JPS6477135A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6477135A
JPS6477135A JP62234430A JP23443087A JPS6477135A JP S6477135 A JPS6477135 A JP S6477135A JP 62234430 A JP62234430 A JP 62234430A JP 23443087 A JP23443087 A JP 23443087A JP S6477135 A JPS6477135 A JP S6477135A
Authority
JP
Japan
Prior art keywords
chips
memory
rear side
chip
mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62234430A
Other languages
English (en)
Inventor
Mikio Matoba
Takeshi Sugawara
Katsujirou Nakamura
Shigeru Sakairi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Holdings Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP62234430A priority Critical patent/JPS6477135A/ja
Publication of JPS6477135A publication Critical patent/JPS6477135A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Wire Bonding (AREA)
JP62234430A 1987-09-18 1987-09-18 Semiconductor device Pending JPS6477135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62234430A JPS6477135A (en) 1987-09-18 1987-09-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62234430A JPS6477135A (en) 1987-09-18 1987-09-18 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6477135A true JPS6477135A (en) 1989-03-23

Family

ID=16970894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62234430A Pending JPS6477135A (en) 1987-09-18 1987-09-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6477135A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0473796A4 (en) * 1990-03-15 1994-05-25 Fujitsu Ltd Semiconductor device having a plurality of chips
US5332922A (en) * 1990-04-26 1994-07-26 Hitachi, Ltd. Multi-chip semiconductor package
US5539250A (en) * 1990-06-15 1996-07-23 Hitachi, Ltd. Plastic-molded-type semiconductor device
EP0847086A2 (en) * 1996-12-03 1998-06-10 Texas Instruments Incorporated Improvements in or relating to semiconductor devices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62195136A (ja) * 1986-02-21 1987-08-27 Fuji Electric Co Ltd 半導体装置の製造方法
JPS62205636A (ja) * 1986-03-06 1987-09-10 Fuji Electric Co Ltd 半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62195136A (ja) * 1986-02-21 1987-08-27 Fuji Electric Co Ltd 半導体装置の製造方法
JPS62205636A (ja) * 1986-03-06 1987-09-10 Fuji Electric Co Ltd 半導体装置の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0473796A4 (en) * 1990-03-15 1994-05-25 Fujitsu Ltd Semiconductor device having a plurality of chips
US5332922A (en) * 1990-04-26 1994-07-26 Hitachi, Ltd. Multi-chip semiconductor package
US5701031A (en) * 1990-04-26 1997-12-23 Hitachi, Ltd. Sealed stacked arrangement of semiconductor devices
USRE37539E1 (en) * 1990-04-26 2002-02-05 Hitachi, Ltd. Sealed stacked arrangement of semiconductor devices
US5539250A (en) * 1990-06-15 1996-07-23 Hitachi, Ltd. Plastic-molded-type semiconductor device
EP0847086A2 (en) * 1996-12-03 1998-06-10 Texas Instruments Incorporated Improvements in or relating to semiconductor devices
EP0847086A3 (en) * 1996-12-03 2000-07-26 Texas Instruments Incorporated Improvements in or relating to semiconductor devices

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