JPS6487148A - Polishing method - Google Patents
Polishing methodInfo
- Publication number
- JPS6487148A JPS6487148A JP62240810A JP24081087A JPS6487148A JP S6487148 A JPS6487148 A JP S6487148A JP 62240810 A JP62240810 A JP 62240810A JP 24081087 A JP24081087 A JP 24081087A JP S6487148 A JPS6487148 A JP S6487148A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- approximate
- polishing
- artificial leather
- rmax
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE:To enable extremely high-precise machining of a mirror surface, by a method wherein, in the middle or after polishing of a substance to be machined, e.g. Si wafers, by means of an artificial leather, polishing is performed by a tin surface plate serving as a polisher. CONSTITUTION:A wafer 6 adhered to a mount plate 9 is pressed against a polisher 8, e.g., artificial leather, laminated to a surface plate 7, e.g., aluminum, and by using a polishing agent in which SiO2 of approximate 0.01mum is dispersed in a colloidal manner in a weak alkaline water solution, lapping is effected so that surface roughness is reduced from 2-3mum to approximate 1mum Rmax. The wafer is finished by diamond cutting to form a high-precise complete plane. The wafer 6 adhered to the mount plate 19 is pressed against a surface plate 14 made of Sn in which a helical groove 15 is formed, and by using a water solution polishing agent 16 containing 10% SiO with a grain size of approximate 0.01mum, the wafer is finished to 0.7mum by means of LTV (Local Thickness Variation). Thereafter, by using the artificial leather, it is polished to surface roughness of 0.002mum Rmax to remove haze.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62240810A JPS6487148A (en) | 1987-09-28 | 1987-09-28 | Polishing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62240810A JPS6487148A (en) | 1987-09-28 | 1987-09-28 | Polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6487148A true JPS6487148A (en) | 1989-03-31 |
Family
ID=17065020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62240810A Pending JPS6487148A (en) | 1987-09-28 | 1987-09-28 | Polishing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6487148A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0387558U (en) * | 1989-12-18 | 1991-09-05 | ||
US5705423A (en) * | 1994-11-14 | 1998-01-06 | Shin-Etsu Handotai Co., Ltd. | Epitaxial wafer |
-
1987
- 1987-09-28 JP JP62240810A patent/JPS6487148A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0387558U (en) * | 1989-12-18 | 1991-09-05 | ||
US5705423A (en) * | 1994-11-14 | 1998-01-06 | Shin-Etsu Handotai Co., Ltd. | Epitaxial wafer |
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