JPS648711B2 - - Google Patents
Info
- Publication number
- JPS648711B2 JPS648711B2 JP20000381A JP20000381A JPS648711B2 JP S648711 B2 JPS648711 B2 JP S648711B2 JP 20000381 A JP20000381 A JP 20000381A JP 20000381 A JP20000381 A JP 20000381A JP S648711 B2 JPS648711 B2 JP S648711B2
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- voltage
- plated
- plating thickness
- electroless plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 38
- 238000007772 electroless plating Methods 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 239000012811 non-conductive material Substances 0.000 claims description 6
- 238000005070 sampling Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 238000005259 measurement Methods 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 9
- 230000008021 deposition Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000000691 measurement method Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1671—Electric field
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20000381A JPS58104167A (ja) | 1981-12-14 | 1981-12-14 | 無電解めつき厚さ連続測定方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20000381A JPS58104167A (ja) | 1981-12-14 | 1981-12-14 | 無電解めつき厚さ連続測定方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58104167A JPS58104167A (ja) | 1983-06-21 |
| JPS648711B2 true JPS648711B2 (enrdf_load_stackoverflow) | 1989-02-15 |
Family
ID=16417172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20000381A Granted JPS58104167A (ja) | 1981-12-14 | 1981-12-14 | 無電解めつき厚さ連続測定方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58104167A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62147304A (ja) * | 1985-12-20 | 1987-07-01 | Ibiden Co Ltd | 無電解メッキ方法 |
| JP2638283B2 (ja) * | 1990-10-17 | 1997-08-06 | 日立化成工業株式会社 | 無電解めっき析出速度測定装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5926663B2 (ja) * | 1979-11-08 | 1984-06-29 | 株式会社東芝 | 無電解メツキ反応の測定装置 |
-
1981
- 1981-12-14 JP JP20000381A patent/JPS58104167A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58104167A (ja) | 1983-06-21 |
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