JPS57136350A - Contact for ic handler - Google Patents

Contact for ic handler

Info

Publication number
JPS57136350A
JPS57136350A JP56023322A JP2332281A JPS57136350A JP S57136350 A JPS57136350 A JP S57136350A JP 56023322 A JP56023322 A JP 56023322A JP 2332281 A JP2332281 A JP 2332281A JP S57136350 A JPS57136350 A JP S57136350A
Authority
JP
Japan
Prior art keywords
contact
lead
root
ring shaped
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56023322A
Other languages
Japanese (ja)
Inventor
Tsuneo Fukunishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56023322A priority Critical patent/JPS57136350A/en
Publication of JPS57136350A publication Critical patent/JPS57136350A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Abstract

PURPOSE:To cause a contact of an IC handler to resiliently abut against the root of an IC device lead by a method wherein a ring shaped contact is provided abutting against the root of each lead. CONSTITUTION:Contact pins 20 are arranged in two files facing each other and the pins constituting a file are separated from one another at a constant pitch. Each pin is planted in a platform 12 and is provided at its top end with a ring shaped contact 21. A supporting bar 22 supports each member pin of a file midway of its height. An IC device 1 is inserted between contact pins 20, and the contacts 21 abut against the roots of the leads 3 of the IC device when pressed from both directions by jigs 17. This setup causes the ring shaped spring of the contact 21 to easily contact the root of the lead 3. An excellent contact can be established as the root of the lead 3 is not affected even when the lead 3 is forced to bend slightly.
JP56023322A 1981-02-18 1981-02-18 Contact for ic handler Pending JPS57136350A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56023322A JPS57136350A (en) 1981-02-18 1981-02-18 Contact for ic handler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56023322A JPS57136350A (en) 1981-02-18 1981-02-18 Contact for ic handler

Publications (1)

Publication Number Publication Date
JPS57136350A true JPS57136350A (en) 1982-08-23

Family

ID=12107346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56023322A Pending JPS57136350A (en) 1981-02-18 1981-02-18 Contact for ic handler

Country Status (1)

Country Link
JP (1) JPS57136350A (en)

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