JP2804532B2 - High-voltage feedthrough capacitor and method of manufacturing the same - Google Patents

Description

The present invention relates to a high-voltage feedthrough capacitor and a method of manufacturing the same. More specifically, the present invention is suitable for use as a noise filter for a magnetron used in a microwave oven. The present invention relates to an improved high-voltage feedthrough capacitor and a method of manufacturing the same.

(B) Conventional technology Conventionally, as feed-through capacitors for preventing radio noise leaking from a magnetron used in a microwave oven, Japanese Utility Model Publication No. 55-35803 (H01G 4/42) and Japanese Utility Model Publication No. 55-52665 (H01G) There is a capacitor as shown in 4/42).

Next, a conventional example will be described with reference to FIGS. 28 and 29. FIG. (1) is a cylindrical dielectric made of a through-type ceramic, (2) and (3) are first and second electrodes respectively disposed on both end surfaces of the cylindrical dielectric (1), and are powdery silver. (Ag) and paste Ag mixed with glass about 700-800 ℃
Is a thick film electrode formed by baking on the end face of the dielectric (1). Reference numeral (4) denotes a penetrating conductor, which is disposed so as to penetrate the inside of the cylindrical dielectric (1), and is provided with a first connection fitting (5).
It is electrically connected to the electrode (2) by soldering or the like.
(6) is an enlarged ground metal plate, which is in contact with and connected to the second electrode (3) by an upper bent portion (6b) provided with a through hole (6a). (7) is a silicone insulating tube through which the penetrating conductor (4) is inserted, and (8) and (8 ') are insulating resins such as epoxy resin, around the fitting (5) and the penetrating conductor (4). And is filled to insulate the tubular dielectric (1) and ensure insulation and moisture resistance of the tubular dielectric (1). (9) is polybutylene terephthalate (PBT)
An outer case made of synthetic resin made of, and (10) is an insulating cover.

The epoxy resin conventionally used as an insulating filler material shrinks during curing in the direction indicated by the arrows in FIGS. 29 (a) and (b) during curing, so that the cylindrical dielectric (1 A gap is generated between the inner wall (1a) and the interface of the filling epoxy resin. To explain this in more detail, in the through-type porcelain capacitor, the coefficient of linear expansion of the ceramic (1) is 1 to 10 × 10 ⁻⁶ / ° C., while that of the epoxy resin (8) (8 ′) is 1 to 10. 10x
Since the difference is 10 ^-5 / ° C and the difference is large, when a thermal shock test is performed, gaps and cracks occur at the interface (1a) between the ceramics (1) and the epoxy resin (8) due to residual stress, and charge concentration occurs. Occurs, and the withstand voltage decreases. In such a state, moisture enters the inside of the feedthrough capacitor in the moisture resistance test. To prevent this, an elastic insulating tube (7) made of silicone or the like is provided.

Since the feedthrough capacitor thus configured is mounted in the shield case of the magnetron, it is always exposed to high temperatures. In a microwave oven, a cooling fan sends air to the cooling fins of the magnetron body, and also sends air to the feedthrough condenser to cool it. Nevertheless, the temperature around the magnetron anode is about 300 ° C, and the feedthrough capacitor is always 100
Exposure to high temperatures of ~ 120 ° C, sometimes up to 150 ° C. It is also conceivable that the temperature may reach 180 to 200 ° C in the event of an abnormality.

Furthermore, recently, the type that integrates a microwave oven and an oven has been commercialized, and the cooling capacity has been reduced due to the cost reduction of the microwave oven. It's getting tougher. However, for example, at 150 ° C., the epoxy resin softens, the deterioration proceeds rapidly, and interfacial peeling occurs.
The conventional feedthrough capacitor is in a limit state.

To solve these problems, resins with heat resistance of around 200 ° C have been recently developed, but have high hardness, which causes cracks and tears in the element due to cure shrinkage and residual stress during thermal shock. Also, sufficient pressure resistance and reliability cannot be obtained due to gaps or peeling off at the interface.

In general, silicone rubber has a heat resistance of about 200 ° C. and is known to be elastic. However, since it is not adhesive, it can be used as a filler for insulating a through-type porcelain capacitor. ) Is not used as a filler because of the drawback that moisture enters from between the silicone rubber and silicone rubber and causes insulation failure. To solve this problem, there is a method of applying a primer to an adherend. However, it is difficult to apply the primer and it is difficult to control the primer layer, so that stable insulation and moisture resistance cannot be obtained.

When driving the magnetron, the feedthrough capacitor should be 7 ~.
Since a high voltage of 8 kV is applied, a withstand voltage of more than 10 kV is required.

Thus, the feedthrough capacitor has (i) a withstand voltage,
Although extremely strict characteristics and reliability are required in terms of (ii) heat resistance and (iii) thermal shock resistance, conventional capacitors do not completely satisfy these requirements. Furthermore, (iv) one of the important characteristics required for the feedthrough capacitor is tracking resistance. This is to evaluate the withstand voltage when moisture condenses on the surface of the feedthrough capacitor due to a rapid temperature change. Conventional insulating cases (9) and insulating covers (10) made of organic polymers have poor tracking resistance, and once leaking along the outside of the case, the organic polymer is carbonized, resulting in a short circuit. There was a problem that would.

(C) Problems to be Solved by the Invention Conventionally, since silicone is used for the insulating tube (7), it is very expensive, and since it is inserted into the through conductor (4), the work is troublesome and the cost is high. I was
Further, when an epoxy resin is used as an insulating material, the usage limit is 150 ° C., and at a temperature higher than this, the insulating characteristics are rapidly deteriorated.

In order to solve such a problem, the present invention proposes a feedthrough capacitor using a self-adhesive silicone rubber as an insulating material. The breakdown voltage of the high-voltage feedthrough capacitor using this self-adhesive silicone rubber is 26 to
Although it is distributed at 40 kV (AC), the present invention aims to increase the yield of the capacitor by further concentrating this distribution on the high voltage side and further improve the reliability.

Further, there is a problem of tracking resistance on the surface of the exterior insulating case (9) and the insulating cover (10) in the conventional capacitor, but this is also solved.

As shown in FIGS. 19 and 20, the solder tunnel at the joint between the first electrode and the second electrode provided on both end surfaces of the cylindrical dielectric and the metal plate connected to them by soldering, respectively. There is a problem of poor insulation caused by leakage of silicone rubber from the gap.

