JPS6477912A - Capacitor - Google Patents
CapacitorInfo
- Publication number
- JPS6477912A JPS6477912A JP23520387A JP23520387A JPS6477912A JP S6477912 A JPS6477912 A JP S6477912A JP 23520387 A JP23520387 A JP 23520387A JP 23520387 A JP23520387 A JP 23520387A JP S6477912 A JPS6477912 A JP S6477912A
- Authority
- JP
- Japan
- Prior art keywords
- extends over
- layers
- zinc
- over approximately
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title 1
- 229910001297 Zn alloy Inorganic materials 0.000 abstract 3
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 abstract 3
- 229910000679 solder Inorganic materials 0.000 abstract 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 2
- 239000011701 zinc Substances 0.000 abstract 2
- 229910052725 zinc Inorganic materials 0.000 abstract 2
- 229910020220 Pb—Sn Inorganic materials 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 230000002950 deficient Effects 0.000 abstract 1
- 230000000593 degrading effect Effects 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 239000007791 liquid phase Substances 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 239000007790 solid phase Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
PURPOSE:To strengthen and stabilize the electrical coupling of an electrode and an electrode leading out section by composing a first layer in the electrode leading out section of a copper-zinc alloy and constituting a second layer of solder. CONSTITUTION:Electrode leading-out sections 6, 7 are organized of first layers 6a, 7a, on which a copper-zinc alloy is flame-sprayed, and second layers 6b, 7b on which solder is flame-sprayed. It is preferable that the copper-zinc alloy, thickness of which extends over approximately 0.10-0.20mm and the ratio of the component of zinc of which extends over approximately 5-60wt.%, is used as the first layers 6a, 7a, and it is desirable that solder (an Sb-Pb-Sn alloy), thickness of which extends over approximately 0.20-0.40mm, a liquid phase point temperature of which extends over 195-215 deg.C and a solid-phase point temperature of which extends over approximately 189 deg.C, is employed as the second layers 6b, 7b. Defective tandelta is generated in small number when the ratio of the component of zinc extends over 75wt.%, and the melting point is elevated when the ratio is smaller than 5wt.%, and the film deterioration of a bridge surface is promoted, thus degrading charge and discharge characteristics.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62235203A JPH0770426B2 (en) | 1987-09-18 | 1987-09-18 | Capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62235203A JPH0770426B2 (en) | 1987-09-18 | 1987-09-18 | Capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6477912A true JPS6477912A (en) | 1989-03-23 |
JPH0770426B2 JPH0770426B2 (en) | 1995-07-31 |
Family
ID=16982605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62235203A Expired - Lifetime JPH0770426B2 (en) | 1987-09-18 | 1987-09-18 | Capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0770426B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0385715A (en) * | 1989-08-30 | 1991-04-10 | Matsushita Electric Ind Co Ltd | Method of forming electrode of electronic component |
JPH03241813A (en) * | 1990-02-20 | 1991-10-29 | Matsushita Electric Ind Co Ltd | Method of covering chip type electronic part |
JP2004119913A (en) * | 2002-09-30 | 2004-04-15 | Nichicon Corp | Film capacitor and its manufacturing method |
JP2006351830A (en) * | 2005-06-16 | 2006-12-28 | Hitachi Aic Inc | Metallized film capacitor |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101444598B1 (en) * | 2013-05-13 | 2014-09-24 | 삼성전기주식회사 | Multi-layered ceramic electronic part and board for mounting the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5329218A (en) * | 1976-08-31 | 1978-03-18 | Sumitomo Metal Ind Ltd | Production of ultralow carbon, 80 kg/mm2 high tensile steel plate |
JPS61119023A (en) * | 1984-11-15 | 1986-06-06 | 松下電器産業株式会社 | Metalized plastic film capacitor |
-
1987
- 1987-09-18 JP JP62235203A patent/JPH0770426B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5329218A (en) * | 1976-08-31 | 1978-03-18 | Sumitomo Metal Ind Ltd | Production of ultralow carbon, 80 kg/mm2 high tensile steel plate |
JPS61119023A (en) * | 1984-11-15 | 1986-06-06 | 松下電器産業株式会社 | Metalized plastic film capacitor |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0385715A (en) * | 1989-08-30 | 1991-04-10 | Matsushita Electric Ind Co Ltd | Method of forming electrode of electronic component |
JPH03241813A (en) * | 1990-02-20 | 1991-10-29 | Matsushita Electric Ind Co Ltd | Method of covering chip type electronic part |
JP2004119913A (en) * | 2002-09-30 | 2004-04-15 | Nichicon Corp | Film capacitor and its manufacturing method |
JP2006351830A (en) * | 2005-06-16 | 2006-12-28 | Hitachi Aic Inc | Metallized film capacitor |
Also Published As
Publication number | Publication date |
---|---|
JPH0770426B2 (en) | 1995-07-31 |
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