JPS6487153A - Grinding amount correction system for numerical control machine tool - Google Patents
Grinding amount correction system for numerical control machine toolInfo
- Publication number
- JPS6487153A JPS6487153A JP62239782A JP23978287A JPS6487153A JP S6487153 A JPS6487153 A JP S6487153A JP 62239782 A JP62239782 A JP 62239782A JP 23978287 A JP23978287 A JP 23978287A JP S6487153 A JPS6487153 A JP S6487153A
- Authority
- JP
- Japan
- Prior art keywords
- amount
- wear
- grinding stone
- tool
- correction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
PURPOSE:To automatically and easily correct a decrease in a grinding amount due to wear of a tool, by a method wherein, from the current value of a tool driving motor, a correction moving amount, in the direction of the radius of a workpiece, of a tool responding to a wear amount of the tool is calculated to add it to a target moving amount. CONSTITUTION:The current value of a grinding stone rotating motor 24 is detected by a current detecting means. Based on the detected current value, a wear amount of a rotary grinding stone is calculated as a correction cut amount D, in the direction of the radius of a rolling roll, of the rotary grinding stone by means of a wear correction means 62. By adding the calculated correction cut amount D of the rotary grinding stone to a target cut amount R, a decrease in a grinding amount due to wear of the rotary grinding stone is corrected, and the rolling roll is ground in a desired shape by means of a normally accurate grinding amount.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62239782A JPS6487153A (en) | 1987-09-22 | 1987-09-22 | Grinding amount correction system for numerical control machine tool |
DE3828594A DE3828594C2 (en) | 1987-08-24 | 1988-08-23 | Numerically controlled machine tool and method for controlling the grinding process carried out with it |
KR1019880010781A KR940008050B1 (en) | 1987-08-24 | 1988-08-24 | Numerically controlled machine tool and method of controlling grinding operation thereof |
US07/769,346 US5315789A (en) | 1987-08-24 | 1991-10-02 | Numerically controlled machine tool and method of controlling grinding operation thereof |
KR1019940007985A KR940008088B1 (en) | 1987-08-24 | 1994-04-15 | Numerically controlled machine tool and method of controlling grinding operation thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62239782A JPS6487153A (en) | 1987-09-22 | 1987-09-22 | Grinding amount correction system for numerical control machine tool |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6487153A true JPS6487153A (en) | 1989-03-31 |
Family
ID=17049809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62239782A Pending JPS6487153A (en) | 1987-08-24 | 1987-09-22 | Grinding amount correction system for numerical control machine tool |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6487153A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE38029E1 (en) * | 1988-10-28 | 2003-03-11 | Ibm Corporation | Wafer polishing and endpoint detection |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5135271A (en) * | 1974-07-23 | 1976-03-25 | Trt Telecom Radio Electr |
-
1987
- 1987-09-22 JP JP62239782A patent/JPS6487153A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5135271A (en) * | 1974-07-23 | 1976-03-25 | Trt Telecom Radio Electr |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE38029E1 (en) * | 1988-10-28 | 2003-03-11 | Ibm Corporation | Wafer polishing and endpoint detection |
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