JPS578059A - Cutting method for block body - Google Patents

Cutting method for block body

Info

Publication number
JPS578059A
JPS578059A JP7860880A JP7860880A JPS578059A JP S578059 A JPS578059 A JP S578059A JP 7860880 A JP7860880 A JP 7860880A JP 7860880 A JP7860880 A JP 7860880A JP S578059 A JPS578059 A JP S578059A
Authority
JP
Japan
Prior art keywords
cutting
block bodies
block
block body
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7860880A
Other languages
Japanese (ja)
Inventor
Kaoru Shimizu
Shunichi Mizukoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7860880A priority Critical patent/JPS578059A/en
Publication of JPS578059A publication Critical patent/JPS578059A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To improve the cutting efficiency and cutting accuracy for the block body by a method wherein the block bodies are arranged on a holding stock with the predetermined distance of separation in the wire-cutting method for the block body. CONSTITUTION:A plurality of the block bodies 1 are adhered in multiple rows on the holding stock 2 with adhesive bond 3 with the gap having the predetermined distance G between the block bodies 1. Under the condition mentioned above, the block bodies 1 are abutted by wires 4 applied with the predetermined load to be cut. Lapping compound collects in the gap G part formed between the block bodies 1 and is stuck to the wires 4, resulting in stabilizing the cutting, increasing the cutting speed and improving the cutting accuracy.
JP7860880A 1980-06-10 1980-06-10 Cutting method for block body Pending JPS578059A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7860880A JPS578059A (en) 1980-06-10 1980-06-10 Cutting method for block body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7860880A JPS578059A (en) 1980-06-10 1980-06-10 Cutting method for block body

Publications (1)

Publication Number Publication Date
JPS578059A true JPS578059A (en) 1982-01-16

Family

ID=13666590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7860880A Pending JPS578059A (en) 1980-06-10 1980-06-10 Cutting method for block body

Country Status (1)

Country Link
JP (1) JPS578059A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5388495A (en) * 1993-06-02 1995-02-14 Yamaha Corporation Upper cymbal fastening assembly for a hi-hat cymbal
US8865988B2 (en) 2012-10-10 2014-10-21 Sakae Rhythm Musical Instrument Ltd. Cymbal holding structure, cymbal stand having the holding structure, and fastener used in the holding structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5388495A (en) * 1993-06-02 1995-02-14 Yamaha Corporation Upper cymbal fastening assembly for a hi-hat cymbal
US8865988B2 (en) 2012-10-10 2014-10-21 Sakae Rhythm Musical Instrument Ltd. Cymbal holding structure, cymbal stand having the holding structure, and fastener used in the holding structure

Similar Documents

Publication Publication Date Title
IT8321371A1 (en) METHOD FOR THE SOLID STATE PRODUCTION OF MULTIPLE MONOCRYSTAL ARTICLES
GR3003809T3 (en)
JPS6446216A (en) Magnetic head
FR2595718B1 (en) PROCESS FOR THE PRODUCTION OF ADHESIVE IC LAYERS FOR INCREASING THE LIFE OF CUTTING TOOLS OR THE LIKE
DE3172935D1 (en) Iii - v group compound semiconductor light-emitting element and method of producing the same
JPS578059A (en) Cutting method for block body
EP0235815A3 (en) A method for attaching multi-strand elastic material to a garment, an apparatus for carrying out this process and the garment made therewith
GB2154938B (en) Machine for deforming the gullets of saw blades to improve resistance to fatigue stress
EP0220421A3 (en) Chip breaking method
JPS578058A (en) Cutting method for block body
DE3568109D1 (en) Light-emitting diodes array and method for its production
IT1177380B (en) DIESEL EXTENSORS FOR AUTOMOTIVE AND THEIR PRODUCTION METHOD
JPS52124291A (en) Method of cutting brittle material
JPS5542262A (en) Optical fiber cutting method
JPS645738A (en) Manufacture of metal dice
JPS57128087A (en) Magneto-electric transducer element
SU1191285A1 (en) Shakeless sawing chain
JPS5715439A (en) Dicing method
JPS5287799A (en) Electric machining method
JPS5779687A (en) Manufacture of polychromic luminous element
JPS57141012A (en) Magnetic head with azimuth gap
JPS5759334A (en) Method for cutting of semiconductor wafer
JPS55135322A (en) Manufacture of thin-film magnetic head
EP0320090A3 (en) Shaping silicon semiconductor wafers
JPS5449114A (en) Production of multichannel magnetic head