SU672165A1 - Glass - Google Patents

Description

(54) GLASS

FIELD OF THE INVENTION The invention relates to compositions of pegcoped glasses, used primarily as insulating coatings in the popructophore and radioelectronic industries.

Known glass used to seal the active elements of semiconductor devices, containing PBO 65-75; Si Og 8-12; B2O, 7-8; ZnO 5-15; Coo 0.5-3; CdO 0.5-1.5; W- Glass indicated reflow temperature and linear thermal expansion coefficient 85 1 / ° C.

The closest to the invention is SIB glass containing the following components, weight. %:

PCO 75.8-77.3 BgOg 8.0-9.0 Si O 2 3.7-4.7 1.5-2.0 and, in addition, MnOg. 8.5-9.5 2

The glass of this composition has a melting point of 460ilO C, a linear thermal expansion coefficient (90 ± 5). Yu-T 1 / S.

The aim of the invention is to reduce the glass melting temperature.

This is achieved by the fact that the described glass, including PbO, BgOg jSiOjj AEgO I, additionally contains um and zOs in the following ratio of the indicated components, wt%: PbO

7i9-85;

BgO,

4-6,5

Sio | 8-12

ASgOj 0.5-2 0.5-4.5

2% 0.3-1.

Introduction to the glass AALP20C-locally with PjOj reduces the temperature J of glass softening, and in addition, reduces the ability to restore P3O, which causes the electrical characteristics of products coated with the proposed glass for a long sKcrmyaTautfH. An insulating coating is provided with a thickness of 5070 microns.

The table shows specific examples of glass compositions.

Physical and mechanical properties of these materials are shown in Table. 2

79,7.3 5.3 can be used as raw materials for boiling stems.

12 0.5 1.5 1 Temperature op avpe314 305 and, C Thermal Expansion Coefficient ° C) Deppectric 6.5 7.0 Permeability Specific volume Yu-b 10 resistance, Adhesion to aircrow. 190190 Kum glass, kg / cm Chemical resistance (weight loss) to water 9 0, O20.03 to 0.1 NHCg, mg / da / 4.75.2 Cooking temperature, C 10001000

721654

Wans: lead oxide, boric acid, silicic acid, aluminum fluoride, manganese oxide, ammonium phosphate brand H and HCH.

The proposed glass belongs to the type of chemically resistant insulating low-melting glasses and is intended for use in the electronic industry as thin-film

coating materials. lo

Table 1

82.8 80 81 84.5

2 6.5

four

5.8 4.5

4 8.4

10 2 0.7 9.2 11 8

0.7 1.0 2

1.5 4.0 1.7 0.5 1 1

0.5 0.3 0.8 0.6

Table2 88 306 310 308 300 89 87 93 6.8 7.9 8.3 9.3 loV 10 10 190190190190 0.020.030.020.035 4.85.55.66.1 10009501000100О

5 672165 4

Claims (1)

SiOg 8-12 Claim AegOa 0.5-2 Glass including PbO.BgOj.e.iOg. 0.5-4.5 Atgog o similarly, O, 3-1, O. that, with the float temperature drop circuit. Sources of information taken in laziness, it additionally contains MPg Od attention when examining IT OuPri following the ratio of UK-1- USSR authorial testimony Ehannyh components, wt.%: No. 349652 ,, With OZ With 3 / tO, 1971,  79-852. USSR author's certificate BjO 4-6.5 No. 471319, C 03 C 3/12, 1973.