JPS6470384A - Pin grid array type package carrier - Google Patents
Pin grid array type package carrierInfo
- Publication number
- JPS6470384A JPS6470384A JP62223253A JP22325387A JPS6470384A JP S6470384 A JPS6470384 A JP S6470384A JP 62223253 A JP62223253 A JP 62223253A JP 22325387 A JP22325387 A JP 22325387A JP S6470384 A JPS6470384 A JP S6470384A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- package
- pins
- grid array
- array type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
- Packaging Frangible Articles (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To permit the setting of a package in such way as to expose its entire upper surface by inserting some of a plurality of pins into holes for engagement against the inner surface thereof and using the resulting frictional force as means for retaining the package. CONSTITUTION:A package 10 is placed on a receiving stand 3 from above, with each of the corners of a package body 11 being guided by their respective guiding portions 4-7. At this time, each pin 12 passes through a respective one of a plurality of holes 8. In particular, the pins 12a, 12b and 12c are guided by tapered portions 8a-1, 8b-1 and 8c-1 for insertion into the holes 8a, 8b and 8c, respectively. The pins 12b and 12c in the holes 8b and 8c are resiliently energized in the directions of the arrows A2 and B2 and urged into contact with the inner surfaces 8b-2 and 8c-2 of the holes 8b and 8c. At these contact portions, a frictional force is created, and exerted on the package 10 for retention in a set condition with the entire upper surface thereof exposed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62223253A JP2545405B2 (en) | 1987-09-07 | 1987-09-07 | Carrier for pin grid array type package and method of transporting pin grid array type package using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62223253A JP2545405B2 (en) | 1987-09-07 | 1987-09-07 | Carrier for pin grid array type package and method of transporting pin grid array type package using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6470384A true JPS6470384A (en) | 1989-03-15 |
JP2545405B2 JP2545405B2 (en) | 1996-10-16 |
Family
ID=16795199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62223253A Expired - Fee Related JP2545405B2 (en) | 1987-09-07 | 1987-09-07 | Carrier for pin grid array type package and method of transporting pin grid array type package using the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2545405B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0356142U (en) * | 1989-10-04 | 1991-05-30 | ||
JPH05259304A (en) * | 1992-03-12 | 1993-10-08 | Yamaichi Electron Co Ltd | Ic carrier |
WO1995034825A1 (en) * | 1994-06-15 | 1995-12-21 | Advantest Corporation | Carrier of ic handler |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008024316A (en) * | 2006-07-18 | 2008-02-07 | Fujitsu Component Ltd | Synthetic resin-made molded article, and its manufacturing method |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57100234U (en) * | 1980-12-09 | 1982-06-19 | ||
JPS5814582U (en) * | 1981-07-21 | 1983-01-29 | 株式会社イナックス | Water pipe silencer |
JPS609952A (en) * | 1983-06-29 | 1985-01-19 | 株式会社豊田自動織機製作所 | Cut warp yarn treatment in loom |
JPS6099542A (en) * | 1983-08-18 | 1985-06-03 | プレツシ− オ−バ−シ−ズ リミテツド | Jig |
JPS60156798U (en) * | 1984-03-26 | 1985-10-18 | 日本電気株式会社 | IC tray case |
JPS61113274U (en) * | 1984-12-28 | 1986-07-17 | ||
JPS61140588U (en) * | 1985-02-21 | 1986-08-30 | ||
JPS62128593A (en) * | 1985-11-30 | 1987-06-10 | 株式会社東芝 | Attachment structure of parts |
-
1987
- 1987-09-07 JP JP62223253A patent/JP2545405B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57100234U (en) * | 1980-12-09 | 1982-06-19 | ||
JPS5814582U (en) * | 1981-07-21 | 1983-01-29 | 株式会社イナックス | Water pipe silencer |
JPS609952A (en) * | 1983-06-29 | 1985-01-19 | 株式会社豊田自動織機製作所 | Cut warp yarn treatment in loom |
JPS6099542A (en) * | 1983-08-18 | 1985-06-03 | プレツシ− オ−バ−シ−ズ リミテツド | Jig |
JPS60156798U (en) * | 1984-03-26 | 1985-10-18 | 日本電気株式会社 | IC tray case |
JPS61113274U (en) * | 1984-12-28 | 1986-07-17 | ||
JPS61140588U (en) * | 1985-02-21 | 1986-08-30 | ||
JPS62128593A (en) * | 1985-11-30 | 1987-06-10 | 株式会社東芝 | Attachment structure of parts |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0356142U (en) * | 1989-10-04 | 1991-05-30 | ||
JPH05259304A (en) * | 1992-03-12 | 1993-10-08 | Yamaichi Electron Co Ltd | Ic carrier |
WO1995034825A1 (en) * | 1994-06-15 | 1995-12-21 | Advantest Corporation | Carrier of ic handler |
US5635832A (en) * | 1994-06-15 | 1997-06-03 | Advantest Corporation | IC carrier for use with an IC handler |
Also Published As
Publication number | Publication date |
---|---|
JP2545405B2 (en) | 1996-10-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |