JPS645738A - Manufacture of metal dice - Google Patents

Manufacture of metal dice

Info

Publication number
JPS645738A
JPS645738A JP16126087A JP16126087A JPS645738A JP S645738 A JPS645738 A JP S645738A JP 16126087 A JP16126087 A JP 16126087A JP 16126087 A JP16126087 A JP 16126087A JP S645738 A JPS645738 A JP S645738A
Authority
JP
Japan
Prior art keywords
metal
plane
slice
cut
metal die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16126087A
Other languages
Japanese (ja)
Inventor
Hisatoshi Sekiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP16126087A priority Critical patent/JPS645738A/en
Publication of JPS645738A publication Critical patent/JPS645738A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To manufacture metal die with no burrs by fixing one of the surfaces of a metal die material to a slice table, affixing a slice plate to the other surface, and cutting this metal die material in the X and Y directions on a plane and also cutting in the X direction of plane again. CONSTITUTION:Different types of metal 3 are plated on the front and rear sides of a large size metal plate 2 as a metal die material 1A, which is affixed to a slice table 5 with adhesive 4, and a slice plate 6 is stuck to the oversurface with adhesive 7. The metal die material 1A and slice plate 6 are cut perfectly by dicing first in the X direction in plane and then Y direction in plane to yield a plurality of metal dice. At this time, a burr 8 is generated in the Y direction as cut afterward, so that dicing is made again in the X direction to cut off the burr 8 protruding into the cut groove in X direction. Thus metal dice with no burrs are manufactured, wherein no inclination will occur at the time of die bonding, which should enhance the reliability of the wire bonding strength.
JP16126087A 1987-06-30 1987-06-30 Manufacture of metal dice Pending JPS645738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16126087A JPS645738A (en) 1987-06-30 1987-06-30 Manufacture of metal dice

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16126087A JPS645738A (en) 1987-06-30 1987-06-30 Manufacture of metal dice

Publications (1)

Publication Number Publication Date
JPS645738A true JPS645738A (en) 1989-01-10

Family

ID=15731715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16126087A Pending JPS645738A (en) 1987-06-30 1987-06-30 Manufacture of metal dice

Country Status (1)

Country Link
JP (1) JPS645738A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188749A (en) * 1990-11-22 1992-07-07 Fuji Electric Co Ltd Manufacture of semiconductor device
JP2009198671A (en) * 2008-02-20 2009-09-03 Seiko Epson Corp Development roller, developing apparatus, and image forming apparatus
US8023868B2 (en) 2008-02-20 2011-09-20 Seiko Epson Corporation Development roller, development device, and image forming apparatus
US8081911B2 (en) 2008-02-20 2011-12-20 Seiko Epson Corporation Development roller, development device, and image forming apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188749A (en) * 1990-11-22 1992-07-07 Fuji Electric Co Ltd Manufacture of semiconductor device
JP2009198671A (en) * 2008-02-20 2009-09-03 Seiko Epson Corp Development roller, developing apparatus, and image forming apparatus
US8023868B2 (en) 2008-02-20 2011-09-20 Seiko Epson Corporation Development roller, development device, and image forming apparatus
US8081911B2 (en) 2008-02-20 2011-12-20 Seiko Epson Corporation Development roller, development device, and image forming apparatus

Similar Documents

Publication Publication Date Title
HK93993A (en) Method of manufacturing electronic modules for microcircuit boards and modules obtained by this method
EP0332085A3 (en) Polygonal cutting insert
EP0354696A3 (en) Semiconductor device assembly comprising a lead frame structure
JPS645738A (en) Manufacture of metal dice
IT8522780A0 (en) MACHINE WITH BLADE DISC, PARTICULARLY FOR CUTTING SUGAR BEETS.
EP0304343A3 (en) Pack of laminations and forming projections and depressions
JPH0410554A (en) Manufacture of semiconductor device
JPS648647A (en) Manufacture of semiconductor device
DE3009985A1 (en) Light emitting diode chip assembly - is formed by applying thick metal layer one side for sawing into lines and columns
JPS57207022A (en) Bonding method of transparent acrylic resin plate
US5917237A (en) Semiconductor integrated circuit device and lead frame therefor
EP0204102A3 (en) Direct connection of lead frame having flexible, tapered leads and mechanical die support
CN215203758U (en) Plate with good continuity of decorative surface
JPS5821999A (en) Piezoelectric sound generator and its production
KR100343871B1 (en) Process for manufacturing an accessory
JPS5925283A (en) Photosemiconductor device
JPS578059A (en) Cutting method for block body
TH30099B (en) Methods for assembling multiple absorbent materials
JPS578058A (en) Cutting method for block body
SU1688984A1 (en) Built-up cutting tool
JPS5629346A (en) Division of wafer
JPS6484646A (en) Manufacture of semiconductor package
JPS5634122A (en) Manufacture for thin film magnetic head
JPS649629A (en) Method for supplying and compressing solder
JPS5715439A (en) Dicing method