JPS6475167A - Joining method for dissimilar material - Google Patents
Joining method for dissimilar materialInfo
- Publication number
- JPS6475167A JPS6475167A JP23100687A JP23100687A JPS6475167A JP S6475167 A JPS6475167 A JP S6475167A JP 23100687 A JP23100687 A JP 23100687A JP 23100687 A JP23100687 A JP 23100687A JP S6475167 A JPS6475167 A JP S6475167A
- Authority
- JP
- Japan
- Prior art keywords
- joining
- thermal expansion
- materials
- temp
- joined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
- Ceramic Products (AREA)
Abstract
PURPOSE:To equalize the thermal expansion of each joining material and to join a large area by heating 1st and 2nd joining materials at the specified temp. respectively after joining a brazing filler metal to each joining face of the 1st, 2nd joining materials having different thermal expansion coefft. and joining the 1st and 2nd joining materials. CONSTITUTION:In joining the 1st joining material and 2nd joining material having different kind each other, a brazing filler metal is joined to the joining face of the 1st joining material and that of the 2nd joining material. Thereafter, the 1st joining material having smaller thermal expansion coefft. is heated to the brazing temp. higher than the melting temp. of a brazing filler metal. Also, the 2nd joining material of larger thermal expansion coefft. is heated to the specified temp. lower than the brazing temp. And the mutual brazed having been joined on the joining faces of the 1st and 2nd joining materials are brought into contact with and joined. Therefore, the elongation by the thermal expansion of the 1st, 2nd joining materials can be equalized, the generation of the internal stress becomes extremely small even in case of cooling and the joining of large area is enabled without causing the crack due to the internal stress, the peeling off of the joining part, etc.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23100687A JPS6475167A (en) | 1987-09-17 | 1987-09-17 | Joining method for dissimilar material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23100687A JPS6475167A (en) | 1987-09-17 | 1987-09-17 | Joining method for dissimilar material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6475167A true JPS6475167A (en) | 1989-03-20 |
Family
ID=16916763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23100687A Pending JPS6475167A (en) | 1987-09-17 | 1987-09-17 | Joining method for dissimilar material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6475167A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012089828A (en) * | 2010-09-22 | 2012-05-10 | Toshiba Corp | Semiconductor device manufacturing method |
JP2014200819A (en) * | 2013-04-05 | 2014-10-27 | 株式会社東芝 | Brazing device and brazing method |
-
1987
- 1987-09-17 JP JP23100687A patent/JPS6475167A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012089828A (en) * | 2010-09-22 | 2012-05-10 | Toshiba Corp | Semiconductor device manufacturing method |
JP2014200819A (en) * | 2013-04-05 | 2014-10-27 | 株式会社東芝 | Brazing device and brazing method |
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