JPS6450455A - Electronic component - Google Patents

Electronic component

Info

Publication number
JPS6450455A
JPS6450455A JP62207163A JP20716387A JPS6450455A JP S6450455 A JPS6450455 A JP S6450455A JP 62207163 A JP62207163 A JP 62207163A JP 20716387 A JP20716387 A JP 20716387A JP S6450455 A JPS6450455 A JP S6450455A
Authority
JP
Japan
Prior art keywords
package
leads
mounting
bent
root
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62207163A
Other languages
Japanese (ja)
Inventor
Sumio Okada
Kazuo Shimizu
Akiro Hoshi
Soichiro Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62207163A priority Critical patent/JPS6450455A/en
Priority to KR1019880001745A priority patent/KR960006710B1/en
Priority to US07/160,177 priority patent/US4920074A/en
Publication of JPS6450455A publication Critical patent/JPS6450455A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To easily decide the quality of mounting, by forming leads bent downward at the root of a package into a pad lead type slightly protruding from the bottom of the package. CONSTITUTION:14 leads 2 respectively protrudes from a pair of side faces which are longitudinal of a rectangular package 1 made of resin, and the lead 2 are bent to the bottom of the package 1 at the root of the package 1. The bent leads 2 linearly advance as they are, the ends extend to a position slightly protruding several mm from the bottom of the package 1, in a so-called pad lead type. Accordingly, the leads 2 do not largely extend sidewisely of the package 1 to suppress the mounting area to the minimum limit, and the conformation of the leads 2 at the mounting section of a semiconductor device 3 can be externally performed. Thus, the decision of quality of the mounting becomes accurate, and its operability is improved.
JP62207163A 1987-02-25 1987-08-20 Electronic component Pending JPS6450455A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP62207163A JPS6450455A (en) 1987-08-20 1987-08-20 Electronic component
KR1019880001745A KR960006710B1 (en) 1987-02-25 1988-02-19 Surface mount plastic package semiconductor integrated circuit and the manufacturing method thereof and well asmount struct
US07/160,177 US4920074A (en) 1987-02-25 1988-02-25 Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62207163A JPS6450455A (en) 1987-08-20 1987-08-20 Electronic component

Publications (1)

Publication Number Publication Date
JPS6450455A true JPS6450455A (en) 1989-02-27

Family

ID=16535269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62207163A Pending JPS6450455A (en) 1987-02-25 1987-08-20 Electronic component

Country Status (1)

Country Link
JP (1) JPS6450455A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5498731A (en) * 1993-06-29 1996-03-12 Mitsubishi Chemical Corporation Oxide catalyst and process for producing maleic anhydride by using oxide catalyst

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5498731A (en) * 1993-06-29 1996-03-12 Mitsubishi Chemical Corporation Oxide catalyst and process for producing maleic anhydride by using oxide catalyst

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