JPS6486546A - Semiconductor stack - Google Patents

Semiconductor stack

Info

Publication number
JPS6486546A
JPS6486546A JP24447787A JP24447787A JPS6486546A JP S6486546 A JPS6486546 A JP S6486546A JP 24447787 A JP24447787 A JP 24447787A JP 24447787 A JP24447787 A JP 24447787A JP S6486546 A JPS6486546 A JP S6486546A
Authority
JP
Japan
Prior art keywords
pin
hole
length
central axis
semiconductor stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24447787A
Other languages
Japanese (ja)
Inventor
Takashi Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP24447787A priority Critical patent/JPS6486546A/en
Publication of JPS6486546A publication Critical patent/JPS6486546A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To adjust length at the same time as assembly of a semiconductor stack, and to facilitate the assembly by composing the semiconductor stack of a cylindrical first pin, a central axis of which has a specified wall thickness and a through-hole, and a columnar second pin, which can be fitted into the through-hole in the first pin, and inserting the first pin into the through-hole in the second pin in an adjustable manner. CONSTITUTION:When length in the axial direction of a central axis 4 is lengthened excessively and a first pin 2 collides with the base of a hole 8 in a diode 7, a second pin 3 is further inserted into a through-hole 2 in the first pin 2, and overall length is shortened. When the length of the central axis 4 is lengthened, on the contrary, the second pin 3 is drawn out of the through- hole 2 in the first pin 2, and overall length in the axial direction is lengthened. When the first pin 2 and the second pin 3 are combined, entire length in the axial direction of the central axis 4 is made longer than a fixed value previously, and both pins can also be combined while the end face of the first pin 1 is abutted against the base of the hole 8 in the diode 7 when a semiconductor stack is assembled. Accordingly, the length of the central axis 4 can be adjusted at the same time as the assembly of the semiconductor stack.
JP24447787A 1987-09-29 1987-09-29 Semiconductor stack Pending JPS6486546A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24447787A JPS6486546A (en) 1987-09-29 1987-09-29 Semiconductor stack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24447787A JPS6486546A (en) 1987-09-29 1987-09-29 Semiconductor stack

Publications (1)

Publication Number Publication Date
JPS6486546A true JPS6486546A (en) 1989-03-31

Family

ID=17119246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24447787A Pending JPS6486546A (en) 1987-09-29 1987-09-29 Semiconductor stack

Country Status (1)

Country Link
JP (1) JPS6486546A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5285216A (en) * 1989-09-27 1994-02-08 Kyocera Corporation Thermal head
US5959651A (en) * 1995-08-12 1999-09-28 Rohm Co., Ltd. Thermal printhead and method of adjusting characteristic thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5285216A (en) * 1989-09-27 1994-02-08 Kyocera Corporation Thermal head
US5959651A (en) * 1995-08-12 1999-09-28 Rohm Co., Ltd. Thermal printhead and method of adjusting characteristic thereof

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