JPS6473651A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6473651A
JPS6473651A JP23035587A JP23035587A JPS6473651A JP S6473651 A JPS6473651 A JP S6473651A JP 23035587 A JP23035587 A JP 23035587A JP 23035587 A JP23035587 A JP 23035587A JP S6473651 A JPS6473651 A JP S6473651A
Authority
JP
Japan
Prior art keywords
epoxy resin
hydrated
oxide
resin
phosphorus compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23035587A
Other languages
Japanese (ja)
Other versions
JP2757938B2 (en
Inventor
Minoru Nakao
Fujio Kitamura
Hideto Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP62230355A priority Critical patent/JP2757938B2/en
Publication of JPS6473651A publication Critical patent/JPS6473651A/en
Application granted granted Critical
Publication of JP2757938B2 publication Critical patent/JP2757938B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To retain excellent reliability even when a semiconductor device is left in a high-temperature atmosphere for a long time by a method wherein a semiconductor element is sealed by using an epoxy resin composition containing an epoxy resin, an organic phosphorus compound and a hydrated oxide component of a metal whose valence is 3-5. CONSTITUTION:A semiconductor element is sealed by using an epoxy resin composition containing an epoxy resin, a phenol resin, an organic phosphorus compound and a hydrated oxide of a metal whose valence is 3-5. A novolak- type epoxy resin whose epoxy equivalent is 170-300 is suitable as a material for the epoxy resin. The phenol resin acts as a hardening agent of the epoxy resin; a phenol novolak resin, a crezol novolak resin or the like is suitable. Any special limit is not set to the organic phosphorus compound. Sb, Bi, Zr, Al or the like is enumerated as the metal whose valence is 3-5. Hydrated antimony pentoxide, hydrated zirconium oxide, hydrated bismuth oxide and hydrated aluminum oxide are enumerated as representative examples of the hydrated oxide of this kind of metal.
JP62230355A 1987-09-14 1987-09-14 Semiconductor device Expired - Lifetime JP2757938B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62230355A JP2757938B2 (en) 1987-09-14 1987-09-14 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62230355A JP2757938B2 (en) 1987-09-14 1987-09-14 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS6473651A true JPS6473651A (en) 1989-03-17
JP2757938B2 JP2757938B2 (en) 1998-05-25

Family

ID=16906561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62230355A Expired - Lifetime JP2757938B2 (en) 1987-09-14 1987-09-14 Semiconductor device

Country Status (1)

Country Link
JP (1) JP2757938B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0703613A3 (en) * 1994-09-26 1996-06-05 Motorola Inc Protecting electronic components in acidic and basic environments
WO1996037532A1 (en) * 1995-05-24 1996-11-28 Siemens Aktiengesellschaft Epoxy resin moulding materials fire-proofed without halogens
EP1116774A2 (en) * 2000-01-17 2001-07-18 Sumitomo Bakelite Company Limited Flame-retardant resin composition, and prepregs and laminates using such composition
JP2001200140A (en) * 2000-01-17 2001-07-24 Sumitomo Bakelite Co Ltd Flame-retarded resin composition and prepreg and laminated sheet using the same
US6495260B1 (en) 1999-06-15 2002-12-17 Sumitomo Bakelite Company Limited Method of producing epoxy for molding semiconductor device, molding material, and semiconductor device
WO2005033362A1 (en) 2003-10-01 2005-04-14 Shishiai-Kabushikigaisha Liquid coolant composition
JP2010538134A (en) * 2007-09-05 2010-12-09 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン Flame retardant additive

