JPS6470727A - Liquid crystal panel structure - Google Patents

Abstract

PURPOSE:To improve the earthquake-proof property of the whole of a device by forming the bump of an IC in a rectangular form, and crossing the long axis of the bump with the side of the outer form of the IC at an angle other than right angles or in parallel. CONSTITUTION:A conductive particulate 10 is distributed uniformly in a bonding agent layer 11, and the bonding agent layer 11 in which the conductive particulate 10 is mixed is sandwiched between a liquid crystal panel 6 and a driver IC8, and both of them are jointed after being heated and pressurized, however, at this time, the bonding agent 11 at the part of the bump 13 of the IC8 forms a thin layer by being pressed strongly, and the conductive particulate 10 which exists at the part conducts the bump 13 of the IC8 and the external deriving terminal part 7 of the panel 6 by bringing into contact with them. Meanwhile, no contribution of the conductive particulate 10 at a part other than the bump 13 of the IC8 is seen in conduction. Since the IC8 to drive the liquid crystal panel 6 on the panel 6 directly and no semiconductor component with a large space is interposed between the panel 6 and the IC8, it is possible to reduce the size of the whole of a liquid crystal panel block, and to keep satisfactory balance between a liquid crystal display area and the surface area of the whole of the device.