JPS5821999A - Piezoelectric sound generator and its production - Google Patents
Piezoelectric sound generator and its productionInfo
- Publication number
- JPS5821999A JPS5821999A JP12110181A JP12110181A JPS5821999A JP S5821999 A JPS5821999 A JP S5821999A JP 12110181 A JP12110181 A JP 12110181A JP 12110181 A JP12110181 A JP 12110181A JP S5821999 A JPS5821999 A JP S5821999A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- piezoelectric
- piezoelectric element
- substrate
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000011889 copper foil Substances 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 8
- 238000004080 punching Methods 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 239000011888 foil Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は圧電型スピーカ等に用いるに好適な圧電型発音
体とその製造法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a piezoelectric sounding body suitable for use in piezoelectric speakers, etc., and a method for manufacturing the same.
従来一般の圧電型発音体は第１図に示すようにフレキシ
ブル基板１、金属板２、及び圧電素子３を順次接着剤で
貼り合わせて形成していた。このため、このような発音
体の製造時には金属板の機械加工が必要となるばかりで
なく極度に薄い金属板を使用した場合には変形し易く作
業性が極めて悪かった。このため余り薄い金属板を使用
することができず、発音体自身の共振周波数は余り低く
ならなかった。Conventionally, a general piezoelectric sounding body has been formed by sequentially bonding a flexible substrate 1, a metal plate 2, and a piezoelectric element 3 together with an adhesive, as shown in FIG. For this reason, when manufacturing such a sounding body, not only is it necessary to machine the metal plate, but also when an extremely thin metal plate is used, it is easily deformed and the workability is extremely poor. For this reason, it was not possible to use a very thin metal plate, and the resonance frequency of the sounding body itself was not very low.
また第２図に示すように、フレキシブル基板ｊに直接圧
電素子３を貼着したものもあるが、この場合には圧電素
子３の裏面への給電が難しく、基板１の一部を切欠いて
給電する必要があった。Furthermore, as shown in Fig. 2, there is a device in which a piezoelectric element 3 is directly attached to a flexible substrate j, but in this case, it is difficult to supply power to the back side of the piezoelectric element 3, so a part of the substrate 1 is cut out to supply power. I needed to.
本発明はこのような点に鑑みなされたものであり、作業
性がよく極度に薄い振動板を作成することが可能な圧電
型発音体の製造法を提供するものである。The present invention has been made in view of these points, and it is an object of the present invention to provide a method for manufacturing a piezoelectric sounding body that is easy to work with and allows the production of an extremely thin diaphragm.
また本発明では共振周波数が低く広帯域の音声再生用と
して用いることができる圧電型発音体を提供するもので
ある。Further, the present invention provides a piezoelectric sounding body that has a low resonance frequency and can be used for wideband audio reproduction.
以下図面に示す実施例に従って本発明を説明する。本発
明ではまず第３図（ａ）に示すように、フレキシブル基
板４の一面に銅箔５が積層された銅張りフレキシブル基
板を準備し、この基板に周知のエツチング技術を用いて
第３図（ｂ）に示す如くフレキシブル基板４上の銅箔５
の一部を剥離して所望の形状に形成する。次にこの基板
４の複数の箇所を第３図（ｃ）に示すようにプレス打抜
き機６にて同時に打抜き、第３図（ｄ）に示すように形
成されたエツチング処理済みの銅張りフレキシブル基板
を多数同時に得る。然る後にこのような各基板の中央に
エポキシ樹脂のような接着剤を用いて第３図（ｅ）に示
すように円板状の圧電素子７を貼り合せる。The present invention will be described below according to embodiments shown in the drawings. In the present invention, first, as shown in FIG. 3(a), a copper-clad flexible board in which a copper foil 5 is laminated on one surface of a flexible board 4 is prepared, and this board is etched using a well-known etching technique. As shown in b), the copper foil 5 on the flexible substrate 4
A part of the film is peeled off and formed into a desired shape. Next, as shown in FIG. 3(c), multiple parts of this board 4 are simultaneously punched out using a press punching machine 6 to form an etched copper-clad flexible board as shown in FIG. 3(d). obtain many at the same time. Thereafter, a disk-shaped piezoelectric element 7 is bonded to the center of each of these substrates using an adhesive such as epoxy resin, as shown in FIG. 3(e).
１−記のようにして作成された発音体の実施例を第４図
乃至第６図に示す。これらの図面からも、わかるように
本発明の製造方法によれば各発音体の銅箔部のパターン
はエツチング加工により所望とする任意の形状に作成す
ることができる。Examples of the sounding body produced as described in 1- are shown in FIGS. 4 to 6. As can be seen from these drawings, according to the manufacturing method of the present invention, the pattern of the copper foil portion of each sounding body can be formed into any desired shape by etching.
なお、上記実施例ではフレキシブル基板の打抜き加工後
に圧電素子７を貼着しているが、もちろん先に圧電素子
７を貼着し、その後に打抜き加工を行なってもよい。In the above embodiment, the piezoelectric element 7 is attached after the flexible substrate is punched out, but it is of course possible to attach the piezoelectric element 7 first and then perform the punching process.
本発明の圧電型発音体の製造法では、銅張りフレキシブ
ル基板上の銅箔を所望の形状にエツチングし、且つ所定
の形状に打抜くとともに圧電素子を貼着して圧電型発音
体を形成しているため、作業性がよく多量の発音体を同
時に作成することができる。また銅箔部の形状は任意９
ノくターンに形成できるため、圧電素子への給電用の半
田付けも容易となる。In the method for manufacturing a piezoelectric sounding body of the present invention, a piezoelectric sounding body is formed by etching copper foil on a copper-clad flexible substrate into a desired shape, punching it into a predetermined shape, and pasting a piezoelectric element. Because of this, it is easy to work with and can create a large number of sounding bodies at the same time. Also, the shape of the copper foil part is arbitrary9.