Furthermore, as shown in FIG. 25, external force is applied to the faston tab (4a) of the through conductor (4) to cause cracks in the cylindrical dielectric (1), thereby causing insulation failure. There is. An object of the present invention is to provide a method for manufacturing an insulating material, a covering material, and a feedthrough capacitor that can solve such a problem.

(D) Means for Solving the Problems The present invention uses a silicone gel that expands and contracts very well or a self-adhesive silicone rubber as an insulating material to be filled inside a cylindrical dielectric.

In another embodiment, a Teflon coating or silicone grease is applied around the through conductor facing the inner peripheral surface of the cylindrical dielectric in the feedthrough capacitor, or a silicone tube or a Teflon tube [for example, polytetrafluoroethylene] is used. Fluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer 8
(PFA), a tube made of tetrafluoroethylene-hexafluoropropylene copolymer (FEP), etc.] or a self-adhesive silicone rubber, or a release layer that is difficult to adhere to, or the outer periphery of the through conductor is made of insulating resin. After plating with a metal having a relatively weak bonding force with the conductor, self-adhesive silicone rubber is filled as an insulating material between the cylindrical dielectric and the through conductor. Further, in another embodiment, when a self-adhesive silicone rubber is used as an insulating material for covering the cylindrical dielectric and the through conductor, a curing reaction is performed at a low temperature of 80 ° C. or less, and then heating is performed to 100 ° C. By performing a so-called step cure in which the reaction of imparting adhesiveness is performed at the high temperature described above, by eliminating the variation in the adhesion between the inside of the through-hole of the through-type dielectric and the self-adhesive silicone rubber, a high pressure resistance is achieved. In addition, variations in withstand voltage are reduced.

Further, in another embodiment, after filling and curing an insulating resin made of self-adhesive silicone rubber, a creeping discharge treatment is performed on the outer surface thereof.

In addition, in still another embodiment, when soldering to electrically connect the electrodes on both end surfaces of the cylindrical dielectric and the electrodes,
In order to solve the withstand voltage failure caused by the solder tunnel, the contact area between the electrodes on the end faces of the cylindrical dielectric and the metal plate to be soldered to them is reduced so as to make line contact.

Further, in another embodiment of the present invention (FIG. 26), the concave portion (26) having a weak strength is formed in the surface of the tab (4a) of the through conductor (4).
(26 ') and recesses (27) and (27') between the tab (4a) and the flange (13) and in a direction perpendicular to the tab surface, so that when an external force is applied to the tab (4a). , Cylindrical dielectric (1)
The Faston tab (4a) bends before cracking in the, so that external force is absorbed here.

(E) Action Among silicone resins, silicone gel having no complete cross-linked structure has good adhesiveness and a very large elongation, so there is no cure shrinkage, and no cylindrical dielectric (1) or through conductor (4) ) Absorbs and relaxes the stress due to thermal expansion, so it is resistant to heat resistance and heat shock. In addition, the self-adhesive silicone rubber is obtained by adding an adhesiveness-imparting component such as a silane coupling agent to a silicone rubber composition and imparting self-adhesiveness, and has very good adhesion to ceramics, metals, plastics, and the like. It also has extremely high insulating properties, absorbs stress due to thermal expansion, and is resistant to heat resistance and heat shock.

In another embodiment of the present invention (FIGS. 4 and 11), a tube made of a material which is difficult to adhere to a self-adhesive silicone rubber, such as silicone or Teflon, is used to cover an appropriate portion of the through conductor and to be placed on the through conductor. A release layer is provided, or a desired outer peripheral surface of the through conductor is plated with nickel or the like having a relatively weak bonding force with the self-adhesive silicone rubber as shown in FIG. A non-adhesion region is provided at a portion corresponding to the inner peripheral surface, and at both ends of the through conductor, the through conductor and the self-adhesive silicone rubber are bonded so that no gap is generated.

Further, in another embodiment of the present invention (FIGS. 10 and 11), the self-adhesive silicone rubber is directly exposed without using the outer insulating case (9) and the insulating cover (10). . Since the silicone rubber has a so-called water repellency that repels water, even if moisture is condensed on the surface of the self-adhesive silicone rubber, the water droplets immediately flow down, so that the tracking resistance is improved. Furthermore, unlike organic polymers used for conventional insulating cases and the like, silicone rubber does not contain carbon and is flame-retardant,
Even if creepage occurs and creepage leakage occurs on the outer side of the feedthrough capacitor, it does not carbonize, so that it immediately returns to the original insulating state.

As described above, the self-adhesive silicone rubber is obtained by adding an adhesiveness-imparting component such as a silane coupling agent to a silicone rubber originally having no adhesiveness, thereby imparting self-adhesiveness. In general, when a temperature of 100 ° C. or more is applied, a curing reaction and an adhesion reaction occur in 1 to 2 hours. Of these two reactions, the adhesive reaction requires a temperature of 100 ° C. or more, but the curing reaction takes place at room temperature if it takes a long time. In general, when a self-adhesive silicone rubber is used for casting, it is usually convenient to heat the mixture to 100 ° C. or higher to simultaneously perform the above two reactions. In the present invention, the above two reactions are performed separately. That is, the curing reaction is sufficiently performed at a low temperature, and the bonding reaction is performed after the curing is completed. By doing so, expansion of the through conductor during curing can be suppressed as much as possible.

Further, in another embodiment of the present invention, a self-adhesive silicone rubber of a heat-curable type has good adhesiveness so that no gap is generated, and the insulating property and the moisture resistance are improved. By applying a creeping discharge treatment to the outer surface of the cured insulating resin in Fig. 11 and Fig. 11, the outer surface of the insulating resin is smoothed, and the dust or dust adhering to the outer surface is generated by carbonization or water droplet adhesion. To reduce creeping leaks.

Further, in the embodiment of the present invention (FIGS. 21, 22, and 23), the flange portions of the through conductors respectively contacting the first electrode and the second electrode provided on both ends of the cylindrical dielectric. Since the shape of the abutting portion and the shape of the joining portion of the grounding metal plate are narrowed linearly, the abutting area of each abutting portion is small, and the abutting portions are substantially in line contact. The gap at the contact portion is hardly generated. Therefore, the solvent and the flux in the cream solder are easily eluted, and voids are hardly generated. Also, a solder tunnel is unlikely to occur.

In another embodiment of the present invention (FIG. 26), when an external force is applied to the faston tab (4a), the faston tab (4a) is recessed (26) before the cylindrical dielectric (1) is cracked.
By bending at (26 ') or (27) (27'), external force is absorbed here to prevent damage to the cylindrical dielectric (1).

(F) Embodiment FIG. 1 shows an embodiment of the present invention, and the same reference numerals as those in FIGS. 28 and 29 denote the same parts. In this embodiment, the inside of the cylindrical dielectric (1) is filled with a silicone gel (11) having a penetration of 60 and an elongation of 850% according to JIS standards. The outside of the cylindrical dielectric (1) is filled with an epoxy resin (12) having a Shore hardness of D-90 according to JIS and cured, and has a strength of 15 kg · f in the axial direction of the through conductor (4). Let

FIG. 2 shows another embodiment of the present invention, in which a silicone gel (11) having a penetration of 60 and an elongation of 850% is filled inside and outside the cylindrical dielectric (1). An epoxy resin layer (12) (12 ') having a Shore hardness of D-90 is formed thereon. By adopting such a two-layer structure, the moisture resistance is further improved, and 15 kg · f in the axial direction of the through conductor (4).
Strength can be provided.

In this way, the stress caused by the thermal expansion of the outer case (9) and the cylindrical dielectric (1) during the heat resistance test and the heat shock test can be absorbed and reduced. If such a silicone gel is filled into a cylindrical dielectric, the silicone gel may be too hard, and a self-adhesive silicone rubber having a much higher hardness may be used.

Next, an embodiment using a self-adhesive silicone rubber will be described with reference to FIG. The same parts as those in FIG. 1 are denoted by the same reference numerals.

In FIG. 3, the through conductor (4) and the flange-like connection fitting (13) are formed by integral molding using a single metal rod by header processing. Connection of flange-shaped connection fitting (13) with electrode (2) and enlarged metal plate (6) and electrode (3) for grounding
Is connected using tin and silver (Sn-Ag) eutectic solder. The melting temperature is 220 ° C., which is higher than the melting temperature of 183 ° C. of the Sn—Pb eutectic solder, so that the heat resistance is good. In addition, exterior case (9)
The insulation cover (10) is made of PPS (polyphenylene sulfide) resin or PBT (polybutylene terephthalate) resin having good heat resistance. The thermal deformation temperature of this PBT resin is about 210 ° C, and that of PPS resin is 260 ° C.

As the self-adhesive silicone rubber (14) used as an insulating material, for example, self-adhesive silicone TSE3331 manufactured by Toshiba Silicone Co., Ltd. is used. This TSE3331 is a two-part type heat-curable silicone rubber, which is cured by heating. The two-pack type is obtained by mixing the main agent (A) and the curing agent (B).

Next, a method for manufacturing the feedthrough capacitor of the present invention will be described.

Next, the characteristics of the thus-produced feedthrough capacitor as shown in FIG. 3 will be described.

Figure 5 shows the temperature and breakdown voltage (BD
V .: Break Down Voltage), and FIG. 28A shows the characteristics of a conventional example as shown in FIG. 28 using an epoxy resin as an insulating material, and FIG. FIG. 3 shows a characteristic diagram of the present invention.

In addition, this measurement is performed as follows. That is,
In FIG. 5 (a), several samples are arbitrarily extracted from the samples of the same lot, placed in a silicone oil which is a high insulating material, and the silicone oil is heated to, for example, 120 ° C.
After holding for 10 to 15 minutes, applying an AC high voltage between the expanded metal plate (6) for grounding the through-type capacitor and the through-hole conductor (4) in silicone oil, the average breakdown voltage of several samples becomes It was 26.5 kV (AC). Other data are measured in the same manner.

In the conventional example shown in FIG. 5 (a), the dielectric breakdown voltage rapidly drops to a level exceeding 10 kV (A, C) at 150 ° C., and the breakdown voltage usually needs to be 10 kV (A, C) or more. This shows that 150 ° C. is the limit of use. On the other hand, the through-type capacitor of the present invention exhibited a breakdown voltage of 30 kV (A, C) even at 200 ° C. as shown in FIG. Call

Fig. 6 shows a sample 20 arbitrarily taken from the same lot.
It is a figure which shows the frequency distribution of the conventional breakdown voltage (BDV) of the conventional example at normal temperature (20 degreeC), and this invention about an individual. From this figure, it can be seen that the withstand voltage is improved as compared with the conventional example. FIG. 7 is a diagram showing a frequency distribution of a breakdown voltage (BDV) after leaving in a thermostat at 150 ° C. for 1000 hours for comparison of heat resistance. As shown in FIG. 7, in the conventional example, dielectric breakdown occurs at 10 ° C. or less at 150 ° C., but the characteristics of the example of the present invention show little change from the initial distribution in FIG. Fig. 8 shows the inside of a constant temperature bath at -40 ° C.
After repeating the thermal shock test for 30 minutes and then alternately in a thermostat at 150 ° C for 30 minutes for 200 cycles at room temperature (20
(° C) shows the frequency distribution of the breakdown voltage of 10 samples. As can be seen by comparing FIG. 6 with FIG. 6, the breakdown voltage in the conventional example is very low after the thermal shock test, but in the example of the present invention, the distribution does not change from the initial state. ing.

Next, another embodiment of the present invention is shown in FIG. In this embodiment, Teflon coating, silicone grease, or a silicone tube or a Teflon tube [for example, polytetrafluoroethylene (PTFE)] is provided around the through conductor (4) facing the inner peripheral surface of the cylindrical dielectric (1). ), Tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), and tetrafluoroethylene-
Hexafluoropropylene copolymer (FEP) tube] and other self-adhesive silicone rubber (for example, TSE 3331 manufactured by Toshiba Silicone Co., Ltd.)
The dielectric (1) facing the inner peripheral surface is provided to be slightly longer than the axial length. After providing such a release layer (15), a self-adhesive silicone rubber (for example, between the cylindrical dielectric (1) and the through conductor (8))
TSE3331) (14) is filled as an insulating material.

