 229910052710 silicon Inorganic materials 0.000 description 1
• 239000010703 silicon Substances 0.000 description 1
• 229910052709 silver Inorganic materials 0.000 description 1
• 239000004332 silver Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1