Since it can be formed into a round turn, soldering for power supply to the piezoelectric element is also facilitated.
さらに本発明の圧電型発音体によれば、銅箔部を極めて
薄く形成できるため、共振周波数を低くすることが可能
となり広帯域の音声再生として用いることができる。Further, according to the piezoelectric sounding body of the present invention, since the copper foil portion can be formed extremely thin, it is possible to lower the resonance frequency and it can be used for wideband audio reproduction.
第１図（ａ） 、 （ｂ）は従来の圧電型発音体の平面
図と正面図、第２図（ａ） 、 （ｂ）もまた従来の圧
電型発音体の平面図と正面図、第３図は本発明の製造法
を示す工程図、第４図乃至第６図はともに本発明により
作成された圧電型発音体の平面図である。
４・・・フレキシブル基板、５・・・銅箔、７・・・圧
電素子０
代理人 弁理士 福 士 愛 彦Figures 1 (a) and (b) are a plan view and a front view of a conventional piezoelectric sounding body, and Figures 2 (a) and (b) are also a plan view and a front view of a conventional piezoelectric sounding body. FIG. 3 is a process diagram showing the manufacturing method of the present invention, and FIGS. 4 to 6 are plan views of a piezoelectric sounding body produced according to the present invention. 4...Flexible board, 5...Copper foil, 7...Piezoelectric element 0 Agent Patent attorney Aihiko Fukushi
Claims (1)
れた、銅張りフレキシブル基板の中央に圧電素子を貼着
してなる圧電型発音体。 ２ 銅張シフレキシプル基板上の銀箔を所望の形状にエ
ンチングする工程と、このエツチング処理された銅張り
フレキシブル基板を所定の形状に打抜く工程と、この銅
張りフレキシブル基板の銅箔上に圧電素子を貼着する工
程とからなる圧電型発音体の製造法。[Scope of Claims] 1. A piezoelectric sounding body formed by adhering a piezoelectric element to the center of a copper-clad flexible substrate on which copper foil has been formed into a desired shape by etching. 2. A process of etching the silver foil on the copper-clad flexible board into a desired shape, a process of punching out the etched copper-clad flexible board into a predetermined shape, and a process of attaching a piezoelectric element onto the copper foil of the copper-clad flexible board. A method for manufacturing a piezoelectric sounding body, which includes a step of pasting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12110181A JPS5821999A (en) | 1981-08-01 | 1981-08-01 | Piezoelectric sound generator and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12110181A JPS5821999A (en) | 1981-08-01 | 1981-08-01 | Piezoelectric sound generator and its production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5821999A true JPS5821999A (en) | 1983-02-09 |
| JPS6126879B2 JPS6126879B2 (en) | 1986-06-23 |
Family
ID=14802895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12110181A Granted JPS5821999A (en) | 1981-08-01 | 1981-08-01 | Piezoelectric sound generator and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5821999A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6154798A (en) * | 1984-08-27 | 1986-03-19 | Trio Kenwood Corp | Diaphragm for speaker |
| JPS6184995A (en) * | 1984-10-02 | 1986-04-30 | Onkyo Corp | Diaphragm for electric acoustic converter and its manufacture |
| JPS61251298A (en) * | 1985-04-26 | 1986-11-08 | Pioneer Electronic Corp | Diaphragm for speaker |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008010227A2 (en) | 2006-07-19 | 2008-01-24 | Spectrum Dynamics Llc | Imaging protocols |
| US8894974B2 (en) | 2006-05-11 | 2014-11-25 | Spectrum Dynamics Llc | Radiopharmaceuticals for diagnosis and therapy |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4941858U (en) * | 1972-07-13 | 1974-04-12 | ||
| JPS50122926A (en) * | 1974-03-12 | 1975-09-26 | ||
| JPS50133874A (en) * | 1974-04-09 | 1975-10-23 | ||
| JPS54103217U (en) * | 1977-12-28 | 1979-07-20 | ||
| JPS5574198U (en) * | 1978-11-15 | 1980-05-22 | ||
| JPS55100397U (en) * | 1978-12-29 | 1980-07-12 |
-
1981
- 1981-08-01 JP JP12110181A patent/JPS5821999A/en active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4941858U (en) * | 1972-07-13 | 1974-04-12 | ||
| JPS50122926A (en) * | 1974-03-12 | 1975-09-26 | ||
| JPS50133874A (en) * | 1974-04-09 | 1975-10-23 | ||
| JPS54103217U (en) * | 1977-12-28 | 1979-07-20 | ||
| JPS5574198U (en) * | 1978-11-15 | 1980-05-22 | ||
| JPS55100397U (en) * | 1978-12-29 | 1980-07-12 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6154798A (en) * | 1984-08-27 | 1986-03-19 | Trio Kenwood Corp | Diaphragm for speaker |
| JPS6184995A (en) * | 1984-10-02 | 1986-04-30 | Onkyo Corp | Diaphragm for electric acoustic converter and its manufacture |
| JPS61251298A (en) * | 1985-04-26 | 1986-11-08 | Pioneer Electronic Corp | Diaphragm for speaker |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6126879B2 (en) | 1986-06-23 |
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