In this case, the through conductor (4) does not adhere to the cast self-adhesive silicone rubber (14), but the tubular dielectric (1) and the self-adhesive silicone rubber (14) adhere well. As a result, no separation between the cylindrical dielectric (1) and the self-adhesive silicone rubber (14) occurs due to residual stress when a thermal shock is applied as in a thermal shock test,
Since the penetrating conductor (4) at a portion away from the release layer (15) is firmly bonded by the self-adhesive silicone rubber (14), the moisture resistance, temperature resistance, and voltage resistance characteristics are extremely good. In this case, since the silicone tube used is merely for providing a release layer, the conventional silicone tube is used.
The thickness of the silicone tube used in Figure 28 (about 0.5 mm)
It may be much thinner (eg, about 0.1 mm) and less elastic.

Next, another embodiment of the present invention will be described. This is because the self-adhesive silicone rubber hardly adheres around the through conductor (4) facing the cylindrical dielectric (1) instead of the release layer (15) made of Teflon coating or the like in the embodiment of FIG. The present invention is characterized in that the nickel plating is provided to be longer than the axial length of the opposing dielectric (1). In this way, the same effect as that shown in FIG. 3 can be obtained even if plating is performed that is difficult to adhere to the self-adhesive silicone rubber (14).

In a high-voltage feedthrough capacitor connected to a power supply line such as a magnetron or the like, two through-conductors (4) are required. Therefore, an actual feedthrough capacitor is a cylindrical type as shown in FIG. Dielectric (1)
(1 '), through-conductor (4) provided with flange-shaped connection fittings (13) (13') from one metal rod by header processing
(4 '), the enlarged metal plate for grounding (6), the outer case (not shown), and the insulating cover (not shown) are combined, and self-adhesive silicone rubber (not shown) is formed by the method described above. Fill it and make it. (4a) and (4a ') denote faston tabs, which serve as male terminals of connector fittings, and are inserted and connected to female terminal sockets (faston receptacles) on the microwave oven side.

Next, another embodiment of the present invention will be described with reference to FIG. In the high-voltage feedthrough capacitor of this embodiment,
The self-adhesive silicone rubber is directly exposed without using the outer insulating case (9) and the insulating cover (10).

Describing the manufacturing method of this embodiment, there is a step of removing the mold (Teflon) after the step of the manufacturing method of the embodiment of FIG.

Note that a Teflon mold is used for casting. Teflon does not adhere to silicone, so the mold can be easily removed. Also in this case, characteristics similar to those shown in FIGS. 6, 7, and 8 are obtained.

Next, the following test was conducted for tracking resistance. That is, a penetrating capacitor is hung on a top plate of a resin box having a length of 30 cm, a width of 30 cm, and a height of 40 cm, and water is sprayed from below using an ultrasonic humidifier. In this state, 5 kv (A) is set between the through conductor (4) of the feedthrough capacitor and the ground metal plate (6).
C) is applied. Then, 10 mA was selected as the cutoff current, the time from the start of discharge to the start of the 10 mA current flowing between the penetrating conductor (4) and the metal plate (6) was measured, and the voltage was temporarily measured at the next point. Stop the application. Then, the surface of the discharged capacitor element is wiped with a dry cloth, and a second test is performed. Hereinafter, measurement is performed in the same manner as in the third and fourth measurements. Table 1 shows the test results of three randomly taken samples. In this table, in the fourth test shown in FIG. 10 of the embodiment of the present invention, since no discharge occurs even after 200 minutes of measurement, the positioning was terminated halfway thereafter.

As can be seen from Table 1, in the conventional example (FIG. 28), once discharged, the outer case (9) and the insulating case (10) are carbonized, a current path is formed, and a short-circuit path is completed on the case surface. Once discharged, it becomes defective and cannot be used. On the other hand, in the present invention, since the current path cannot be formed, the state returns to the original state any number of times, and the tracking resistance is improved.

Next, another embodiment of the present invention is shown in FIG. In this embodiment, a self-adhesive material such as a Teflon coating, a silicone grease or a silicone tube is provided around the through conductor (4) facing the cylindrical dielectric (1) in FIG. 10 as in the case of FIG. Release layer (15) that is difficult to adhere to silicone rubber (for example, TSE3331 manufactured by Toshiba Silicone Co., Ltd.)
Are provided slightly longer than the axial length of the opposing dielectric (1). After providing such a release layer (15), a self-adhesive silicone rubber (for example, TSE3331) (14) is filled as an insulating agent between the cylindrical dielectric (1) and the through conductor (4). Therefore, the same characteristics as in the case of FIG. 4 are obtained.

Still another embodiment will be described with reference to FIG. This embodiment is characterized in that the surface of the through conductor (4) is provided with a layer (16) plated with a metal having a relatively low adhesion to a self-adhesive silicone rubber (14) such as nickel, and the through conductor (4) is provided. )
Is that a non-adhesion region is formed at the center of the.

Hereinafter, a method for forming the non-adhesion region (17) will be described with reference to FIGS. 12 and 13. The assembling of the capacitor element is the same as that of FIG. 10, and the through conductor (4) penetrates through the inside of the cylindrical dielectric (1). The first electrode (2) on the dielectric (1) is electrically connected by soldering or the like. The other second electrode (3) of the cylindrical dielectric (1) is connected to an upper bent portion (6b) provided on the enlarged ground metal plate (6). Then, by filling and curing the self-adhesive silicone rubber (14), a high-voltage feedthrough capacitor is formed.

Here, as shown in FIG. 13, when the self-adhesive silicone rubber (14) is filled and cured, the center of the surface of the through conductor (4) where the cylindrical dielectric (1) is disposed outside is provided. In the portion, the force (F ₁ ) of the self-adhesive silicone rubber (14) trying to adhere to the inner wall (1a) of the cylindrical dielectric (1) and the self-adhesive silicone rubber (14) to the through conductor (4) The bonding force (F ₂ ) works in opposition. In general, the shear bond strength between the inner wall (1a) of the cylindrical dielectric (1) and the self-adhesive silicone rubber is as high as about 15 kg / cm ² ,
The shear bonding strength between the through conductor (4) and the self-adhesive silicone rubber (14) is relatively weak at about 7 kg / cm ² . Therefore, the force of (F ₁ -F ₂ ) acts outward as a whole, and the self-adhesive silicone rubber (14) is pulled toward the inner wall side of the cylindrical dielectric (1), and the non-conductive silicone rubber (14) is not placed on the through conductor (4). An adhesion area (17) is formed.

Further, since the cylindrical dielectric (1) is not provided for the other portion of the through conductor (4), the through conductor (4)
Only the force (F ₂ ) of the self-adhesive silicone rubber (14) trying to adhere acts to the through conductor (4).

