JPS6477199A - Semiconductor electronic device - Google Patents

Semiconductor electronic device

Info

Publication number
JPS6477199A
JPS6477199A JP23381787A JP23381787A JPS6477199A JP S6477199 A JPS6477199 A JP S6477199A JP 23381787 A JP23381787 A JP 23381787A JP 23381787 A JP23381787 A JP 23381787A JP S6477199 A JPS6477199 A JP S6477199A
Authority
JP
Japan
Prior art keywords
cold plate
cam
hole
tapered section
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23381787A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0563118B2 (enrdf_load_stackoverflow
Inventor
Mitsuo Takamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP23381787A priority Critical patent/JPS6477199A/ja
Publication of JPS6477199A publication Critical patent/JPS6477199A/ja
Publication of JPH0563118B2 publication Critical patent/JPH0563118B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP23381787A 1987-09-18 1987-09-18 Semiconductor electronic device Granted JPS6477199A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23381787A JPS6477199A (en) 1987-09-18 1987-09-18 Semiconductor electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23381787A JPS6477199A (en) 1987-09-18 1987-09-18 Semiconductor electronic device

Publications (2)

Publication Number Publication Date
JPS6477199A true JPS6477199A (en) 1989-03-23
JPH0563118B2 JPH0563118B2 (enrdf_load_stackoverflow) 1993-09-09

Family

ID=16961037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23381787A Granted JPS6477199A (en) 1987-09-18 1987-09-18 Semiconductor electronic device

Country Status (1)

Country Link
JP (1) JPS6477199A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8027162B2 (en) * 2009-09-24 2011-09-27 International Business Machines Corporation Liquid-cooled electronics apparatus and methods of fabrication
US8493738B2 (en) 2011-05-06 2013-07-23 International Business Machines Corporation Cooled electronic system with thermal spreaders coupling electronics cards to cold rails
US8687364B2 (en) 2011-10-28 2014-04-01 International Business Machines Corporation Directly connected heat exchanger tube section and coolant-cooled structure
US9307674B2 (en) 2011-05-06 2016-04-05 International Business Machines Corporation Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
US9879926B2 (en) 2012-06-20 2018-01-30 International Business Machines Corporation Controlled cooling of an electronic system for reduced energy consumption

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8027162B2 (en) * 2009-09-24 2011-09-27 International Business Machines Corporation Liquid-cooled electronics apparatus and methods of fabrication
US8493738B2 (en) 2011-05-06 2013-07-23 International Business Machines Corporation Cooled electronic system with thermal spreaders coupling electronics cards to cold rails
US8649177B2 (en) 2011-05-06 2014-02-11 International Business Machines Corporation Method of fabricating a cooled electronic system
US9307674B2 (en) 2011-05-06 2016-04-05 International Business Machines Corporation Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
US9930807B2 (en) 2011-05-06 2018-03-27 International Business Machines Corporation Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader
US9930806B2 (en) 2011-05-06 2018-03-27 International Business Machines Corporation Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
US10045463B2 (en) 2011-05-06 2018-08-07 International Business Machines Corporation Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader
US8687364B2 (en) 2011-10-28 2014-04-01 International Business Machines Corporation Directly connected heat exchanger tube section and coolant-cooled structure
US9879926B2 (en) 2012-06-20 2018-01-30 International Business Machines Corporation Controlled cooling of an electronic system for reduced energy consumption

Also Published As

Publication number Publication date
JPH0563118B2 (enrdf_load_stackoverflow) 1993-09-09

Similar Documents

Publication Publication Date Title
DE69410245D1 (de) Kuehlkoerper- montagevorrichtung fuer ein halbleiterbauteil
EP0149786A3 (en) Semiconductor power module
EP0386103A1 (en) Cooling body for an electric circuit card and method to arrange such a cooling body in an electronic unit
WO2006029265A3 (en) Liquid cooled heat sink with cold plate retention mechanism
RU96115254A (ru) Способ и устройство для охлаждения в закрытых пространствах
DE3865805D1 (de) Vorrichtung zur expansionsuebernahme in fluessigkeitskreislaufsystemen, insbesondere von heizungs- oder kuehlanlagen.
CA2145081A1 (en) Liquid-coolant cooling element
JPS6477199A (en) Semiconductor electronic device
DE3683034D1 (de) Vorrichtung fuer eine fluessigkeitskuehlung eines elektrischen bauelementes, insbesondere halbleiter-bauelementes.
JPS63226049A (ja) 冷却モジユ−ル構造
JPS56137662A (en) Semiconductor device
JPH01145136U (enrdf_load_stackoverflow)
CN221081614U (zh) 一种实现pcb板双面安装的散热装置
KR890000065Y1 (ko) 트랜지스터와 방열판의 고정장치
JPS57160150A (en) Heat dissipating board for hybrid ic
EP0157367A3 (en) Method and apparatus for evaporative cooling
CN208016224U (zh) 散热结构及电子设备
JPS6412561A (en) Application of heat transfer compound
JPS6428944A (en) Cooling structure of integrated circuit
JPS6473724A (en) Fixation of wafer
JPH09116284A (ja) 放熱器
Flynn Helping power transistors keep their cool
KR910007316Y1 (ko) 발열반도체 부품의 방열판 고정장치
JPH0220868Y2 (enrdf_load_stackoverflow)
SU1619438A1 (ru) Радиатор