JPS6484624A - Semiconductor integrated circuit device using film carrier - Google Patents

Semiconductor integrated circuit device using film carrier

Info

Publication number
JPS6484624A
JPS6484624A JP24085587A JP24085587A JPS6484624A JP S6484624 A JPS6484624 A JP S6484624A JP 24085587 A JP24085587 A JP 24085587A JP 24085587 A JP24085587 A JP 24085587A JP S6484624 A JPS6484624 A JP S6484624A
Authority
JP
Japan
Prior art keywords
film carrier
integrated circuit
semiconductor integrated
circuit device
circuit chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24085587A
Other languages
Japanese (ja)
Other versions
JP2507475B2 (en
Inventor
Toshio Sudo
Kazuyoshi Saito
Tomoaki Takubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP24085587A priority Critical patent/JP2507475B2/en
Publication of JPS6484624A publication Critical patent/JPS6484624A/en
Application granted granted Critical
Publication of JP2507475B2 publication Critical patent/JP2507475B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To reduce the inductance of a bonding wire by a method wherein a film carrier is used to be connected to an integrated circuit chip while the film carrier is loaded with a condenser for decoupling. CONSTITUTION:A through hole is made on the end of inner leads 2 connected to one another by an integrated circuit chip 4 and a bump. A conductor 5 is formed on the central part of a film carrier to form a condenser holding a polyimide insulating layer. When the film carrier is used to be connected to the integrated circuit chip 4, they are connected by the bump. Through these procedures, the inductance of a bonding wire can be reduced.
JP24085587A 1987-09-28 1987-09-28 Semiconductor integrated circuit device using film carrier Expired - Lifetime JP2507475B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24085587A JP2507475B2 (en) 1987-09-28 1987-09-28 Semiconductor integrated circuit device using film carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24085587A JP2507475B2 (en) 1987-09-28 1987-09-28 Semiconductor integrated circuit device using film carrier

Publications (2)

Publication Number Publication Date
JPS6484624A true JPS6484624A (en) 1989-03-29
JP2507475B2 JP2507475B2 (en) 1996-06-12

Family

ID=17065712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24085587A Expired - Lifetime JP2507475B2 (en) 1987-09-28 1987-09-28 Semiconductor integrated circuit device using film carrier

Country Status (1)

Country Link
JP (1) JP2507475B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5109270A (en) * 1989-04-17 1992-04-28 Matsushita Electric Industrial Co., Ltd. High frequency semiconductor device
JPH06268012A (en) * 1993-03-11 1994-09-22 Nec Corp Semiconductor integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5109270A (en) * 1989-04-17 1992-04-28 Matsushita Electric Industrial Co., Ltd. High frequency semiconductor device
JPH06268012A (en) * 1993-03-11 1994-09-22 Nec Corp Semiconductor integrated circuit

Also Published As

Publication number Publication date
JP2507475B2 (en) 1996-06-12

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