As a result, the penetrating conductor and the self-adhesive silicone rubber (14) are bonded at both ends of the penetrating conductor (4), and a non-bonding area (17) is formed at the center of the penetrating conductor (4). The through conductor (4) and the self-adhesive silicone rubber (14) are separated from each other. Therefore, the expansion of the through conductor (4) due to a rapid temperature change or the like can be suppressed as much as possible, and the stress due to the temperature change can be suppressed as much as possible to the self-adhesive silicone rubber (14). Degradation can be suppressed.

Next, a method for effecting a curing reaction of a self-adhesive silicone rubber according to another embodiment of the present invention will be described with reference to FIG.

Example (1) As the self-adhesive silicone rubber (14) used as an insulating material, for example, a self-adhesive silicone TSE3331 manufactured by Toshiba Silicone Co., Ltd. is used. This TSE3331 is a two-part type heat-curable silicone rubber. The two-pack type is obtained by mixing the main agent (A) and the curing agent (B).
In this embodiment, the outer case (9) and the insulating cover (10) are not used, and the self-adhesive silicone (14) is directly exposed.

Next, the operation of the present invention will be described in detail. Before that, first, a conventional manufacturing method in which a curing reaction and an adhesion reaction are simultaneously performed at a high temperature of 100 ° C. or higher, and a dielectric breakdown voltage (BDV; Break) of a high-voltage feedthrough capacitor using self-adhesive silicone rubber as an insulating material. Down Voltage) characteristics will be described. After a dielectric breakdown test of a feed-through capacitor manufactured by the conventional manufacturing method, it was
The element destroyed at about 32 kVAC) is a discharge between the inside of the through hole of the through dielectric (1) and the interface between the silicone rubber, and the element destroyed at a high voltage (about 34 to 40 kVAC) is the through dielectric. His body had been broken apart. The cause of the appearance of the two types of destruction modes is considered to be a variation in the adhesion between the inside of the through hole of the through dielectric and the silicone rubber.

FIG. 14 shows characteristics of a conventional manufacturing method in which a curing reaction and an adhesive reaction are simultaneously performed at a high temperature. That is, FIG.
This indicates a time of heating at a high temperature of not less than ° C, in which a curing reaction and an adhesion reaction proceed simultaneously. If a temperature of 100 ° C. or more is applied at the time of curing, the self-adhesive silicone rubber is cured and adheres in a state where the through conductor expands. At this time, the metal penetrating conductor (4) is thermally expanded in the direction of the thick arrow to become thick. FIG. 14 (b) shows a room temperature condition. When the room temperature condition is reached, the through conductor (4) contracts.
The self-adhesive silicone rubber layer is pulled by the through conductor,
The residual stress is as shown by the dashed arrow.

FIG. 15 shows the characteristics in the case of manufacturing by performing the two-stage step carry of the present invention. FIG. 15 (a) shows a low temperature heating in which only the curing reaction proceeds, and the expansion of the through conductor (4) is small. FIG. 15 (b) shows that only the adhesive reaction is progressing by heating at a high temperature, and the self-adhesive silicone rubber (14) expands in the direction of the thick line arrow at the time of the adhesive reaction, and the direction of the thin broken arrow is increased. Has been pushed. However, when the temperature returns to the room temperature shown in FIG.

As described above, in the conventional manufacturing method, the silicone rubber layer is pulled and subjected to stress in the direction of peeling off the adhesive, whereas according to the manufacturing method of the present invention, the silicone rubber layer is simply pushed and the direction of peeling off the adhesive is removed. No stress is applied. Also, the strength of silicone rubber is stronger when pressed than when pulled.

In order to suppress the influence of the expansion of the through conductor (4), it is preferable to use a metal material having a small linear expansion coefficient for the through conductor. That is, as can be seen from the description of FIGS. 14 and 15, since it is desirable to suppress the thermal expansion of the through conductor (4) as much as possible, a metal material having a small linear expansion coefficient is used. For example,
Amber (36Ni-Fe, 2.0 × 10 ^-6 ), 42 alloy (42Ni-F
e, 6.5 to 7.0 × 10 ⁻⁶ ), Fe (11.5 × 10 ⁻⁶ ), or the like may be used.

Next, a method for manufacturing the feedthrough capacitor of the present invention will be described. The following steps are identical to those of the embodiment of FIG. 3, and the features of the embodiment of the present invention shown in FIG. That is, Since the Teflon mold does not adhere to the silicone rubber, it can be easily removed. Further, even if an insulating case or an insulating cover is used, it does not affect the inside of the through-hole of the through-type dielectric and the adhesion of the silicone rubber.

Example (2) Since the TSE3331 used in Example (1) is generally used to simultaneously carry out the curing reaction and the adhesion reaction described above, the curing reaction speed at a low temperature is extremely slow, and the work is difficult. Poor. This is because a large amount of a reaction delaying agent is included in order to lengthen the pot life (operable time: time until the initial viscosity doubles) (8 hours). Therefore, in Example (2), the structure and manufacturing method of the feedthrough capacitor are exactly the same as in Example (1), and only the self-adhesive silicone used is changed.

That is, a self-adhesive silicone rubber with a reduced reaction retarder is used so that the curing reaction proceeds rapidly at a low temperature. For example, XE14-804 manufactured by Toshiba Silicone is used. The silicone rubber cures at 50 ° C. for 2 hours and adheres at 120 ° C. for 1 hour, thereby shortening the working time. However, pot life
Shorter than TSE3331 (1 hour). FIGS. 16 and 17 show the initial breakdown voltage distribution in order to evaluate the withstand voltage of the thus formed feedthrough capacitor. FIG. 16 shows a frequency distribution in the case of the conventional manufacturing method, which is widely distributed from a low voltage to a high voltage. FIG. 17 shows the frequency distribution in the case of the manufacturing method of the present invention, and it can be seen that the distribution is concentrated on the high voltage. FIGS. 16 and 17 show the frequency distribution of the initial breakdown voltage (BDV) at room temperature (20 ° C.) for 20 samples arbitrarily taken from the same lot.

Further, another embodiment of the present invention (for example, FIG. 10) is characterized in that a creeping discharge treatment is applied to the high-voltage feedthrough capacitor configured as described above.

