JPS6486547A - Manufacture of semiconductor element - Google Patents
Manufacture of semiconductor elementInfo
- Publication number
- JPS6486547A JPS6486547A JP24498087A JP24498087A JPS6486547A JP S6486547 A JPS6486547 A JP S6486547A JP 24498087 A JP24498087 A JP 24498087A JP 24498087 A JP24498087 A JP 24498087A JP S6486547 A JPS6486547 A JP S6486547A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- film
- single crystal
- type
- sic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Junction Field-Effect Transistors (AREA)
Abstract
PURPOSE:To decrease the number of processes, and to realize an element having excellent performance, stability and reliability by constructing an Si semiconductor element by using a pattern film being employed for selectively growing a single crystal SiC film and composed of a high melting-point material as a mask and a surface protective film as it is without being peeled. CONSTITUTION:A gate electrode 9, a source electrode 10 and a drain electrode 11 are formed onto an N-type single crystal SiC film 4, thus constructing an SiC Schottky gate type field-effect transistor. A window is bored to an SiO2 pattern film 2a, and an ohmic electrode 12 to a P-type Si layer 7 and an ohmic electrode 13 to an N-type Si layer 8 are shaped, thus constituting an Si P-N junction diode. Consequently, an SiC semiconductor element and an Si semiconductor element can be built to the same single crystal Si substrate 1. An SiO2 pattern film used for selectively growing the single crystal SiC film can be utilized as a mask for manufacturing the Si semiconductor element and a surface protective film in the Si semiconductor element after manufacture as it is.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24498087A JPS6486547A (en) | 1987-09-28 | 1987-09-28 | Manufacture of semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24498087A JPS6486547A (en) | 1987-09-28 | 1987-09-28 | Manufacture of semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6486547A true JPS6486547A (en) | 1989-03-31 |
Family
ID=17126803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24498087A Pending JPS6486547A (en) | 1987-09-28 | 1987-09-28 | Manufacture of semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6486547A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5216264A (en) * | 1989-06-07 | 1993-06-01 | Sharp Kabushiki Kaisha | Silicon carbide MOS type field-effect transistor with at least one of the source and drain regions is formed by the use of a schottky contact |
-
1987
- 1987-09-28 JP JP24498087A patent/JPS6486547A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5216264A (en) * | 1989-06-07 | 1993-06-01 | Sharp Kabushiki Kaisha | Silicon carbide MOS type field-effect transistor with at least one of the source and drain regions is formed by the use of a schottky contact |
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