JPS6289177U - - Google Patents

Info

Publication number
JPS6289177U
JPS6289177U JP1985180159U JP18015985U JPS6289177U JP S6289177 U JPS6289177 U JP S6289177U JP 1985180159 U JP1985180159 U JP 1985180159U JP 18015985 U JP18015985 U JP 18015985U JP S6289177 U JPS6289177 U JP S6289177U
Authority
JP
Japan
Prior art keywords
liquid crystal
crystal display
driving
glass substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985180159U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985180159U priority Critical patent/JPS6289177U/ja
Publication of JPS6289177U publication Critical patent/JPS6289177U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Liquid Crystal (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案による液晶表示装置の一実施例
の断面図。 １，２……ガラス基板、３……液晶、４……透
明電極、６……ＩＣ基板、７……バンプ、８……
導電接着剤、９……封止樹脂。 FIG. 1 is a sectional view of an embodiment of a liquid crystal display device according to the present invention. 1, 2...Glass substrate, 3...Liquid crystal, 4...Transparent electrode, 6...IC board, 7...Bump, 8...
Conductive adhesive, 9...Sealing resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 液晶表示パネルのガラス基板上に駆動ＩＣを導
電性接着剤を介してフエイスダウンボンデイング
する実装構造に於いて、該駆動ＩＣのバンブをガ
イドとすることによつてガラス基板とＩＣ基板と
の間隔２０〜８０μｍとすることを特徴とする液
晶表示装置。 In a mounting structure in which a driving IC is face-down bonded onto a glass substrate of a liquid crystal display panel via a conductive adhesive, the distance between the glass substrate and the IC substrate is increased by 20 mm by using the bumps of the driving IC as a guide. A liquid crystal display device characterized in that the thickness is 80 μm.
JP1985180159U 1985-11-22 1985-11-22 Pending JPS6289177U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985180159U JPS6289177U (en) 1985-11-22 1985-11-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985180159U JPS6289177U (en) 1985-11-22 1985-11-22

Publications (1)

Publication Number Publication Date
JPS6289177U true JPS6289177U (en) 1987-06-08

Family

ID=31123861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985180159U Pending JPS6289177U (en) 1985-11-22 1985-11-22

Country Status (1)

Country Link
JP (1) JPS6289177U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232735A (en) * 1988-03-11 1989-09-18 Matsushita Electric Ind Co Ltd Semiconductor device
JPH0344945A (en) * 1989-07-12 1991-02-26 Matsushita Electric Ind Co Ltd Mounting of semiconductor device
JPH07201921A (en) * 1993-11-25 1995-08-04 Nec Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232735A (en) * 1988-03-11 1989-09-18 Matsushita Electric Ind Co Ltd Semiconductor device
JPH0344945A (en) * 1989-07-12 1991-02-26 Matsushita Electric Ind Co Ltd Mounting of semiconductor device
JPH07201921A (en) * 1993-11-25 1995-08-04 Nec Corp Semiconductor device

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