JPS646051U - - Google Patents
Info
- Publication number
- JPS646051U JPS646051U JP10120587U JP10120587U JPS646051U JP S646051 U JPS646051 U JP S646051U JP 10120587 U JP10120587 U JP 10120587U JP 10120587 U JP10120587 U JP 10120587U JP S646051 U JPS646051 U JP S646051U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- integrated circuit
- hybrid integrated
- mounting
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
Description
第１図は、本考案の一実施例を説明する図で、
同図ａは平面図、ｂは側断面図、ｃは裏面図、ｄ
は正面図、第２図は、従来のキヤリアを説明する
図で、同図ａは平面図、ｂは側断面図、ｃは正面
図である。
図において、１，４はキヤリア、２は混成集積
回路基板、３は取付孔、５は筐体、１１，４１は
取付凹部、１２，４３は筐体への取付面、１３，
４４は混成集積回路基板取付面、４２は凹部、を
それぞれ示す。
FIG. 1 is a diagram illustrating an embodiment of the present invention.
In the same figure, a is a plan view, b is a side sectional view, c is a back view, and d
2 is a front view, and FIG. 2 is a diagram illustrating a conventional carrier, in which a is a plan view, b is a side sectional view, and c is a front view. In the figure, 1 and 4 are carriers, 2 is a hybrid integrated circuit board, 3 is a mounting hole, 5 is a housing, 11 and 41 are mounting recesses, 12 and 43 are mounting surfaces to the housing, 13,
Reference numeral 44 indicates a mounting surface for the hybrid integrated circuit board, and reference numeral 42 indicates a recess.
Claims (1)
ヤリア４の混成集積回路基板取付面４４に、混成
集積回路基板２の取付凹部４１を設け、該取付凹
部４１を除く混成集積回路取付面４４の表面積と
、前記キヤリア４の筐体への取付面４３の表面積
を略同等とするために、 該筐体への取付面４３に凹部４２を設けたこと
を特徴とするセラミツク回路基板を接着する金属
キヤリアの構造。[Claims for Utility Model Registration] A mounting recess 41 for the hybrid integrated circuit board 2 is provided on the hybrid integrated circuit board mounting surface 44 of a rectangular carrier 4 with mounting holes 3 bored at both ends in the longitudinal direction. In order to make the surface area of the mounting surface 44 of the hybrid integrated circuit (excl. The structure of the metal carrier to which the ceramic circuit board is bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10120587U JPH0617306Y2 (en) | 1987-06-30 | 1987-06-30 | Structure of metal carrier for bonding ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10120587U JPH0617306Y2 (en) | 1987-06-30 | 1987-06-30 | Structure of metal carrier for bonding ceramic circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS646051U true JPS646051U (en) | 1989-01-13 |
| JPH0617306Y2 JPH0617306Y2 (en) | 1994-05-02 |
Family
ID=31329987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10120587U Expired - Lifetime JPH0617306Y2 (en) | 1987-06-30 | 1987-06-30 | Structure of metal carrier for bonding ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617306Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0718564U (en) * | 1993-09-16 | 1995-04-04 | 株式会社銀星社 | Spinning reel bail arm rotating device |
-
1987
- 1987-06-30 JP JP10120587U patent/JPH0617306Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0718564U (en) * | 1993-09-16 | 1995-04-04 | 株式会社銀星社 | Spinning reel bail arm rotating device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0617306Y2 (en) | 1994-05-02 |
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