JPS6471157A - Cooling structure of heating component - Google Patents

Cooling structure of heating component

Info

Publication number
JPS6471157A
JPS6471157A JP62227901A JP22790187A JPS6471157A JP S6471157 A JPS6471157 A JP S6471157A JP 62227901 A JP62227901 A JP 62227901A JP 22790187 A JP22790187 A JP 22790187A JP S6471157 A JPS6471157 A JP S6471157A
Authority
JP
Japan
Prior art keywords
component
liquid
refrigerant
cooling
bellows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62227901A
Other languages
Japanese (ja)
Inventor
Katsumi Shiga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62227901A priority Critical patent/JPS6471157A/en
Publication of JPS6471157A publication Critical patent/JPS6471157A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a refrigerant by an electric insulating inert liquid even when the refrigerant leaks into the liquid, to improve air-tightness and to obviate the lowering of cooling power by forming cooling plates in two layer structure and injecting the liquid to the cooling plate near a heating component. CONSTITUTION:A heating component 2 is mounted to a substrate 1 and bonded by solder 7, and a bellows 12 composed of a metal having excellent thermal conduction is abutted against the component 2. The bellows 12 is inserted into a plurality of mounting holes 131, 141 shaped to two layer cooling plates 13, 14 consisting of a metal through O rings 4 made up of an elastic member. The cooling plates 13, 14 are installed between the substrate 1 through the O rings 4. An electric insulating inert liquid 15 is injected to the cooling plate 14 side near the component 2, and a refrigerant 6 is passed through the cooling plates 13. The refrigerant 6 intrudes into the bellows 12 and absorbs heat generated by the component 2 and cools the component 2. Even when the refrigerant 6 intrudes into the liquid 15, the liquid 15 fills the role of a seal. Accordingly, airtightness is improved, and cooling power is not lowered.
JP62227901A 1987-09-10 1987-09-10 Cooling structure of heating component Pending JPS6471157A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62227901A JPS6471157A (en) 1987-09-10 1987-09-10 Cooling structure of heating component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62227901A JPS6471157A (en) 1987-09-10 1987-09-10 Cooling structure of heating component

Publications (1)

Publication Number Publication Date
JPS6471157A true JPS6471157A (en) 1989-03-16

Family

ID=16868083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62227901A Pending JPS6471157A (en) 1987-09-10 1987-09-10 Cooling structure of heating component

Country Status (1)

Country Link
JP (1) JPS6471157A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5285840A (en) * 1991-09-30 1994-02-15 Aisin Seiki Kabushiki Kaisha Method and apparatus for manufacturing piston of internal combustion engine
US5894824A (en) * 1996-02-29 1999-04-20 Unisia Jecs Corporation Piston for internal combustion engines
KR100794373B1 (en) * 2006-06-05 2008-01-15 잘만테크 주식회사 Waterblock apperutus for computer graphic card

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5285840A (en) * 1991-09-30 1994-02-15 Aisin Seiki Kabushiki Kaisha Method and apparatus for manufacturing piston of internal combustion engine
US5894824A (en) * 1996-02-29 1999-04-20 Unisia Jecs Corporation Piston for internal combustion engines
KR100794373B1 (en) * 2006-06-05 2008-01-15 잘만테크 주식회사 Waterblock apperutus for computer graphic card

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