JPS5645055A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5645055A
JPS5645055A JP12061779A JP12061779A JPS5645055A JP S5645055 A JPS5645055 A JP S5645055A JP 12061779 A JP12061779 A JP 12061779A JP 12061779 A JP12061779 A JP 12061779A JP S5645055 A JPS5645055 A JP S5645055A
Authority
JP
Japan
Prior art keywords
less
zno
glass
sio2
dielectric strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12061779A
Other languages
Japanese (ja)
Inventor
Shinichi Tai
Masaru Shinpo
Katsujiro Tanzawa
Kiyoshi Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12061779A priority Critical patent/JPS5645055A/en
Publication of JPS5645055A publication Critical patent/JPS5645055A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a stable semiconductor device having high dielectric strength and high reliability by including SiO2, B2O3, ZnO, Al2O3, Sb2O3, As2O3, PbO to compose a glass layer for protection. (However, the oxides of a transition element and a rare earth element having two kinds or more of valence should be 0.03% or less). CONSTITUTION:The following are each composition of glass shown in percent indication by weight: 1; SiO2 of 8% or less - easy to be exfoliated and has inferior chemical durability. 2; SiO2 of 20% or more - hard to be glazed. 3; B2O3 of 17% or less - transparency will be lost. 4; B2O3 of 30% or more - will not equally be glazed. 5; ZnO of 53% or less - transparency will lost. 6; ZnO of 63% or more - crystals will be separated in the glass. 7; Sb2O3, As2O3 of 1% or more as a deforming agent - will induce a deterioration in resisting pressure. 8; PbO of 3% or more - will induce a decrease in resisting pressure. 9; Al2O3 should be 3-10% to give stability and dielectric strength will be equalized and variations in dielectric strength will be prevented by fixing the content of the oxides of a transition element or a rare earth element to a predetermined amount. With a semiconductor protected by a glass film composing of the above composition, a high reliability semiconductor will be obtained.
JP12061779A 1979-09-21 1979-09-21 Semiconductor device Pending JPS5645055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12061779A JPS5645055A (en) 1979-09-21 1979-09-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12061779A JPS5645055A (en) 1979-09-21 1979-09-21 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5645055A true JPS5645055A (en) 1981-04-24

Family

ID=14790669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12061779A Pending JPS5645055A (en) 1979-09-21 1979-09-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5645055A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4927237B1 (en) * 2011-05-26 2012-05-09 新電元工業株式会社 Semiconductor junction protecting glass composition, semiconductor device manufacturing method, and semiconductor device
JP5184717B1 (en) * 2012-01-31 2013-04-17 新電元工業株式会社 Semiconductor junction protecting glass composition, semiconductor device manufacturing method, and semiconductor device
WO2014155739A1 (en) * 2013-03-29 2014-10-02 新電元工業株式会社 Glass composition for semiconductor junction protection, method for manufacturing semiconductor device, and semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5117028A (en) * 1974-07-15 1976-02-10 Draft Systems
JPS5432064A (en) * 1977-08-16 1979-03-09 Asahi Glass Co Ltd Glass composition for coating semiconductor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5117028A (en) * 1974-07-15 1976-02-10 Draft Systems
JPS5432064A (en) * 1977-08-16 1979-03-09 Asahi Glass Co Ltd Glass composition for coating semiconductor

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4927237B1 (en) * 2011-05-26 2012-05-09 新電元工業株式会社 Semiconductor junction protecting glass composition, semiconductor device manufacturing method, and semiconductor device
CN102781861A (en) * 2011-05-26 2012-11-14 新电元工业株式会社 Glass composition for semiconductor junction protection, production method for semiconductor device, and semiconductor device
WO2012160704A1 (en) * 2011-05-26 2012-11-29 新電元工業株式会社 Glass composition for semiconductor junction protection, production method for semiconductor device, and semiconductor device
TWI424472B (en) * 2011-05-26 2014-01-21 Shindengen Electric Mfg Method for fabricating glass for semiconductor bonding, method for manufacturing semiconductor device, and semiconductor device
EP2717299A4 (en) * 2011-05-26 2015-04-08 Shindengen Electric Mfg Glass composition for semiconductor junction protection, production method for semiconductor device, and semiconductor device
US9159549B2 (en) 2011-05-26 2015-10-13 Shindengen Electric Manufacturing Co., Ltd. Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device
JP5184717B1 (en) * 2012-01-31 2013-04-17 新電元工業株式会社 Semiconductor junction protecting glass composition, semiconductor device manufacturing method, and semiconductor device
WO2013114562A1 (en) * 2012-01-31 2013-08-08 新電元工業株式会社 Glass composition for semiconductor junction protection, production method for semiconductor device, and semiconductor device
US9099483B2 (en) 2012-01-31 2015-08-04 Shindengen Electric Manufacturing Co., Ltd. Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device
WO2014155739A1 (en) * 2013-03-29 2014-10-02 新電元工業株式会社 Glass composition for semiconductor junction protection, method for manufacturing semiconductor device, and semiconductor device
CN104254907A (en) * 2013-03-29 2014-12-31 新电元工业株式会社 Glass composition for semiconductor junction protection, method for manufacturing semiconductor device, and semiconductor device
US9236318B1 (en) 2013-03-29 2016-01-12 Shindengen Electric Manufacturing Co., Ltd. Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device

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