JPS6467306A - Resin molding method and its device - Google Patents
Resin molding method and its deviceInfo
- Publication number
- JPS6467306A JPS6467306A JP22445187A JP22445187A JPS6467306A JP S6467306 A JPS6467306 A JP S6467306A JP 22445187 A JP22445187 A JP 22445187A JP 22445187 A JP22445187 A JP 22445187A JP S6467306 A JPS6467306 A JP S6467306A
- Authority
- JP
- Japan
- Prior art keywords
- component
- main body
- temperature
- mold main
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
PURPOSE:To obtain a resin molding method and its device to raise the temperature in an extremely short period of time and to be able to lower the temperature by constituting the engraved surface of a mold with a component having large electrical resistance and installing said component insulated from a mold main body. CONSTITUTION:An engraved surface constituting of a cavity of a mold main body 1 is manufactured by a separated component 2 having large electrical resistance and electric wires 3... are provided in proper positions on the back of said component 2, while an insulated material 4 is placed between the mold main body 1 and the component 2 and said electric wires 3... are put out of a through-hole 5 provided on the mold main body 1, to be connected with an electric source 6 and a control device and generating low pressure voltage. At the time of molding, first, a large electric current of low voltage retained at the high temperature is applied to the component 2 preliminarily and molding is carried out by filling resin liquid sufficiently in the cavity. As the temperature in the cavity can be controlled high freely by said arrangement, weld lines are not generated on a molded product, and the gloss of its surface is good and fine and also the quality and strength are enhanced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22445187A JPS6467306A (en) | 1987-09-08 | 1987-09-08 | Resin molding method and its device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22445187A JPS6467306A (en) | 1987-09-08 | 1987-09-08 | Resin molding method and its device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6467306A true JPS6467306A (en) | 1989-03-14 |
Family
ID=16813979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22445187A Pending JPS6467306A (en) | 1987-09-08 | 1987-09-08 | Resin molding method and its device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6467306A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5567417A (en) * | 1978-11-15 | 1980-05-21 | Yoshino Kogyosho Co Ltd | Metal mold for blow molding |
| JPS5932298A (en) * | 1982-08-14 | 1984-02-21 | Matsushita Electric Works Ltd | Ultrasonic wave oscillator |
| JPS59109310A (en) * | 1982-12-15 | 1984-06-25 | Royal Kogyo Kk | Method and machine for molding |
-
1987
- 1987-09-08 JP JP22445187A patent/JPS6467306A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5567417A (en) * | 1978-11-15 | 1980-05-21 | Yoshino Kogyosho Co Ltd | Metal mold for blow molding |
| JPS5932298A (en) * | 1982-08-14 | 1984-02-21 | Matsushita Electric Works Ltd | Ultrasonic wave oscillator |
| JPS59109310A (en) * | 1982-12-15 | 1984-06-25 | Royal Kogyo Kk | Method and machine for molding |
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