JPS6471003A - Transparent conductive film - Google Patents

Abstract

PURPOSE:To improve transparence and the adhesion of a conductive layer by forming an undercoating layer of the three-dimensional mesh structure on a holding body, over which forming a conductive layer by spreading a solution including a semiconductor compound. CONSTITUTION:As a holding body, a body of a polyester or a polyolefine is used. The three-dimensional mesh structure which forms an undercoating layer on such a holding body is preferable to form the mesh structure after spreading. For this purpose, a bridging agent consisting of isocyanate radical is suitable as the bringing component. The degree of swelling of the undercoating to the used solvent T1/T0 (T0 is the film thickness before soaking and T1 is the film thickness after 5 minutes when the semiconductor compound is soaked in the solvent) is preferable to be in the range 1.05 to 2.5 when T0 is about 10mu. The semiconductor used for the conductive layer is preferable to be cuprous iodide and silver iodide, and a semiconductor including some other metal can be also used. As the solvent for cuprous iodide, acetonitrile is available because cuprous iodide and acetonitrile make a complex salt. The density of the semiconductor is preferable to be 0.1 to 50wt.%.