JPS6471050A - Wafer holder - Google Patents

Wafer holder

Info

Publication number
JPS6471050A
JPS6471050A JP63107749A JP10774988A JPS6471050A JP S6471050 A JPS6471050 A JP S6471050A JP 63107749 A JP63107749 A JP 63107749A JP 10774988 A JP10774988 A JP 10774988A JP S6471050 A JPS6471050 A JP S6471050A
Authority
JP
Japan
Prior art keywords
fingers
platen
wafer
fitted
inner faces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63107749A
Other languages
English (en)
Other versions
JP2761887B2 (ja
Inventor
Eru Miaazu Eritsuku
Jiei Heruteru Richiyaado
Bui Buritsuku Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of JPS6471050A publication Critical patent/JPS6471050A/ja
Application granted granted Critical
Publication of JP2761887B2 publication Critical patent/JP2761887B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/24—Chucks or sockets by centrifugal force
    • Y10T279/243—Chucks or sockets by centrifugal force to counterbalance jaws
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/31—Jaws mounted on flexible member; i.e., diaphragm
JP63107749A 1987-05-04 1988-05-02 ウエファ保持装置 Expired - Fee Related JP2761887B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US046,230 1987-05-04
US07/046,230 US4817556A (en) 1987-05-04 1987-05-04 Apparatus for retaining wafers

Publications (2)

Publication Number Publication Date
JPS6471050A true JPS6471050A (en) 1989-03-16
JP2761887B2 JP2761887B2 (ja) 1998-06-04

Family

ID=21942309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63107749A Expired - Fee Related JP2761887B2 (ja) 1987-05-04 1988-05-02 ウエファ保持装置

Country Status (6)

Country Link
US (1) US4817556A (ja)
EP (1) EP0290218B1 (ja)
JP (1) JP2761887B2 (ja)
KR (1) KR970004820B1 (ja)
CA (1) CA1320741C (ja)
DE (1) DE3855424T2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07176533A (ja) * 1991-04-18 1995-07-14 Internatl Business Mach Corp <Ibm> コンタクトマスキング装置及びその方法並びに整合装置

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040484A (en) * 1987-05-04 1991-08-20 Varian Associates, Inc. Apparatus for retaining wafers
US5168887A (en) * 1990-05-18 1992-12-08 Semitool, Inc. Single wafer processor apparatus
EP0405301B1 (en) * 1989-06-29 1995-08-30 Applied Materials, Inc. Apparatus for handling semiconductor wafers
US5080929A (en) * 1990-04-02 1992-01-14 Delco Electronics Corporation Method and apparatus for through hole substrate printing
GB9010833D0 (en) * 1990-05-15 1990-07-04 Electrotech Research Limited Workpiece support
US5222310A (en) * 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
JP3064409B2 (ja) * 1990-11-30 2000-07-12 株式会社日立製作所 保持装置およびそれを用いた半導体製造装置
JPH056752A (ja) * 1991-02-05 1993-01-14 Nissin High Voltage Co Ltd イオン注入装置
DE59107487D1 (de) * 1991-09-16 1996-04-04 Sig Schweiz Industrieges Greifer für einen Manipulator
CH686558A5 (de) * 1992-04-06 1996-04-30 Balzers Hochvakuum Halteanordnung fur ein flochiges Werkstuck sowie Troger mit mindestens einer solchen.
US5350427A (en) * 1993-06-14 1994-09-27 Varian Associates, Inc. Wafer retaining platen having peripheral clamp and wafer lifting means
US5513594A (en) * 1993-10-20 1996-05-07 Mcclanahan; Adolphus E. Clamp with wafer release for semiconductor wafer processing equipment
US5791895A (en) * 1994-02-17 1998-08-11 Novellus Systems, Inc. Apparatus for thermal treatment of thin film wafer
JP3288554B2 (ja) * 1995-05-29 2002-06-04 株式会社日立製作所 イオン注入装置及びイオン注入方法
US5863340A (en) * 1996-05-08 1999-01-26 Flanigan; Allen Deposition ring anti-rotation apparatus
US6145849A (en) * 1998-11-18 2000-11-14 Komag, Incorporated Disk processing chuck
JP2000183139A (ja) * 1998-12-17 2000-06-30 Hitachi Ltd イオン注入装置
US6452195B1 (en) * 1999-08-18 2002-09-17 Ibis Technology Corporation Wafer holding pin
US6398823B1 (en) * 1999-12-07 2002-06-04 Tru-Si Technologies, Inc. Dynamic break for non-contact wafer holder
DE10119570B4 (de) * 2001-04-21 2005-12-08 Schott Ag Verwendung beschichteter Maschinenteile
US7312084B2 (en) 2001-07-13 2007-12-25 Ortho-Clinical Diagnostics, Inc. Tandem incubator for clinical analyzer
US6824343B2 (en) 2002-02-22 2004-11-30 Applied Materials, Inc. Substrate support
US7032287B1 (en) * 2002-07-19 2006-04-25 Nanometrics Incorporated Edge grip chuck
EP1454691A1 (fr) * 2003-03-04 2004-09-08 Willemin Machines S.A. Dispositif de serrage muni d'articulations élastiques
US6794662B1 (en) * 2003-10-07 2004-09-21 Ibis Technology Corporation Thermosetting resin wafer-holding pin
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
WO2005048313A2 (en) 2003-11-10 2005-05-26 Blueshift Technologies, Inc. Methods and systems for handling workpieces in a vacuum-based semiconductor handling system
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US20060231388A1 (en) * 2005-04-14 2006-10-19 Ravi Mullapudi Multi-station sputtering and cleaning system
DE102005059850A1 (de) * 2005-12-15 2007-06-28 Atmel Germany Gmbh Vorrichtung zum Reinigen und Trocknen von Wafern
US9218990B2 (en) * 2011-10-07 2015-12-22 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for holding a plurality of substrates for processing
CN103137447B (zh) * 2011-11-30 2016-05-11 中国科学院微电子研究所 离子注入机
CN103137413B (zh) * 2011-11-30 2016-06-01 中国科学院微电子研究所 离子注入机控制系统
US11114329B2 (en) * 2019-04-08 2021-09-07 Semiconductor Components Industries, Llc Methods for loading or unloading substrate with evaporator planet
CN115355680B (zh) * 2022-10-19 2023-01-03 四川上特科技有限公司 一种晶圆自动甩干装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201241A (ja) * 1982-05-19 1983-11-24 Hitachi Ltd イオン打込角制御法
JPS5994414A (ja) * 1983-09-28 1984-05-31 Hitachi Ltd ウエハホルダ
JPS60167245A (ja) * 1984-02-10 1985-08-30 Hitachi Ltd 試料保持装置
JPS6151916A (ja) * 1984-08-22 1986-03-14 Toshiba Mach Co Ltd 半導体基板の把持装置
JPS6170930U (ja) * 1984-10-15 1986-05-15
JPS61104648A (ja) * 1984-10-29 1986-05-22 Ulvac Corp 基板の冷却装置
JPS61116746A (ja) * 1984-09-19 1986-06-04 アプライド　マテリアルズ　インコ−ポレ−テツド 半導体ウエハをイオンインプランテ−シヨンする装置及び方法

