JPS647538A - Manufacture of wiring structure of lsi - Google Patents
Manufacture of wiring structure of lsiInfo
- Publication number
- JPS647538A JPS647538A JP62161073A JP16107387A JPS647538A JP S647538 A JPS647538 A JP S647538A JP 62161073 A JP62161073 A JP 62161073A JP 16107387 A JP16107387 A JP 16107387A JP S647538 A JPS647538 A JP S647538A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- case
- wiring material
- formation
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Memories (AREA)
Abstract
PURPOSE:To make possible the more microscopical formation of the wiring structure of an LSI by a method wherein a recessed part is provided in a base insulating film before wiring are formed and a wiring material having a directional property is deposited at the time of formation of the wiring material to perform a patterning of the wiring. CONSTITUTION:In the case of the formation of a memory array part and so on, part of an intermediate insulating film 302 is removed using a photolitho etching technique to obtain a recessed part 303. At this time, it is better to form the etching shape at an acute angle (an overhang shape). Then, when a wiring material is formed using a deposition unit having a directional property, wirings 303 and 305 are formed. In this case, in case the step formed on the film 302 is small and in case the pitch between the wiring is large, the wiring material is formed thinly on a step sidewall part 306, but the isolation between the wiring can be completely executed at this time by removing the thin part of the wiring material using a wet etching method. Thereby, very closely adjacent wiring can be formed without any intervals between the wiring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62161073A JPS647538A (en) | 1987-06-30 | 1987-06-30 | Manufacture of wiring structure of lsi |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62161073A JPS647538A (en) | 1987-06-30 | 1987-06-30 | Manufacture of wiring structure of lsi |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS647538A true JPS647538A (en) | 1989-01-11 |
Family
ID=15728110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62161073A Pending JPS647538A (en) | 1987-06-30 | 1987-06-30 | Manufacture of wiring structure of lsi |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS647538A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100281897B1 (en) * | 1998-07-21 | 2001-03-02 | 윤종용 | Semiconductor device having conduction layer and fabrication method thereof |
JP2012209441A (en) * | 2011-03-30 | 2012-10-25 | Oki Electric Ind Co Ltd | High density wiring structure and manufacturing method of the same |
-
1987
- 1987-06-30 JP JP62161073A patent/JPS647538A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100281897B1 (en) * | 1998-07-21 | 2001-03-02 | 윤종용 | Semiconductor device having conduction layer and fabrication method thereof |
JP2012209441A (en) * | 2011-03-30 | 2012-10-25 | Oki Electric Ind Co Ltd | High density wiring structure and manufacturing method of the same |
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