Hereinafter, the creeping discharge treatment method will be described in detail. First, a high-voltage feedthrough capacitor filled and cured with a self-adhesive silicone rubber is placed in a humid sealed enclosure.
In addition, as a method of forming a humid state, an ultrasonic humidifier or the like is provided in a closed housing and sprayed with water. Next, in this humid housing, the cut-off current is set to 10 mA between both terminals of the high-voltage feedthrough capacitor, and an AC voltage of 5 KV is applied. This state is maintained until the first discharge occurs on the outer surface of the capacitor element. Thereafter, the creeping discharge process is repeated again.

Hereinafter, Table 2 shows the number of discharges and the time until the discharge for each sample (A, B, C).

As is clear from Table 2, when the creeping discharge treatment was performed only twice, each of the samples A, B, and C discharged again within one hour. On the other hand, creeping discharge treatment
The discharge performed three times did not discharge even after 3 hours.

This is for the following reason. That is, (a) by applying a creeping discharge treatment to a self-adhesive silicone rubber having a rough surface, an insulating substance (SiO ₂ ) is generated on the outer surface of the self-adhesive silicone rubber; Rubber is easily charged with static electricity, so dust easily adheres to its surface, but the insulating material (SiO ₂ ) is hardly charged, so it is difficult for dust to adhere, and (c) this insulating material is made of self-adhesive silicone rubber. By being generated on the outer surface, the outer surface of the self-adhesive silicone rubber becomes smooth, and in the conventional self-adhesive silicone rubber having a rough outer surface, dust, water droplets, etc. easily adhere to the outer surface, and the dust Although short-circuiting due to carbonization and water droplets is likely to occur, in this embodiment, since the outer surface of the silicone rubber is smooth, even if moisture is condensed, it flows down immediately and dust is generated. Rinikui. These factors work together to suppress creepage leakage.

Next, still another embodiment of the present invention will be described. Before that, the junction and the cylinder of the first electrode (2) and the connecting metal plate (5) on the ceramic cylindrical dielectric in the high-voltage feedthrough capacitor are described. The problem that solder missing portions and voids are likely to occur at the joint between the second electrode (3) made of the dielectric dielectric and the ground metal plate (6) will be described. That is, as shown in FIG. 18, the upper and lower end surfaces of the cylindrical dielectric body 1 made of ceramic are made of silver (Ag) or Ag.
-Pa baked electrodes (2) and (3) are formed, and the joint (18) of this electrode (2) with the connection metal plate (13) and the connection of the electrode (3) with the ground metal plate (6). The joint (19) is connected by cream solder (18a) (19a). This cream solder contains a large amount of solvent to facilitate printing, and is in the form of a paste. This solvent or solder flux usually elutes completely outside when the solder is melted, or volatilizes in air.However, depending on the amount of cream solder applied, the heating temperature, and the time of the heating temperature, the solder layer Air bubbles (18b) and (19b) are generated in the solder layer. This is because the contact area between the electrode (2) and the connection metal plate (15) and between the electrode (3) and the connection metal plate (6) are large and are in surface contact. When a large amount of voids are generated in the joints (18) and (19), the joint strength of the electrodes (2) and (3) with the metal plates (13) and (6) decreases. Even if the solder is washed after the solder is attached, a residual flux is likely to remain. When the silicone rubber according to the embodiment of the present invention is used as the insulating resin (14) (14 '), the residual flux adheres. Affects the reaction. This is because the flux exerts a curing inhibition on the addition type silicone rubber. In addition, in the case of joining by surface contact, if the accuracy of each flatness is not good, a gap occurs and a solder tunnel occurs. When a solder tunnel occurs, resin leakage (20) occurs as shown in FIG. 19, causing a breakdown voltage failure. The reason is as follows. That is, as shown in FIG. 19, a Teflon mold (21) is mounted at a predetermined interval from the outer periphery of the cylindrical dielectric (1), and silicone rubber (14) is injected from the direction of arrow (A). Leaks through the gap of the solder tunnel (19c) into the inner peripheral surface of the through hole of the ceramic body (1) and the inside of the grounding metal plate (6). In this state, the silicone rubber is cured, and then inverted as shown in FIG. 20, a Teflon mold (22) is attached, and the silicone rubber (14 ') is injected from the opposite side in the direction of arrow (B). The silicone rubber (20) leaked and cured earlier does not adhere to the silicone rubber (14 ') injected later, and the periphery of the silicone rubber leaked earlier is also less likely to adhere. When such an adhesion failure occurs, a breakdown voltage failure is caused.

Next, another embodiment of the present invention capable of solving such a problem is shown in FIGS. This is the contact portion of the flange portion (13) of the through conductor (4) provided on both end surfaces of the cylindrical dielectric (1) and contacting the first electrode (2) and the second electrode (3), respectively. The shape of (23) and the shape of the joint (24) of the grounding metal plate (6) are narrowed linearly. That is, the 21st
In the figure, the grounding metal plate (6) stands up so that the shape of the contact portion (23) is sharp and sharp, and the shape of the bonding portion (24) of the grounding metal plate (6) is the thickness of the plate. It has a raised shape. In FIG. 22, the shape of the through-conductor (4) on the side of the flange (13) is the same as that of FIG. 21, but the shape of the joint (24) of the ground metal plate (6) is shown in FIG. The edge of the ground metal plate (6) is further sharpened than the second electrode (3).
Up to approximately 45 ° with respect to the surface of
It is cut so as to be perpendicular to the surface of the electrode (3).

In FIG. 23, the shape of the joint (24) of the grounding metal plate (6) is bent to eliminate the influence of burrs at the time of pressing. In this case, the state of soldering (23a) (24a)
Shown in the figure.

21 to 24, the solvent in the cream solders (23a) and (24a) elutes outside the solder while being volatilized during the heating and melting of the solder layer. Are not left at all, and no voids are generated.
This is because the contact area between the contact part (23) and the joint part (24) is extremely small, and is in substantially line contact. Also, in this case, a gap is less likely to occur at the joint portion than in the case of the conventional surface contact, and therefore, a solder tunnel is also less likely to occur.
As described above, in these embodiments, since the voids in the solder layer and the solder tunnel hardly occur, the phenomenon that the silicone rubber leaks to the other side of the cylindrical dielectric (1) through the solder tunnel does not occur. Therefore, the withstand voltage failure is reduced, and the bonding strength is improved, so that the reliability is improved.

Next, another embodiment of the present invention will be described in which a crack or the like does not occur in the cylindrical dielectric (1) even when an external force is applied to the through conductor.