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US4261762A (en) * 1979-09-14 1981-04-14 Eaton Corporation Method for conducting heat to or from an article being treated under vacuum
SU864381A1 (ru) * 1979-11-05 1981-09-15 Предприятие П/Я В-8495 Держатель дл полупроводниковых пластин
US4306731A (en) * 1979-12-21 1981-12-22 Varian Associates, Inc. Wafer support assembly
US4311427A (en) * 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system
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DE3028536C2 (de) * 1980-07-28 1983-01-05 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur Halterung von kreisförmigen Substratscheiben und ihre Verwendung
US4473455A (en) * 1981-12-21 1984-09-25 At&T Bell Laboratories Wafer holding apparatus and method
US4447049A (en) * 1982-08-02 1984-05-08 Alumin-Art Plating Company Apparatus for holding a work piece
US4530635A (en) * 1983-06-15 1985-07-23 The Perkin-Elmer Corporation Wafer transferring chuck assembly
JPS6060060A (ja) * 1983-09-12 1985-04-06 株式会社日立製作所 鉄道車両の扉開閉装置
JPS6079724A (ja) * 1983-10-07 1985-05-07 Hitachi Ltd 回転処理装置
US4553069A (en) * 1984-01-05 1985-11-12 General Ionex Corporation Wafer holding apparatus for ion implantation
US4584045A (en) * 1984-02-21 1986-04-22 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
EP0169932B1 (de) * 1984-08-03 1987-04-22 Wilhelm Loh Wetzlar Optikmaschinen GmbH &amp; Co. KG Vorrichtung zum Halten von empfindlichen Werkstücken, insbesondere von optischen Linsen und anderen optischen Bauelementen
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Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201241A (ja) * 1982-05-19 1983-11-24 Hitachi Ltd イオン打込角制御法
JPS5994414A (ja) * 1983-09-28 1984-05-31 Hitachi Ltd ウエハホルダ
JPS60167245A (ja) * 1984-02-10 1985-08-30 Hitachi Ltd 試料保持装置
JPS6151916A (ja) * 1984-08-22 1986-03-14 Toshiba Mach Co Ltd 半導体基板の把持装置
JPS61116746A (ja) * 1984-09-19 1986-06-04 アプライド　マテリアルズ　インコ−ポレ−テツド 半導体ウエハをイオンインプランテ−シヨンする装置及び方法
JPS6170930U (ja) * 1984-10-15 1986-05-15
JPS61104648A (ja) * 1984-10-29 1986-05-22 Ulvac Corp 基板の冷却装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07176533A (ja) * 1991-04-18 1995-07-14 Internatl Business Mach Corp <Ibm> コンタクトマスキング装置及びその方法並びに整合装置

Also Published As

Publication number Publication date
DE3855424D1 (de) 1996-08-22
EP0290218A2 (en) 1988-11-09
EP0290218B1 (en) 1996-07-17
DE3855424T2 (de) 1996-11-21
US4817556A (en) 1989-04-04
CA1320741C (en) 1993-07-27
KR970004820B1 (ko) 1997-04-04
KR890017791A (ko) 1989-12-18
JP2761887B2 (ja) 1998-06-04
EP0290218A3 (en) 1990-11-22

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