JPS6486539A - Filler for semiconductor sealing medium - Google Patents
Filler for semiconductor sealing mediumInfo
- Publication number
- JPS6486539A JPS6486539A JP16627587A JP16627587A JPS6486539A JP S6486539 A JPS6486539 A JP S6486539A JP 16627587 A JP16627587 A JP 16627587A JP 16627587 A JP16627587 A JP 16627587A JP S6486539 A JPS6486539 A JP S6486539A
- Authority
- JP
- Japan
- Prior art keywords
- silica
- thermal expansion
- glass
- inorganic powder
- expansion coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Glass Compositions (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To reduce thermal stress, and to improve insulating properties and moisture resistance by using inorganic powder, which has a thermal expansion coefficient smaller than that of an silica based material and the quantity of eluted alkali metallic ions of which is made to have a specific value, as fillers. CONSTITUTION:A silica-AO2 group glass (A=Ti, Zr, Hf), such as silica-titania glass, aluminosilicate, beta-quartz stable at normal temperature or below, and an Li2O-Al2O3-SiO2 group (lithium aluminosilicate) as one having the phase of a keytite type crystal structure are known as inorganic powder, which has a thermal expansion coefficient smaller than silica glass and the quantity of eluted alkali metallic ions of which extends over 0.1wt.% or smaller. These substances are known as materials having negative thermal expansion coefficients, and the range of the compositions are shown by slashed sections in the diagram.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16627587A JPS6486539A (en) | 1987-05-08 | 1987-07-04 | Filler for semiconductor sealing medium |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11049087 | 1987-05-08 | ||
| JP16627587A JPS6486539A (en) | 1987-05-08 | 1987-07-04 | Filler for semiconductor sealing medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6486539A true JPS6486539A (en) | 1989-03-31 |
Family
ID=26450113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16627587A Pending JPS6486539A (en) | 1987-05-08 | 1987-07-04 | Filler for semiconductor sealing medium |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6486539A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0543270A (en) * | 1991-06-03 | 1993-02-23 | Office Natl Etud Rech Aerospat <Onera> | Glass-ceramic li-al-si-o composition and its preparation |
| US6365269B1 (en) | 1997-11-20 | 2002-04-02 | Infineon Technologies Ag | Plastic compositions for sheathing a metal or semiconductor body |
| WO2019044323A1 (en) * | 2017-08-29 | 2019-03-07 | 日本電気硝子株式会社 | Filler powder and method for producing same |
| WO2022202347A1 (en) * | 2021-03-24 | 2022-09-29 | パナソニックＩｐマネジメント株式会社 | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board |
| WO2022202346A1 (en) * | 2021-03-24 | 2022-09-29 | パナソニックＩｐマネジメント株式会社 | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board |
-
1987
- 1987-07-04 JP JP16627587A patent/JPS6486539A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0543270A (en) * | 1991-06-03 | 1993-02-23 | Office Natl Etud Rech Aerospat <Onera> | Glass-ceramic li-al-si-o composition and its preparation |
| US6365269B1 (en) | 1997-11-20 | 2002-04-02 | Infineon Technologies Ag | Plastic compositions for sheathing a metal or semiconductor body |
| WO2019044323A1 (en) * | 2017-08-29 | 2019-03-07 | 日本電気硝子株式会社 | Filler powder and method for producing same |
| JP2019038733A (en) * | 2017-08-29 | 2019-03-14 | 日本電気硝子株式会社 | Filler powder and method for producing the same |
| WO2022202347A1 (en) * | 2021-03-24 | 2022-09-29 | パナソニックＩｐマネジメント株式会社 | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board |
| WO2022202346A1 (en) * | 2021-03-24 | 2022-09-29 | パナソニックＩｐマネジメント株式会社 | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board |
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