JPS6468940A - Probing machine - Google Patents

Abstract

PURPOSE:To perform quick positive making without effects on a probe and the like, by performing the marking on the way of transferring a substrate, whose inspection has been finished, by means of a plurality of marking mechanisms, which are aligned in one line in the direction that is approximately orthogonal with respect to the transfer direction. CONSTITUTION:When the tests of all semiconductor elements on a wafer 60 are completed, a wafer chuck 10 is moved to a conveying position of the wafer 60. The relative positions of the semiconductor elements on the wafer 60 and a line marker 23 accompanied by the movement to the conveying position are computed. An information processor 26 gives instructions to an X-Y stage driver 35 in order to perform marking. The processor 26 also gives instructions to a line-marker driving device 27 so that defect marks 25 are attached on the defective semiconductor elements on the wafer 60, based on the stored data of the positions of the semiconductor elements on the wafer 60 and the result of the tests, in the synchronization with the movement of X-Y stages 19 and 20.