That is, in the embodiment shown in FIG. 9, an arrow (A) or (A ') as shown in FIG.
Direction, or a force in a direction perpendicular to the arrows (A) and (A '), that is, a force in the direction (B) and (B') perpendicular to the face of the faston tab (4a). When it is obtained, the flange (13) of the through conductor (4) and the first on the cylindrical dielectric (1)
Cracks (cracks) (25) may occur in the tubular dielectric (1) around the solder joint (18) joining the electrode (2). That is, the arrow (A) or (A ') at the tip of the faston tab (4a), or 4 kg at (B) or (B').
When the above force is applied, a crack (25) is formed. When a high voltage is applied in this state, insulation failure occurs. The force is applied to the faston tub (4a) when the high voltage feedthrough capacitor is mounted on the magnetron (not shown) of the microwave oven, after the magnetron is inspected, and when the magnetron is mounted on the microwave oven. Under normal handling, no breakage occurs near the solder joint (18) of the cylindrical dielectric (1). However, if the user tries to forcibly attach the Faston tab (4a) to the mounting part of the microwave oven, or tries to remove the Faston tab (4a) once attached, or if excessive force is applied to the Faston tab due to dropping, etc. May lead to destruction. If a crack occurs around the solder joint (18), the crack is not covered by the silicone rubber, so it cannot be determined that the appearance is defective. For this reason, a breakdown voltage failure occurs in the final inspection. There is a problem of insulation failure due to such cracks in the cylindrical dielectric.

Next, another embodiment of the present invention capable of preventing such a crack in the cylindrical dielectric will be described with reference to FIG. 26th
In the figure, the flange portion (13) is formed integrally with the iron through conductor (4) by header press processing. Next, recesses (26) (26 ') parallel to each other on both sides of the Faston tab (4a)
And recesses (27) (27 ') are provided between the faston tab (4a) and the flange (13) in a direction perpendicular to the surface of the tab (4a) and parallel to each other. The surface of the tab is plated with nickel or tin.

Now, the thickness (t ₁ ) between the recesses (27) and (27 ′) and the force (F ₁ ) applied to the tip of the tab (4a) cause the tab to become concave (2).
7) The relationship with the magnitude of the force at the start of bending in (27 ') is as shown in Table 3. _{Incidentally, L 1 = 17mm, L 2} = 8.
5 mm, L ₃ = 19 mm, W ₁ = W ₂ = 1 mm.

The recess (26) (26 ') wall thickness between the (t _2), the force (F ₂₎ of the tab (4a) tab recess by applying to the tip (2
6) The relationship with the magnitude of the force at the start of bending in (26 ') is as shown in Table 4.

According to the experiment of the present inventor, since the dielectric damage near the solder joint of the first electrode (2) of the cylindrical dielectric (1) occurs at 4 kg for both (F ₁ ) and (F ₂ ), As can be seen from Tables 3 and 4, the thickness (t ₁ ) of the recesses (27) and (27 ′) is 0.
There is no effect unless the thickness (t ₂ ) of the concave portions (26) and (26 ′) is 0.6 mm or less. However, if the thicknesses (t ₁ ) and (t ₂ ) are made too thin, the tab (4a) may be bent by a small external force during the work of attaching the feedthrough capacitor to the magnetron and the microwave oven and during the inspection process. Bad appearance.

When the microwave oven is operated, about 10
Since the current of (A) flows, if the thicknesses (t ₁ ) and (t ₂ ) are too thin, heat generated by Joule heat increases. Furthermore,
It is limited from standards in various countries, for example, L ₂ is because the BS standard L ₂ = 7.9 mm, the DIN standard, which is L ₂ = 8 mm, in order to satisfy these, L ₂ is greater than or equal to 8 mm.

Thus, the recesses (27) (27 ') and (26) (26')
When the external force (F ₁ ) (F ₂ ) is applied, the tab bends at the concave portion (27) (27 ′) or (26) (26 ′) before the cylindrical dielectric (1) is damaged. This absorbs external force and prevents breakage of the dielectric.

FIG. 27 shows an actual high voltage feedthrough capacitor of the present invention assembled using two through conductors (4) of FIG.

(G) Effect of the Invention As described above, according to the high-voltage feedthrough capacitor of the present invention, the characteristics of withstand voltage, heat resistance, and thermal shock resistance are significantly improved as compared with the conventional example. There is a great effect that there is no problem even if they are continuous.

In the embodiment as shown in FIGS. 10 and 11, the outer periphery of the cylindrical dielectric (1) is covered only with the insulating resin made of self-adhesive silicone, so that the tracking resistance characteristic is greatly improved. To improve.

Further, in the embodiment as shown in FIG. 4, a self-adhesion of a Teflon coating, a silicone grease or a silicone tube or a Teflon tube around the through conductor (4) facing the inner peripheral surface of the cylindrical dielectric (1). Since the release layer (15) that does not easily adhere to the conductive silicone rubber is provided, the through conductor (4) does not adhere to the self-adhesive silicone rubber (14), but the inner peripheral surface of the cylindrical dielectric (1) does not adhere. And the self-adhesive silicone rubber (14) are well adhered, so that the self-adhesive silicone rubber does not peel off at all even by thermal shock. In this case, since the insulating tube is not inserted into the through conductor, not only is the workability good and the cost can be reduced, but also a stable and excellent through-type capacitor having moisture resistance, heat resistance, and voltage resistance can be obtained. can get. Furthermore, the twelfth
In the embodiment shown in the figure, the surface of the through conductor is plated with a metal having a relatively weak bonding force, so that a non-adhesive region can be formed in the center of the through conductor, and the self-adhesion due to temperature change can be achieved. Prevents degradation of conductive silicone rubber,
A through-type capacitor having more excellent heat resistance can be obtained.

In another embodiment of the present invention, when coating with an insulating resin made of a self-adhesive silicone rubber, a curing reaction is carried out at a low temperature, and then a heating is carried out to cause a bonding reaction at a high temperature. Thus, variations in characteristics can be reduced, and the withstand voltage characteristics are improved, and a highly reliable feedthrough capacitor can be obtained as a whole.

Further, in another embodiment, since the creeping discharge treatment is performed on the outer surface of the self-adhesive silicone rubber, the creeping leak can be suppressed.

