JPS6485247A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS6485247A
JPS6485247A JP63155622A JP15562288A JPS6485247A JP S6485247 A JPS6485247 A JP S6485247A JP 63155622 A JP63155622 A JP 63155622A JP 15562288 A JP15562288 A JP 15562288A JP S6485247 A JPS6485247 A JP S6485247A
Authority
JP
Japan
Prior art keywords
epoxy resin
compound
group
mixing
specified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63155622A
Other languages
Japanese (ja)
Other versions
JPH0689118B2 (en
Inventor
Yoichi Ueda
Kunimasa Kamio
Yasuhisa Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP15562288A priority Critical patent/JPH0689118B2/en
Publication of JPS6485247A publication Critical patent/JPS6485247A/en
Publication of JPH0689118B2 publication Critical patent/JPH0689118B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To make it possible to form a composition having heat resistance more excellent than that of an epoxy resin and adhesiveness and water resistance at least equivalent to those of an epoxy resin, by mixing an epoxy resin with a specified imide compound and a specified polymaleimide compound or with said imide compound and a specified phenolic hydroxyl group containing compound. CONSTITUTION:This epoxy resin composition is prepared by mixing the following components A, B and C or by mixing the following components A, B and D, [A]: an epoxy resin, [B]: an imide compound of formula I (wherein X is an -NH2 group and/or an -OH group, Ar1 and Ar2 are each an aromatic residue, R1 is a hydrogen atom or a 1-10C alkyl group, R2 is a hydrogen atom, a 1-20C alkyl group, an alkoxyl group or a hydroxyl group, m and n are each a number of 0-30) [C]: a polymaleimide compound having at least two maleimide groups in the molecule, and [D]: a compound having at least two phenolic hydroxyl groups in the molecule.
JP15562288A 1987-06-23 1988-06-22 Epoxy resin composition Expired - Lifetime JPH0689118B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15562288A JPH0689118B2 (en) 1987-06-23 1988-06-22 Epoxy resin composition

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP62-157329 1987-06-23
JP62-157331 1987-06-23
JP15733187 1987-06-23
JP15733087 1987-06-23
JP15732987 1987-06-23
JP62-157330 1987-10-14
JP15562288A JPH0689118B2 (en) 1987-06-23 1988-06-22 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS6485247A true JPS6485247A (en) 1989-03-30
JPH0689118B2 JPH0689118B2 (en) 1994-11-09

Family

ID=27473360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15562288A Expired - Lifetime JPH0689118B2 (en) 1987-06-23 1988-06-22 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPH0689118B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005061585A1 (en) * 2003-12-24 2005-07-07 Nippon Petrochemicals Co., Ltd. Polyamic acid and polyimide
JP2005320386A (en) * 2004-05-06 2005-11-17 Nippon Petrochemicals Co Ltd Polyimide film laminate
WO2005108466A1 (en) * 2004-05-06 2005-11-17 Nippon Petrochemicals Co., Ltd. Alignment film for liquid crystal display device
JP2005320387A (en) * 2004-05-06 2005-11-17 Nippon Petrochemicals Co Ltd Laminate and adhesive material

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005061585A1 (en) * 2003-12-24 2005-07-07 Nippon Petrochemicals Co., Ltd. Polyamic acid and polyimide
JP2005206782A (en) * 2003-12-24 2005-08-04 Nippon Petrochemicals Co Ltd Polyamic acid and polyimide
JP2005320386A (en) * 2004-05-06 2005-11-17 Nippon Petrochemicals Co Ltd Polyimide film laminate
WO2005108467A1 (en) * 2004-05-06 2005-11-17 Nippon Petrochemicals Co., Ltd. Polyimide film laminate
WO2005108466A1 (en) * 2004-05-06 2005-11-17 Nippon Petrochemicals Co., Ltd. Alignment film for liquid crystal display device
JP2005320387A (en) * 2004-05-06 2005-11-17 Nippon Petrochemicals Co Ltd Laminate and adhesive material

Also Published As

Publication number Publication date
JPH0689118B2 (en) 1994-11-09

Similar Documents

Publication Publication Date Title
TW354328B (en) Epoxy resin composition comprising a bipohenol-type epoxy resin and a polyhydric phenol resin curing agent, process for the preparation of said composition and articles comprising said composition
ATE85599T1 (en) SUBSTITUTED PHENYLTRIFLUOROMETHYL ETHERS.
JPS5649754A (en) Thermosetting organopolysiloxane composition
MY115318A (en) Liquid epoxy resin composition.
MY108461A (en) Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same.
PT89598A (en) PROCESS FOR THE PREPARATION OF COMPOSITIONS OF ARYLENE POLYSULFURETH RESINS
JPS6485247A (en) Epoxy resin composition
JPS641762A (en) Silicone composition
JPS6465110A (en) Curable resin composition
JPS57131250A (en) Silicone resin composition
JPS5651735A (en) Photoreactive composition
JPS57131223A (en) Resin composition
KR880014002A (en) Epoxy Compounds and Epoxy Resin Compositions Containing the Same
DE3466996D1 (en) Epoxy resin compositions
JPS5622311A (en) Thermosetting resin composition
DK35786D0 (en) PREPARATION AND PROCEDURE FOR TREATMENT OF SURFACE SUBSTRATES
KR930007996A (en) Polyhydric phenols and epoxy resins and epoxy resin compositions derived therefrom
JPS5728129A (en) Curing agent for epoxy resin
JPS53141361A (en) Epoxy resin composition
JPS6448850A (en) Electronic component
JPS57187325A (en) Production of epoxy resin laminated sheet
JPS57167324A (en) Curable resin composition
JPS5655449A (en) Thermosetting resin composition
JPS5590553A (en) Silicone-modified epoxy resin composition
JPS5548242A (en) Hot-melt type heat-resistant resin composition