JPS647518B2 - - Google Patents

Info

Publication number
JPS647518B2
JPS647518B2 JP10626280A JP10626280A JPS647518B2 JP S647518 B2 JPS647518 B2 JP S647518B2 JP 10626280 A JP10626280 A JP 10626280A JP 10626280 A JP10626280 A JP 10626280A JP S647518 B2 JPS647518 B2 JP S647518B2
Authority
JP
Japan
Prior art keywords
sheet
base material
mask plate
electric circuit
thin metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10626280A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5731194A (en
Inventor
Masami Takagi
Yasunori Ono
Yoshinori Urakuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP10626280A priority Critical patent/JPS5731194A/ja
Publication of JPS5731194A publication Critical patent/JPS5731194A/ja
Publication of JPS647518B2 publication Critical patent/JPS647518B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP10626280A 1980-07-31 1980-07-31 Method of producing printed circuit board Granted JPS5731194A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10626280A JPS5731194A (en) 1980-07-31 1980-07-31 Method of producing printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10626280A JPS5731194A (en) 1980-07-31 1980-07-31 Method of producing printed circuit board

Publications (2)

Publication Number Publication Date
JPS5731194A JPS5731194A (en) 1982-02-19
JPS647518B2 true JPS647518B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-02-09

Family

ID=14429176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10626280A Granted JPS5731194A (en) 1980-07-31 1980-07-31 Method of producing printed circuit board

Country Status (1)

Country Link
JP (1) JPS5731194A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5555979A (en) * 1978-10-23 1980-04-24 Mitsubishi Heavy Ind Ltd Liquid storage tank

Also Published As

Publication number Publication date
JPS5731194A (en) 1982-02-19

Similar Documents

Publication Publication Date Title
US3606677A (en) Multilayer circuit board techniques
US7378227B2 (en) Method of making a printed wiring board with conformally plated circuit traces
US4217182A (en) Semi-additive process of manufacturing a printed circuit
JP5213094B2 (ja) 導電バイアを誘電体層に埋め込む方法およびプロセス
US4770900A (en) Process and laminate for the manufacture of through-hole plated electric printed-circuit boards
JPS62158393A (ja) プリント回路の製造方法
US3884771A (en) Process of producing resinous board having a rough surface usable for firmly supporting thereon a printed circuit
JPH0114858B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
US3691007A (en) Printed circuit board fabrication by electroplating a surface through a porous membrane
KR101893503B1 (ko) 미세배선용 연성 회로 기판 및 이의 제조방법
US3756891A (en) Multilayer circuit board techniques
US4358349A (en) Method of forming electrical wiring path on insulative substrate
JPS61124117A (ja) プリントコイルの製造方法
JPS60177195A (ja) スル−ホ−ルを有する配線基板のメツキ方法
JPS647518B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2006140216A (ja) 両面回路基板およびその製造方法
JPH09307216A (ja) 配線基板の製造方法及び配線基板
JP3935558B2 (ja) パターン形成方法
JPH10190183A (ja) メッキされた抵抗器を有するプリント回路板の製法
JPS62291089A (ja) 回路基板の製造方法
JP4153602B2 (ja) 回路基板の製造方法、回路基板及び磁気ヘッドサスペンション
JPS61288488A (ja) 成形回路基板の製造方法
JPS6390897A (ja) 多層配線板の製造方法
JPS6331193A (ja) プリント配線板の導体パタ−ン形成法
JPS6144064B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)