JPS6471594A - Corrosion resistant solder for heat exchanger - Google Patents

Corrosion resistant solder for heat exchanger

Info

Publication number
JPS6471594A
JPS6471594A JP22694187A JP22694187A JPS6471594A JP S6471594 A JPS6471594 A JP S6471594A JP 22694187 A JP22694187 A JP 22694187A JP 22694187 A JP22694187 A JP 22694187A JP S6471594 A JPS6471594 A JP S6471594A
Authority
JP
Japan
Prior art keywords
heat exchanger
solder
corrosion resistant
contg
balance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22694187A
Other languages
Japanese (ja)
Inventor
Ikuo Ito
Kadomasa Sato
Hiroshi Horikawa
Kenichi Komata
Sumio Susa
Katsuhiko Takada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Denso Corp
Original Assignee
Furukawa Electric Co Ltd
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd, NipponDenso Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP22694187A priority Critical patent/JPS6471594A/en
Publication of JPS6471594A publication Critical patent/JPS6471594A/en
Pending legal-status Critical Current

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  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To extend the service life of a heat exchanger by contg. the Sn of specified wt.% as a solder constituent composition and taking the balance Pb as well as contg. at the specified rate one or >= two kinds of Ag, Cu and Hg. CONSTITUTION:The Sn of a basic element as a solder constituent is regulated at 2-40% at wt.%. Moreover one or >= two kinds of either Ag, Cu or Hg are added at 0.3-3% and the balance is Pb component. Due to the Sn component being contained in proper amt. an intermetallic compound is formed at the joining boundary part and Sn is difused into the member to be joined. Ag, Cu, Hg form an unsoluble chloride film on the surface by reacting with the chlorine of in the environment, so the corrosion resistance of a solder is improved. Consequently the service life of a soldered heat exchanger is improved.
JP22694187A 1987-09-10 1987-09-10 Corrosion resistant solder for heat exchanger Pending JPS6471594A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22694187A JPS6471594A (en) 1987-09-10 1987-09-10 Corrosion resistant solder for heat exchanger

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22694187A JPS6471594A (en) 1987-09-10 1987-09-10 Corrosion resistant solder for heat exchanger

Publications (1)

Publication Number Publication Date
JPS6471594A true JPS6471594A (en) 1989-03-16

Family

ID=16853009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22694187A Pending JPS6471594A (en) 1987-09-10 1987-09-10 Corrosion resistant solder for heat exchanger

Country Status (1)

Country Link
JP (1) JPS6471594A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997013000A1 (en) * 1995-10-05 1997-04-10 General Electric Company Amalgam for use in fluorescent lamps comprising lead, tin, mercury together with another of the group silver, magnesium, copper, nickel, gold and platinum
WO2004062843A3 (en) * 2003-01-09 2004-09-23 Martinez Mauricio Vargas Universal remover for electronic components and unsoldering paste for removing surface mount electronics components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997013000A1 (en) * 1995-10-05 1997-04-10 General Electric Company Amalgam for use in fluorescent lamps comprising lead, tin, mercury together with another of the group silver, magnesium, copper, nickel, gold and platinum
US5952780A (en) * 1995-10-05 1999-09-14 General Electric Company Amalgam for use in fluorescent lamps comprising lead, tin, mercury together with another of the group silver, magnesium, copper, nickel, gold and platinum.
WO2004062843A3 (en) * 2003-01-09 2004-09-23 Martinez Mauricio Vargas Universal remover for electronic components and unsoldering paste for removing surface mount electronics components

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