Further, in the embodiment shown in FIGS. 21, 22, and 23, the shape of the joint portion of the through conductor that is in contact with the first electrode and / or the second electrode becomes substantially linear. As a result, voids and solder tunnels in the solder layer are reduced, and the leakage of the self-adhesive rubber is also eliminated. Accordingly, the pressure resistance failure is reduced, the bonding strength is improved, and the overall reliability is improved. Further, in the embodiment as shown in FIG. 26, since the through conductor is provided with a concave portion for absorbing external pressure, even if a force is applied to the through conductor from the outside, the pressing force is absorbed in the concave portion, There is no fear that the cylindrical dielectric will be damaged, and furthermore, a defect can be judged from the appearance by bending in the concave portion.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1, FIG. 2, FIG. 3, and FIG. 4 are all cross-sectional views of the high-voltage feedthrough capacitor of the present invention, FIG.
7 and 8 are comparison diagrams of the characteristics of the capacitor of the present invention and the conventional example, FIG. 9 is an exploded perspective view of the specific structure of the present invention, and FIG. 10, FIG. 11 and FIG. 13 is a cross-sectional view of a high-voltage feedthrough capacitor according to another embodiment of the present invention.
FIG. 1 is a drawing showing the direction of adhesion of the self-adhesive silicone rubber of the present invention. FIG. 1 (a) is an enlarged view of a main part of FIG. 12, and FIG. , FIG. 14 and FIG. 15 are drawings for explaining the internal operation of the conventional method and the manufacturing method of the present invention, respectively. FIGS. 16 and 17 are frequency distribution diagrams of breakdown voltage in the case of the conventional method and the manufacturing method of the present invention, respectively. FIGS. 18, 19 and 20 show the first and second examples of the cylindrical dielectric.
FIG. 21 is a cross-sectional view of an essential part for explaining a defect when the shape of the flange portion of the through conductor abutting on the electrode and the shape of the grounding metal plate abutting on the second electrode are brought into wide surface contact. FIGS. 22 and 23 show a substantially linear shape of the contact portion of the flange portion and the joint portion of the grounding metal plate contacting the first electrode and the second electrode on both end surfaces of the cylindrical dielectric. FIG. 24 is an enlarged sectional view of a main part of FIG. 23, showing a main part sectional view of another embodiment of the present invention.
The figure shows an external force applied to the faston tab of the through conductor, and a cross-sectional view showing a state in which a crack is formed in the cylindrical dielectric. Drawing showing another embodiment, FIG. 27 is a sectional view of the completed assembly of the present invention using the through conductor of FIG.
FIG. 29 is a cross-sectional view for explaining a conventional through-type capacitor for high voltage. FIG. 29 is a drawing showing the curing shrinkage direction of the epoxy resin used for the capacitor. FIG.
FIG. 28B is an enlarged view of a main part of the figure, and FIG.
It is sectional drawing of X ') direction. (1) ... cylindrical dielectric, (2) (3) ... first and second electrodes, (4) ... through conductor, (6) ... ground metal plate, (11)
... silicone gel, (13) flange, (14) self-adhesive silicone rubber, (15) release layer, (16) nickel plating layer, (17) non-adhesive area, (18) (19) )… Joint,
(23) ... contact part, (24) ... joint part, (25) ... crack,
(26) (26 ') (27) (27') ... recess.

 ──────────────────────────────────────────────────続 き Continued on the front page (31) Priority claim number Japanese Patent Application No. 63-292284 (32) Priority date November 18, 1988 (1988) (33) Priority claim country Japan (JP) (31) Priority Claim Number Japanese Patent Application No. 63-292846 (32) Priority Date November 18, 1988 (33) (33) Priority Country Japan (JP) (31) Priority Number No. 63-292847 (32) Priority (1988) November 18, 1988 (33) Countries claiming priority Japan (JP)

Claims (8)

(57) [Claims] 1. A cylindrical dielectric, a first electrode and a second electrode disposed on both end surfaces of the dielectric, and a first electrode disposed inside the cylindrical dielectric and penetrating therethrough. And a grounding metal plate connected to the second electrode. A self-adhesive silicone rubber is provided between at least the inner peripheral surface of the cylindrical dielectric and the through conductor. A high-voltage feed-through capacitor that is filled. 2. A release layer made of a material that is difficult to adhere to self-adhesive silicone rubber is provided around the through conductor facing the inner peripheral surface of the cylindrical dielectric. 2. The high-voltage feedthrough capacitor according to claim 1. 3. A metal plating layer having a weak bonding force with self-adhesive silicone rubber is provided around the through conductor facing the inner peripheral surface of the cylindrical dielectric. 2. A high-voltage feedthrough capacitor according to claim 1. 4. The high-voltage feedthrough capacitor according to claim 1, wherein the outer periphery of said cylindrical dielectric is coated with self-adhesive silicone rubber. 5. A cylindrical dielectric, a first electrode and a second electrode disposed on both end surfaces of the dielectric, and a first electrode disposed inside the cylindrical dielectric and penetrating therethrough. And a ground metal plate connected to the second electrode, and at least a self-adhesive silicone rubber is filled between an inner peripheral surface of the cylindrical dielectric and the through conductor. In the method for manufacturing a high-voltage feedthrough capacitor according to the above, when filling the self-adhesive silicone rubber, after performing a curing reaction at a temperature of 100 ° C. or less, an adhesion imparting reaction is performed at a temperature exceeding 100 ° C. A method for manufacturing a high-voltage feedthrough capacitor, characterized in that: 6. A cylindrical dielectric, first and second electrodes disposed on both end surfaces of the dielectric, and the first electrode disposed through the inside of the cylindrical dielectric. And a grounding metal plate connected to the second electrode, wherein at least a space between the inner peripheral surface of the cylindrical dielectric and the through conductor is filled with a self-adhesive silicone rubber. A method for manufacturing a high-voltage feedthrough capacitor, wherein the outer periphery of the cylindrical dielectric is coated with a self-adhesive silicone rubber, the outer surface of the self-adhesive silicone rubber covering the outer periphery of the cylindrical dielectric, A method for producing a high-voltage feedthrough capacitor, comprising performing a creeping discharge treatment. 7. A shape of a contact portion of the through conductor with the first electrode and a shape of a contact portion of the grounding metal plate with the second electrode are reduced in a substantially linear shape. 2. The high-voltage feedthrough capacitor according to claim 1, wherein: 8. The high-voltage through-type according to claim 1, wherein a concave portion for absorbing external pressure is provided outside the contact portion of the through-conductor with the first electrode. Capacitors.