JPS6465271A - Electroless plating method on resin substrate - Google Patents

Electroless plating method on resin substrate

Info

Publication number
JPS6465271A
JPS6465271A JP22239287A JP22239287A JPS6465271A JP S6465271 A JPS6465271 A JP S6465271A JP 22239287 A JP22239287 A JP 22239287A JP 22239287 A JP22239287 A JP 22239287A JP S6465271 A JPS6465271 A JP S6465271A
Authority
JP
Japan
Prior art keywords
substrate
foil
electroless plating
recesses
projections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22239287A
Other languages
Japanese (ja)
Inventor
Takeshi Sato
Katsuya Fukase
Seiki Shimada
Hirofumi Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP22239287A priority Critical patent/JPS6465271A/en
Priority to US07/240,213 priority patent/US4867839A/en
Publication of JPS6465271A publication Critical patent/JPS6465271A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B29C45/372—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings provided with means for marking or patterning, e.g. numbering articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Abstract

PURPOSE:To form a film having superior adhesion by electroless plating, by adhering foil of an electrolytic metal having projections to molten resin, stripping the foil and subjecting the surface of the resulting resin substrate having fine recesses to electroless plating. CONSTITUTION:Foil 28 of electrolytic copper is incorporated into a metal mold 32 so that the rough surface confronts the cavity 34 and molten resin is injected into the cavity 34 [figures (a), (b)]. The foil 28 is stripped from the surface of the resulting resin substrate 12 so as to pull the fine projections 30 of the foil 28 out of the surface of the substrate 12 [figure (c)]. By the stripping, a large number of fine recesses 26 each constricted in the middle are formed in the surface of the substrate 12 in accordance with the projections 30. A copper film 22 is then formed on the surface of the substrate 12 having the recesses 26 by a known electroless plating means [figure (d)]. Since the plating metal enters the recesses 26 and acts as an anchor, the film 22 has satisfactory adhesion to the surface of the substrate 12.
JP22239287A 1987-09-04 1987-09-04 Electroless plating method on resin substrate Pending JPS6465271A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP22239287A JPS6465271A (en) 1987-09-04 1987-09-04 Electroless plating method on resin substrate
US07/240,213 US4867839A (en) 1987-09-04 1988-09-06 Process for forming a circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22239287A JPS6465271A (en) 1987-09-04 1987-09-04 Electroless plating method on resin substrate

Publications (1)

Publication Number Publication Date
JPS6465271A true JPS6465271A (en) 1989-03-10

Family

ID=16781648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22239287A Pending JPS6465271A (en) 1987-09-04 1987-09-04 Electroless plating method on resin substrate

Country Status (1)

Country Link
JP (1) JPS6465271A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0416836A2 (en) * 1989-09-04 1991-03-13 Polyplastics Co. Ltd. Process for decorating the surface of injection molded articles and surface-decorated articles decorated thereby

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0416836A2 (en) * 1989-09-04 1991-03-13 Polyplastics Co. Ltd. Process for decorating the surface of injection molded articles and surface-decorated articles decorated thereby

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