JPS6477136A - Tape carrier for semiconductor device - Google Patents

Tape carrier for semiconductor device

Info

Publication number
JPS6477136A
JPS6477136A JP62232611A JP23261187A JPS6477136A JP S6477136 A JPS6477136 A JP S6477136A JP 62232611 A JP62232611 A JP 62232611A JP 23261187 A JP23261187 A JP 23261187A JP S6477136 A JPS6477136 A JP S6477136A
Authority
JP
Japan
Prior art keywords
tape carrier
terminals
lead terminals
substrate
outer lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62232611A
Other languages
Japanese (ja)
Other versions
JP2513724B2 (en
Inventor
Ryutaro Arakawa
Kimitaka Koseki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Holdings Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP62232611A priority Critical patent/JP2513724B2/en
Publication of JPS6477136A publication Critical patent/JPS6477136A/en
Application granted granted Critical
Publication of JP2513724B2 publication Critical patent/JP2513724B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

PURPOSE:To obtain a carrier tape for a semiconductor device and capable of mounting in a high integration degree using the same tape carrier by a method wherein memory ICs are bonded to the same tape carrier and each IC is provided with a plurality of outer lead terminals for chip select terminals. CONSTITUTION:A Cu foil is laminated on a tape carrier 1 consisting of a polyimide and so on and thereafter, after lead terminal patterns are formed, an Sn plating is applied to these patterns. Outer lead terminals 10 only for chip select terminals are formed two in number adjoining outer lead terminals 6. Inner lead terminals 7 of this tape carrier and Au bumps of an IC 8 are thermally fixed by pressure to each other. When the ICs 8 are mounted on a printed substrate in a two-stage superposition and are superposed on the upper and lower surfaces of the substrate, the terminals 10 only are cut off arbitrarily in such a way that these are not superposed on each other and are mounted on the upper and lower surfaces of the substrate. Thereby, a highly integrated mounting of two times of the conventional mounting becomes possible.
JP62232611A 1987-09-18 1987-09-18 Carrier tape for semiconductor device Expired - Fee Related JP2513724B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62232611A JP2513724B2 (en) 1987-09-18 1987-09-18 Carrier tape for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62232611A JP2513724B2 (en) 1987-09-18 1987-09-18 Carrier tape for semiconductor device

Publications (2)

Publication Number Publication Date
JPS6477136A true JPS6477136A (en) 1989-03-23
JP2513724B2 JP2513724B2 (en) 1996-07-03

Family

ID=16942056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62232611A Expired - Fee Related JP2513724B2 (en) 1987-09-18 1987-09-18 Carrier tape for semiconductor device

Country Status (1)

Country Link
JP (1) JP2513724B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0383296A2 (en) * 1989-02-15 1990-08-22 Matsushita Electric Industrial Co., Ltd. Method of producing a semiconductor device package
EP0430458A2 (en) * 1989-12-01 1991-06-05 STMicroelectronics Limited Semiconductor chip packages
JPH03154355A (en) * 1989-11-13 1991-07-02 Rohm Co Ltd Electronic parts
EP0473796A4 (en) * 1990-03-15 1994-05-25 Fujitsu Ltd Semiconductor device having a plurality of chips
JP2007010041A (en) * 2005-06-30 2007-01-18 Ntn Corp Wheel bearing device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0383296A2 (en) * 1989-02-15 1990-08-22 Matsushita Electric Industrial Co., Ltd. Method of producing a semiconductor device package
JPH03154355A (en) * 1989-11-13 1991-07-02 Rohm Co Ltd Electronic parts
EP0430458A2 (en) * 1989-12-01 1991-06-05 STMicroelectronics Limited Semiconductor chip packages
US5165067A (en) * 1989-12-01 1992-11-17 Inmos Limited Semiconductor chip packages
US5512783A (en) * 1989-12-01 1996-04-30 Inmos Limited Semiconductor chip packages
EP0473796A4 (en) * 1990-03-15 1994-05-25 Fujitsu Ltd Semiconductor device having a plurality of chips
JP2007010041A (en) * 2005-06-30 2007-01-18 Ntn Corp Wheel bearing device

Also Published As

Publication number Publication date
JP2513724B2 (en) 1996-07-03

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees