JPS647518B2 - - Google Patents
Info
- Publication number
- JPS647518B2 JPS647518B2 JP10626280A JP10626280A JPS647518B2 JP S647518 B2 JPS647518 B2 JP S647518B2 JP 10626280 A JP10626280 A JP 10626280A JP 10626280 A JP10626280 A JP 10626280A JP S647518 B2 JPS647518 B2 JP S647518B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- base material
- mask plate
- electric circuit
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10626280A JPS5731194A (en) | 1980-07-31 | 1980-07-31 | Method of producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10626280A JPS5731194A (en) | 1980-07-31 | 1980-07-31 | Method of producing printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5731194A JPS5731194A (en) | 1982-02-19 |
| JPS647518B2 true JPS647518B2 (cs) | 1989-02-09 |
Family
ID=14429176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10626280A Granted JPS5731194A (en) | 1980-07-31 | 1980-07-31 | Method of producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5731194A (cs) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5555979A (en) * | 1978-10-23 | 1980-04-24 | Mitsubishi Heavy Ind Ltd | Liquid storage tank |
-
1980
- 1980-07-31 JP JP10626280A patent/JPS5731194A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5731194A (en) | 1982-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3606677A (en) | Multilayer circuit board techniques | |
| US7378227B2 (en) | Method of making a printed wiring board with conformally plated circuit traces | |
| US4217182A (en) | Semi-additive process of manufacturing a printed circuit | |
| US4770900A (en) | Process and laminate for the manufacture of through-hole plated electric printed-circuit boards | |
| JPS62158393A (ja) | プリント回路の製造方法 | |
| US3884771A (en) | Process of producing resinous board having a rough surface usable for firmly supporting thereon a printed circuit | |
| JPH0114858B2 (cs) | ||
| US3691007A (en) | Printed circuit board fabrication by electroplating a surface through a porous membrane | |
| KR101893503B1 (ko) | 미세배선용 연성 회로 기판 및 이의 제조방법 | |
| US3756891A (en) | Multilayer circuit board techniques | |
| US4358349A (en) | Method of forming electrical wiring path on insulative substrate | |
| JPS61124117A (ja) | プリントコイルの製造方法 | |
| JPS60177195A (ja) | スル−ホ−ルを有する配線基板のメツキ方法 | |
| JPS647518B2 (cs) | ||
| JP2006140216A (ja) | 両面回路基板およびその製造方法 | |
| JPH09307216A (ja) | 配線基板の製造方法及び配線基板 | |
| JP3935558B2 (ja) | パターン形成方法 | |
| JPH10190183A (ja) | メッキされた抵抗器を有するプリント回路板の製法 | |
| JPS62291089A (ja) | 回路基板の製造方法 | |
| JP4153602B2 (ja) | 回路基板の製造方法、回路基板及び磁気ヘッドサスペンション | |
| JPS61288488A (ja) | 成形回路基板の製造方法 | |
| JP2603097B2 (ja) | プリント配線板の製造方法 | |
| JPS6390897A (ja) | 多層配線板の製造方法 | |
| JPS6144064B2 (cs) | ||
| JP2004165320A (ja) | 配線基板 |