JPS6478674A - Method for fixing optical part and electric part - Google Patents
Method for fixing optical part and electric partInfo
- Publication number
- JPS6478674A JPS6478674A JP23775987A JP23775987A JPS6478674A JP S6478674 A JPS6478674 A JP S6478674A JP 23775987 A JP23775987 A JP 23775987A JP 23775987 A JP23775987 A JP 23775987A JP S6478674 A JPS6478674 A JP S6478674A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- electric
- heat conductivity
- optical
- electric part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Mounting And Adjusting Of Optical Elements (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To reduce the effect of a thermal load onto an electric part by placing optical and electric parts respectively via a solder layer on the comparatively high and low parts of the thermal conductivity of a circuit board and soldering both parts on the board by heating the board by a heating plate. CONSTITUTION:A substrate 1 is composed of the metal sheet 2 of high heat conductivity and the glass fiber cored lamination sheet 3 of low heat conductivity. And optical parts 5, 5 are placed on the metal sheet 2 of high heat conductivity via a solder layer 4. Also, electric parts 6, 6... are placed on the lamination sheet 3 of low heat conductivity via solder layers 4, 4... when the substrate 1 is heated by a heating plate 7 in this state, the heating curve of the optical part 5 and electric part 6 can be made about the same due to the difference in the heat conductivities, the time reaching the soldering temp. of both parts 5, 6 becomes about the same and the thermal effect onto the electric part 6 can be reduced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23775987A JPS6478674A (en) | 1987-09-22 | 1987-09-22 | Method for fixing optical part and electric part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23775987A JPS6478674A (en) | 1987-09-22 | 1987-09-22 | Method for fixing optical part and electric part |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6478674A true JPS6478674A (en) | 1989-03-24 |
Family
ID=17020029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23775987A Pending JPS6478674A (en) | 1987-09-22 | 1987-09-22 | Method for fixing optical part and electric part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6478674A (en) |
-
1987
- 1987-09-22 JP JP23775987A patent/JPS6478674A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW348370B (en) | Control apparatus comprising at least two housing parts | |
DE3587481D1 (en) | CIRCUIT SUBSTRATE WITH HIGH HEAT CONDUCTIVITY. | |
JPS5575282A (en) | Manufacturing method of semiconductor laser device | |
JPS57201058A (en) | Insulated semiconductor device | |
US3717742A (en) | Method and apparatus for forming printed circuit boards with infrared radiation | |
DE3783526D1 (en) | ELECTRIC COMPONENT. | |
JPS6478674A (en) | Method for fixing optical part and electric part | |
EP0434135B1 (en) | Method of positioning and soldering of SMD components | |
JPS5488885A (en) | Insulator target for sputtering device | |
JPS57192908A (en) | Fixing method for soldering | |
SE8302679D0 (en) | LODNINGSFORFARANDE | |
JPS55127044A (en) | Electric circuit substrate and its manufacture | |
JPS6450382A (en) | Plane-form heating body | |
JPH022560Y2 (en) | ||
JP2538130B2 (en) | Optical beam soldering method | |
JPS6482691A (en) | Attachment of surface mounting component to printed board | |
JPS6428944A (en) | Cooling structure of integrated circuit | |
JPS566459A (en) | Removing method of component carried on printed board | |
JPS5515294A (en) | Method for welding glass tube with zinc sulfide crystal plate | |
JPH0494590A (en) | Soldering method for electronic component | |
JPS6433989A (en) | Ceramic circuit board | |
JPS54107257A (en) | Semiconductor device mounting method | |
JPS5581065A (en) | Soldering method | |
EP0250386A3 (en) | Transparent heat radiation panel based on glass | |
KR880001031A (en) | Tape bonding apparatus and method |