JPS5645055A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5645055A JPS5645055A JP12061779A JP12061779A JPS5645055A JP S5645055 A JPS5645055 A JP S5645055A JP 12061779 A JP12061779 A JP 12061779A JP 12061779 A JP12061779 A JP 12061779A JP S5645055 A JPS5645055 A JP S5645055A
- Authority
- JP
- Japan
- Prior art keywords
- less
- zno
- glass
- sio2
- dielectric strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To obtain a stable semiconductor device having high dielectric strength and high reliability by including SiO2, B2O3, ZnO, Al2O3, Sb2O3, As2O3, PbO to compose a glass layer for protection. (However, the oxides of a transition element and a rare earth element having two kinds or more of valence should be 0.03% or less). CONSTITUTION:The following are each composition of glass shown in percent indication by weight: 1; SiO2 of 8% or less - easy to be exfoliated and has inferior chemical durability. 2; SiO2 of 20% or more - hard to be glazed. 3; B2O3 of 17% or less - transparency will be lost. 4; B2O3 of 30% or more - will not equally be glazed. 5; ZnO of 53% or less - transparency will lost. 6; ZnO of 63% or more - crystals will be separated in the glass. 7; Sb2O3, As2O3 of 1% or more as a deforming agent - will induce a deterioration in resisting pressure. 8; PbO of 3% or more - will induce a decrease in resisting pressure. 9; Al2O3 should be 3-10% to give stability and dielectric strength will be equalized and variations in dielectric strength will be prevented by fixing the content of the oxides of a transition element or a rare earth element to a predetermined amount. With a semiconductor protected by a glass film composing of the above composition, a high reliability semiconductor will be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12061779A JPS5645055A (en) | 1979-09-21 | 1979-09-21 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12061779A JPS5645055A (en) | 1979-09-21 | 1979-09-21 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5645055A true JPS5645055A (en) | 1981-04-24 |
Family
ID=14790669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12061779A Pending JPS5645055A (en) | 1979-09-21 | 1979-09-21 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5645055A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4927237B1 (en) * | 2011-05-26 | 2012-05-09 | 新電元工業株式会社 | Semiconductor junction protecting glass composition, semiconductor device manufacturing method, and semiconductor device |
JP5184717B1 (en) * | 2012-01-31 | 2013-04-17 | 新電元工業株式会社 | Semiconductor junction protecting glass composition, semiconductor device manufacturing method, and semiconductor device |
WO2014155739A1 (en) * | 2013-03-29 | 2014-10-02 | 新電元工業株式会社 | Glass composition for semiconductor junction protection, method for manufacturing semiconductor device, and semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5117028A (en) * | 1974-07-15 | 1976-02-10 | Draft Systems | |
JPS5432064A (en) * | 1977-08-16 | 1979-03-09 | Asahi Glass Co Ltd | Glass composition for coating semiconductor |
-
1979
- 1979-09-21 JP JP12061779A patent/JPS5645055A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5117028A (en) * | 1974-07-15 | 1976-02-10 | Draft Systems | |
JPS5432064A (en) * | 1977-08-16 | 1979-03-09 | Asahi Glass Co Ltd | Glass composition for coating semiconductor |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4927237B1 (en) * | 2011-05-26 | 2012-05-09 | 新電元工業株式会社 | Semiconductor junction protecting glass composition, semiconductor device manufacturing method, and semiconductor device |
CN102781861A (en) * | 2011-05-26 | 2012-11-14 | 新电元工业株式会社 | Glass composition for semiconductor junction protection, production method for semiconductor device, and semiconductor device |
WO2012160704A1 (en) * | 2011-05-26 | 2012-11-29 | 新電元工業株式会社 | Glass composition for semiconductor junction protection, production method for semiconductor device, and semiconductor device |
TWI424472B (en) * | 2011-05-26 | 2014-01-21 | Shindengen Electric Mfg | Method for fabricating glass for semiconductor bonding, method for manufacturing semiconductor device, and semiconductor device |
EP2717299A4 (en) * | 2011-05-26 | 2015-04-08 | Shindengen Electric Mfg | Glass composition for semiconductor junction protection, production method for semiconductor device, and semiconductor device |
US9159549B2 (en) | 2011-05-26 | 2015-10-13 | Shindengen Electric Manufacturing Co., Ltd. | Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device |
JP5184717B1 (en) * | 2012-01-31 | 2013-04-17 | 新電元工業株式会社 | Semiconductor junction protecting glass composition, semiconductor device manufacturing method, and semiconductor device |
WO2013114562A1 (en) * | 2012-01-31 | 2013-08-08 | 新電元工業株式会社 | Glass composition for semiconductor junction protection, production method for semiconductor device, and semiconductor device |
US9099483B2 (en) | 2012-01-31 | 2015-08-04 | Shindengen Electric Manufacturing Co., Ltd. | Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device |
WO2014155739A1 (en) * | 2013-03-29 | 2014-10-02 | 新電元工業株式会社 | Glass composition for semiconductor junction protection, method for manufacturing semiconductor device, and semiconductor device |
CN104254907A (en) * | 2013-03-29 | 2014-12-31 | 新电元工业株式会社 | Glass composition for semiconductor junction protection, method for manufacturing semiconductor device, and semiconductor device |
US9236318B1 (en) | 2013-03-29 | 2016-01-12 | Shindengen Electric Manufacturing Co., Ltd. | Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device |
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