JPS6479380A - Electroless copper plating solution - Google Patents

Electroless copper plating solution

Info

Publication number
JPS6479380A
JPS6479380A JP23653287A JP23653287A JPS6479380A JP S6479380 A JPS6479380 A JP S6479380A JP 23653287 A JP23653287 A JP 23653287A JP 23653287 A JP23653287 A JP 23653287A JP S6479380 A JPS6479380 A JP S6479380A
Authority
JP
Japan
Prior art keywords
copper
plating
complexing agent
soln
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23653287A
Other languages
Japanese (ja)
Inventor
Masahiro Oida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP23653287A priority Critical patent/JPS6479380A/en
Publication of JPS6479380A publication Critical patent/JPS6479380A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To increase the rate of deposition of plating and to give fine luster to plated copper by simultaneously adding hydroxyethylethylenediaminetriacetic acid and a complexing agent for copper (I) to a copper plating soln. having a prescribed compsn. CONSTITUTION:Hydroxyethylethylenediaminetriacetic acid (HEDTA) and a complexing agent for copper (I) are simultaneously added to the conventional electroless copper plating soln. made of an aq. soln. contg. a copper salt, a complexing agent for the salt, alkali hydroxide and formaldehyde. Dipyridyl or a deriv. thereof and phenanthroline or a deriv. thereof are used as the complexing agent for copper (I) and added at about 0.001-1g/l concn. The HEDTA is added at about 0.01-0.35g/l concn. Plating copper having fine luster is obtd. by using the resulting plating soln.
JP23653287A 1987-09-21 1987-09-21 Electroless copper plating solution Pending JPS6479380A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23653287A JPS6479380A (en) 1987-09-21 1987-09-21 Electroless copper plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23653287A JPS6479380A (en) 1987-09-21 1987-09-21 Electroless copper plating solution

Publications (1)

Publication Number Publication Date
JPS6479380A true JPS6479380A (en) 1989-03-24

Family

ID=17002075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23653287A Pending JPS6479380A (en) 1987-09-21 1987-09-21 Electroless copper plating solution

Country Status (1)

Country Link
JP (1) JPS6479380A (en)

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