JPS6459844A - Lead frame for resin-sealed semiconductor device and its manufacture - Google Patents

Lead frame for resin-sealed semiconductor device and its manufacture

Info

Publication number
JPS6459844A
JPS6459844A JP21504487A JP21504487A JPS6459844A JP S6459844 A JPS6459844 A JP S6459844A JP 21504487 A JP21504487 A JP 21504487A JP 21504487 A JP21504487 A JP 21504487A JP S6459844 A JPS6459844 A JP S6459844A
Authority
JP
Japan
Prior art keywords
foil
lead frame
semiconductor device
bonded
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21504487A
Other languages
Japanese (ja)
Inventor
Yoshitaka Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP21504487A priority Critical patent/JPS6459844A/en
Publication of JPS6459844A publication Critical patent/JPS6459844A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To stabilize reliability and face-accuracy of the surface by a method wherein Ag foil is partially and mechanically bonded to a lead frame used for a semiconductor device and, after that, the Ag foil is installed only in a bonding region by a press process. CONSTITUTION:Guide holes 21 which are used to transfer a material 20 of a lead frame at fixed intervals are made in the material of the lead frame. By referring to the guide holes 21, prescribed positions are polished in such a way that their roughness is, e.g., less than 1mum; surface-polished parts 22 are formed. Then, Ag foil 23 is positioned in the surface-polished parts 22; the Ag foil 23 is fixed provisionally at more than two parts by using, e.g., a punch in such a way that it is not moved until a next process. Then, the temporarily fixed Ag foil 23 is made to be a clad state 24 by using a pressure roller. Then, an outer lead and an inner lead are pressed by utilizing a stamping technique; a lead frame 25 where the Ag foil is bonded is formed in a region to be bonded.
JP21504487A 1987-08-31 1987-08-31 Lead frame for resin-sealed semiconductor device and its manufacture Pending JPS6459844A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21504487A JPS6459844A (en) 1987-08-31 1987-08-31 Lead frame for resin-sealed semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21504487A JPS6459844A (en) 1987-08-31 1987-08-31 Lead frame for resin-sealed semiconductor device and its manufacture

Publications (1)

Publication Number Publication Date
JPS6459844A true JPS6459844A (en) 1989-03-07

Family

ID=16665825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21504487A Pending JPS6459844A (en) 1987-08-31 1987-08-31 Lead frame for resin-sealed semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPS6459844A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011515113A (en) * 2007-03-26 2011-05-19 プロリテック インコーポレイテッド System and method for controlling the operation of a liquid diffusion device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011515113A (en) * 2007-03-26 2011-05-19 プロリテック インコーポレイテッド System and method for controlling the operation of a liquid diffusion device

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