JPS6467471A - Cooling device for controller - Google Patents

Cooling device for controller

Info

Publication number
JPS6467471A
JPS6467471A JP22373687A JP22373687A JPS6467471A JP S6467471 A JPS6467471 A JP S6467471A JP 22373687 A JP22373687 A JP 22373687A JP 22373687 A JP22373687 A JP 22373687A JP S6467471 A JPS6467471 A JP S6467471A
Authority
JP
Japan
Prior art keywords
containing room
mounting plate
semiconductor
case body
cooling fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22373687A
Other languages
Japanese (ja)
Inventor
Kazuaki Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP22373687A priority Critical patent/JPS6467471A/en
Publication of JPS6467471A publication Critical patent/JPS6467471A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To improve radiating efficiency by partitioning a case body arranged to the under floor of vehicle body into an electrical part containing room and a semiconductor stack containing room, providing a mounting plate attached to the latter containing room with an air duct member, and projecting out a cooling fin and a heating element such as a resistor on the air-duct passage. CONSTITUTION:A sealed part containing room 4 which contains plural electrical parts and a sealed stack containing room 6 separated by a center partition 7 which contains plural semiconductor stacks are formed in a case body 2 to be arranged to the underfloor 1a of an electric vehicle body 1. A mounting plate 8 integrated with each semiconductor 5 is also mounted to the case body 2 positioned at the stack containing room 6, and each cooling fin 9 of each semiconductor switch 5 is projected out on one side of this mounting plate 8. Furthermore, each heating element 10 such as resistor is attached to the mounting plate 8 adjacent to each cooling fin 9, and a plural number of air duct member 19 which form approximately elbow-shaped cooling passages outside of these heating elements 10 and cooling fins 9 are covered.
JP22373687A 1987-09-07 1987-09-07 Cooling device for controller Pending JPS6467471A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22373687A JPS6467471A (en) 1987-09-07 1987-09-07 Cooling device for controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22373687A JPS6467471A (en) 1987-09-07 1987-09-07 Cooling device for controller

Publications (1)

Publication Number Publication Date
JPS6467471A true JPS6467471A (en) 1989-03-14

Family

ID=16802885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22373687A Pending JPS6467471A (en) 1987-09-07 1987-09-07 Cooling device for controller

Country Status (1)

Country Link
JP (1) JPS6467471A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008100559A (en) * 2006-10-18 2008-05-01 Toyo Electric Mfg Co Ltd Forced air-cooled cooling control device for railway vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008100559A (en) * 2006-10-18 2008-05-01 Toyo Electric Mfg Co Ltd Forced air-cooled cooling control device for railway vehicle

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