JPS6484759A - Light-emitting device - Google Patents

Light-emitting device

Info

Publication number
JPS6484759A
JPS6484759A JP24297787A JP24297787A JPS6484759A JP S6484759 A JPS6484759 A JP S6484759A JP 24297787 A JP24297787 A JP 24297787A JP 24297787 A JP24297787 A JP 24297787A JP S6484759 A JPS6484759 A JP S6484759A
Authority
JP
Japan
Prior art keywords
light
emitting
substrate
mounting
emitting part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24297787A
Other languages
Japanese (ja)
Other versions
JP2604603B2 (en
Inventor
Yoshifumi Bito
Akira Watanabe
Kokichi Ishiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP24297787A priority Critical patent/JP2604603B2/en
Publication of JPS6484759A publication Critical patent/JPS6484759A/en
Application granted granted Critical
Publication of JP2604603B2 publication Critical patent/JP2604603B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To obtain a light-emitting device whose resistance to environment and reliability are excellent by a method wherein a wiring part is formed on a substrate for mounting a light-emitting part and the wiring part is connected to an electrode formation part for a light-emitting diode by using a flip chip method. CONSTITUTION:An LED array is composed of a light-emitting part 1 and a substrate 2 for mounting the light-emitting part. An n-type Ga1-xAlxAs layer 4, a P-type Ga1-yAlyAs layer 5 and a P-type GaAs layer 6 are laminated in succession on an alumina single-crystal substrate 3; protective layers 7 composed of SiN or the like and electrodes 8 composed of an Au-Ge-Ni alloy, an Ag-Zn alloy or the like are composed of solders 9a, 9b. The light-emitting part 1 is connected to the substrate 2 for mounting the light-emitting part by using a flip chip method. That is to say, wiring parts 11 are formed on the substrate 12 for mounting the light-emitting part; the solders 9a, 9b are connected directly to the wiring parts 11. In the LED array of this structure, electric power introduced from an electric-power generation source for light-emitting use is impressed on the individual solders 9a, 9b via the wiring parts 11; light-emitting energy generated in the layers 4, 5 is radiated from the alumina single-crystal substrate 3 or an SOS substrate 10.
JP24297787A 1987-09-28 1987-09-28 Light emitting element Expired - Fee Related JP2604603B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24297787A JP2604603B2 (en) 1987-09-28 1987-09-28 Light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24297787A JP2604603B2 (en) 1987-09-28 1987-09-28 Light emitting element

Publications (2)

Publication Number Publication Date
JPS6484759A true JPS6484759A (en) 1989-03-30
JP2604603B2 JP2604603B2 (en) 1997-04-30

Family

ID=17097053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24297787A Expired - Fee Related JP2604603B2 (en) 1987-09-28 1987-09-28 Light emitting element

Country Status (1)

Country Link
JP (1) JP2604603B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19921987B4 (en) * 1998-05-13 2007-05-16 Toyoda Gosei Kk Light-emitting semiconductor device with group III element-nitride compounds
EP2169733A3 (en) * 1997-09-29 2013-04-24 OSRAM Opto Semiconductors GmbH Semiconductor light source and method of fabrication

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5050884A (en) * 1973-09-05 1975-05-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5050884A (en) * 1973-09-05 1975-05-07

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2169733A3 (en) * 1997-09-29 2013-04-24 OSRAM Opto Semiconductors GmbH Semiconductor light source and method of fabrication
DE19921987B4 (en) * 1998-05-13 2007-05-16 Toyoda Gosei Kk Light-emitting semiconductor device with group III element-nitride compounds

Also Published As

Publication number Publication date
JP2604603B2 (en) 1997-04-30

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees