JPS6477198A - Multilayer printed board - Google Patents
Multilayer printed boardInfo
- Publication number
- JPS6477198A JPS6477198A JP23381887A JP23381887A JPS6477198A JP S6477198 A JPS6477198 A JP S6477198A JP 23381887 A JP23381887 A JP 23381887A JP 23381887 A JP23381887 A JP 23381887A JP S6477198 A JPS6477198 A JP S6477198A
- Authority
- JP
- Japan
- Prior art keywords
- layers
- signal
- hole
- printed board
- gnd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To connect components packaged on both sides of a primary printed board which is constituted of GND layers and a signal layers or by only signal layers without reducing a packaging density, by laminating a secondary printed board which is constituted by only power/GND layers onto both surfaces of the primary printed board and by providing signal holes and power source holes which do not pass through all the layers. CONSTITUTION:A secondary printed boards 2 and 3 whose inner layers are constituted of only GND layers 6, 10 and power layers 7, 9 are laminated on both sides of a primary printed board 1 which has a signal wiring layers 16, 17 and a GND layer 8 through an insulation layers 4 and 5. A hole 19 in the primary printed board 1 connects a signal wiring layer 16 and a signal wiring 17 each other. A power supply hole 14 and a grounding hole 15 for packaging components on a surface are made at the position of the signal hole 19. In the rear of a signal hole 12 is a power source hole 15 thus providing a signal through-hole securely without reducing component packaging density.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23381887A JPS6477198A (en) | 1987-09-18 | 1987-09-18 | Multilayer printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23381887A JPS6477198A (en) | 1987-09-18 | 1987-09-18 | Multilayer printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6477198A true JPS6477198A (en) | 1989-03-23 |
Family
ID=16961051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23381887A Pending JPS6477198A (en) | 1987-09-18 | 1987-09-18 | Multilayer printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6477198A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06310870A (en) * | 1993-04-21 | 1994-11-04 | Nec Corp | Wiring board structure and its manufacture |
-
1987
- 1987-09-18 JP JP23381887A patent/JPS6477198A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06310870A (en) * | 1993-04-21 | 1994-11-04 | Nec Corp | Wiring board structure and its manufacture |
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