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device
JPS572329A (en) * 1980-06-05 1982-01-07 Toshiba Corp Epoxy resin type composition and semiconductor device of resin sealing type
JPS6079063A (en) * 1983-10-07 1985-05-04 Sumitomo Bakelite Co Ltd Epoxy resin composition and production thereof
JPS60202118A (en) * 1984-03-26 1985-10-12 Toshiba Corp Sealing epoxy resin composition and semiconductor device sealed therewith
JPS61138619A (en) * 1984-12-10 1986-06-26 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device
JPS572329A (en) * 1980-06-05 1982-01-07 Toshiba Corp Epoxy resin type composition and semiconductor device of resin sealing type
JPS6079063A (en) * 1983-10-07 1985-05-04 Sumitomo Bakelite Co Ltd Epoxy resin composition and production thereof
JPS60202118A (en) * 1984-03-26 1985-10-12 Toshiba Corp Sealing epoxy resin composition and semiconductor device sealed therewith
JPS61138619A (en) * 1984-12-10 1986-06-26 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0703613A3 (en) * 1994-09-26 1996-06-05 Motorola Inc Protecting electronic components in acidic and basic environments
US6030684A (en) * 1994-09-26 2000-02-29 Motorola, Inc. Protecting electronic components in acidic and basic environment
WO1996037532A1 (en) * 1995-05-24 1996-11-28 Siemens Aktiengesellschaft Epoxy resin moulding materials fire-proofed without halogens
US5919843A (en) * 1995-05-24 1999-07-06 Siemens Aktiengesellschaft Epoxy resin moulding compounds having halogen-free flame retardation
US6495260B1 (en) 1999-06-15 2002-12-17 Sumitomo Bakelite Company Limited Method of producing epoxy for molding semiconductor device, molding material, and semiconductor device
EP1116774A2 (en) * 2000-01-17 2001-07-18 Sumitomo Bakelite Company Limited Flame-retardant resin composition, and prepregs and laminates using such composition
JP2001200140A (en) * 2000-01-17 2001-07-24 Sumitomo Bakelite Co Ltd Flame-retarded resin composition and prepreg and laminated sheet using the same
EP1116774A3 (en) * 2000-01-17 2001-10-04 Sumitomo Bakelite Company Limited Flame-retardant resin composition, and prepregs and laminates using such composition
WO2005033362A1 (en) 2003-10-01 2005-04-14 Shishiai-Kabushikigaisha Liquid coolant composition
JP2010538134A (en) * 2007-09-05 2010-12-09 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン Flame retardant additive

Also Published As

Publication number Publication date
JP2757938B2 (en) 1998-05-25

Similar Documents

Publication Publication Date Title
JPS6473651A (en) Semiconductor device
EP0366958A3 (en) Epoxy composition and use thereof
EP0152599A3 (en) Process for making granulates from pyrogenic oxides
IE36795B1 (en) Colour-developer compositions
ATE21190T1 (en) ELECTRICALLY INSULATING ENCAPSULATION COMPOUND FOR SEMICONDUCTOR ARRANGEMENTS.
GB2008621A (en) Masking a Substrate During Pack Aluminising
DE3881313D1 (en) RADIATION-RESISTANT RESIN COMPOSITION WITH A SEMI-ESTERIFIED EPOXY RESIN AS A COMPONENT.
PT86306A (en) PROCESS FOR DIODE MANUFACTURING WITH MIXED OXIDE ISOLATOR
JPS5723625A (en) Epoxy resin composition and resin-sealed semiconductor device
EP0310086A3 (en) Superconductive resin material
JPS57115853A (en) Resin-sealed semiconductor device
JPS5411160A (en) Coating resin composition
JPS6473652A (en) Semiconductor device
JPS57145121A (en) Epoxy resin composition containing dibasic acid dihydrazide as curing agent
GB1110181A (en) Improvements relating to radiation shields
JPS5371134A (en) Inorganic coating compositions
KR900001049A (en) Fluoride Superconductor
DE3670020D1 (en) VACUUM-SEALED CLOSURE BY THERMOCOMPRESSION WITH THE FORMATION OF AN OXIDE LAYER.
JPS6473748A (en) Semiconductor device
JPS5749762A (en) Film for selectively absorbing sunlight
JPS5623275A (en) Heat-resistant insulating covering body
GB1294889A (en)
JPS5322589A (en) Hardening resin composition
JPS57184241A (en) Resin sealing type semiconductor device
JPS5525461A (en) Resin composition for encapsulation of semiconductor

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 10

Free format text: PAYMENT UNTIL: 20080313