JPS6459844A - Lead frame for resin-sealed semiconductor device and its manufacture - Google Patents
Lead frame for resin-sealed semiconductor device and its manufactureInfo
- Publication number
- JPS6459844A JPS6459844A JP21504487A JP21504487A JPS6459844A JP S6459844 A JPS6459844 A JP S6459844A JP 21504487 A JP21504487 A JP 21504487A JP 21504487 A JP21504487 A JP 21504487A JP S6459844 A JPS6459844 A JP S6459844A
- Authority
- JP
- Japan
- Prior art keywords
- foil
- lead frame
- semiconductor device
- bonded
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To stabilize reliability and face-accuracy of the surface by a method wherein Ag foil is partially and mechanically bonded to a lead frame used for a semiconductor device and, after that, the Ag foil is installed only in a bonding region by a press process. CONSTITUTION:Guide holes 21 which are used to transfer a material 20 of a lead frame at fixed intervals are made in the material of the lead frame. By referring to the guide holes 21, prescribed positions are polished in such a way that their roughness is, e.g., less than 1mum; surface-polished parts 22 are formed. Then, Ag foil 23 is positioned in the surface-polished parts 22; the Ag foil 23 is fixed provisionally at more than two parts by using, e.g., a punch in such a way that it is not moved until a next process. Then, the temporarily fixed Ag foil 23 is made to be a clad state 24 by using a pressure roller. Then, an outer lead and an inner lead are pressed by utilizing a stamping technique; a lead frame 25 where the Ag foil is bonded is formed in a region to be bonded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21504487A JPS6459844A (en) | 1987-08-31 | 1987-08-31 | Lead frame for resin-sealed semiconductor device and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21504487A JPS6459844A (en) | 1987-08-31 | 1987-08-31 | Lead frame for resin-sealed semiconductor device and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6459844A true JPS6459844A (en) | 1989-03-07 |
Family
ID=16665825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21504487A Pending JPS6459844A (en) | 1987-08-31 | 1987-08-31 | Lead frame for resin-sealed semiconductor device and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6459844A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011515113A (en) * | 2007-03-26 | 2011-05-19 | プロリテック インコーポレイテッド | System and method for controlling the operation of a liquid diffusion device |
-
1987
- 1987-08-31 JP JP21504487A patent/JPS6459844A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011515113A (en) * | 2007-03-26 | 2011-05-19 | プロリテック インコーポレイテッド | System and method for controlling the operation of a liquid diffusion device |
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